MEMS DEVICE WITH SPLIT PAD PACKAGE
    1.
    发明申请
    MEMS DEVICE WITH SPLIT PAD PACKAGE 审中-公开
    具有分片式封装的MEMS器件

    公开(公告)号:US20150217991A1

    公开(公告)日:2015-08-06

    申请号:US14170178

    申请日:2014-01-31

    Abstract: A device and a microphone are disclosed. The device comprises a circuit board and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other. The microphone comprises a circuit board, a seal structure on the circuit board, and a plurality of pads on the circuit board, wherein at least one of the plurality of pads is split into at least two portions that are electrically isolated from each other.

    Abstract translation: 公开了一种设备和麦克风。 该装置包括电路板和电路板上的多个焊盘,其中多个焊盘中的至少一个焊盘被分成彼此电隔离的至少两个部分。 麦克风包括电路板,电路板上的密封结构和电路板上的多个焊盘,其中多个焊盘中的至少一个焊盘被分成彼此电隔离的至少两个部分。

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