公开(公告)号：US20180061689A1

公开(公告)日：2018-03-01

申请号：US15690211

申请日：2017-08-29

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Terry Pederson ,  William Eugene Runstadler, JR.

IPC: H01L21/67 ,  H01L21/56 ,  H01L21/673 ,  H01L21/687 ,  H01L21/768

CPC classification number: H01L21/67201 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67017 ,  H01L21/67121 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67303 ,  H01L21/67754 ,  H01L21/6776 ,  H01L21/68721 ,  H01L21/768 ,  H01L2224/96 ,  H01L2924/3511

Abstract: A system for fan out chip encapsulation processing is provided, wherein a plurality of microchips are encapsulated in molding compound, the system comprising: an atmospheric loading camber, configured to load substrates onto carriers in atmospheric environment; an entry loadlock arrangement configured to introduce the carriers into vacuum environment of the system; a degas chamber positioned downstream of the loadlock arrangement within the vacuum environment, the degas chamber comprising a heating element and a pumping arrangement to remove gases emitted from the molding compound; an etch chamber positioned downstream of the degas chamber and within the vacuum environment, the etch chamber comprising an ion beam generator and an ion neutralizer; a metal sputtering chamber positioned downstream of the etch chamber and inside the vacuum environment; and, an exit loadlock arrangement configured to remove carriers from the vacuum environment.

公开(公告)号：US20170236740A1

公开(公告)日：2017-08-17

申请号：US15410634

申请日：2017-01-19

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Babak Adibi ,  Vinay Prabhakar ,  William Eugene Runstadler, JR.

IPC: H01L21/683 ,  H01L21/66

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/6875 ,  H01L22/12

Abstract: A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.

公开(公告)号：US20190027636A1

公开(公告)日：2019-01-24

申请号：US16040423

申请日：2018-07-19

Applicant: Intevac, Inc.

Inventor： William Eugene Runstadler, JR. ,  Babak Adibi ,  Terry Bluck

IPC: H01L31/18 ,  H01L31/068 ,  H01J37/20 ,  H01J37/304 ,  H01J37/317

Abstract: A system for transporting substrates and precisely alignment the substrates to shadow masks. The system decouples the functions of transporting the substrates, vertically aligning the substrates, and horizontally aligning the substrates. The transport system includes a carriage upon which plurality of pedestals are loosely positioned, each of the pedestals includes a base having vertical alignment wheels to place the substrate in precise vertical alignment. Two sidebars are configured to freely slide on the base. Each of the sidebars includes a set of horizontal alignment wheels that precisely align the substrate in the horizontal direction. Substrate support claws are attached to the sidebars in precise alignment to the vertical alignment wheels and the horizontal alignment wheels.

公开(公告)号：US20170062258A1

公开(公告)日：2017-03-02

申请号：US15284241

申请日：2016-10-03

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, JR. ,  Terry Pederson

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/683

Abstract: A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

Abstract translation: 一种用于在真空处理室中处理晶片的系统。 载体包括具有多个开口的框架，每个开口被配置为容纳一个晶片。 一种配置成在整个系统中传送多个载体的传送机构。 配置用于支撑晶片的多个晶片板。 一种用于将多个晶片板附接到每个载体的附接机构，其中每个晶片板附接到相应载体的下侧处的对应位置，使得位于晶片载体之一上的每个晶片是 定位在载体中的多个开口中的一个内。 掩模附着在载体中的多个开口中的一个的前侧上。 对准台在载体的开口下面支撑晶片板。 定位成同时对掩模和晶片进行成像的照相机。