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公开(公告)号：US08946901B2
公开(公告)日：2015-02-03
申请号：US13746571
申请日：2013-01-22
Applicant: Invensas Corporation
Inventor： Wael Zohni , Chung-Chuan Tseng
CPC classification number: H01L25/0655 , H01L21/56 , H01L23/13 , H01L23/3128 , H01L23/3157 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2224/06136 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/4824 , H01L2224/49 , H01L2924/00014 , H01L2924/15311 , H01L2924/2064 , H01L2924/20641 , H01L2224/45099 , H01L2224/05599
Abstract: A microelectronic assembly may include a substrate having an opening extending between first and second oppositely facing surfaces of the substrate, the opening elongated in a first direction; and at least one microelectronic element having a front face facing and attached to the first surface of the substrate and a plurality of contacts at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges extending away from the front face. The first peripheral edge extends beyond, or is aligned in the first direction with, an inner edge of the opening, and the opening extends beyond the second peripheral edge.
Abstract translation: 微电子组件可以包括具有在基板的第一和第二相对面对的表面之间延伸的开口的基板，该开口在第一方向上伸长; 以及至少一个微电子元件，其具有面向并连接到所述基板的第一表面的正面和在所述开口的上方的前表面处的多个触点，所述微电子元件具有远离所述前表面延伸的第一和第二相对的周边边缘。 第一周边边缘在开口的内边缘延伸超过第一方向或与第一方向对齐，并且开口延伸超出第二周边边缘。
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公开(公告)号：US20140203440A1
公开(公告)日：2014-07-24
申请号：US13746571
申请日：2013-01-22
Applicant: INVENSAS CORPORATION
Inventor： Wael Zohni , Chung-Chuan Tseng
CPC classification number: H01L25/0655 , H01L21/56 , H01L23/13 , H01L23/3128 , H01L23/3157 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2224/06136 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/4824 , H01L2224/49 , H01L2924/00014 , H01L2924/15311 , H01L2924/2064 , H01L2924/20641 , H01L2224/45099 , H01L2224/05599
Abstract: A microelectronic assembly may include a substrate having an opening extending between first and second oppositely facing surfaces of the substrate, the opening elongated in a first direction; and at least one microelectronic element having a front face facing and attached to the first surface of the substrate and a plurality of contacts at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges extending away from the front face. The first peripheral edge extends beyond, or is aligned in the first direction with, an inner edge of the opening, and the opening extends beyond the second peripheral edge.
Abstract translation: 微电子组件可以包括具有在基板的第一和第二相对面对的表面之间延伸的开口的基板，该开口在第一方向上伸长; 以及至少一个微电子元件，其具有面向并连接到所述基板的第一表面的正面和在所述开口的上方的前表面处的多个触点，所述微电子元件具有远离所述前表面延伸的第一和第二相对的周边边缘。 第一周边边缘在开口的内边缘延伸超过第一方向或与第一方向对齐，并且开口延伸超出第二周边边缘。
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公开(公告)号：US09368478B2
公开(公告)日：2016-06-14
申请号：US14597534
申请日：2015-01-15
Applicant: Invensas Corporation
Inventor： Wael Zohni , Chung-Chuan Tseng
IPC: H01L25/065 , H01L23/00 , H01L23/31 , H01L23/13 , H01L21/56
CPC classification number: H01L25/0655 , H01L21/56 , H01L23/13 , H01L23/3128 , H01L23/3157 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2224/06136 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/4824 , H01L2224/49 , H01L2924/00014 , H01L2924/15311 , H01L2924/2064 , H01L2924/20641 , H01L2224/45099 , H01L2224/05599
Abstract: A microelectronic assembly may include a substrate having an opening extending between first and second oppositely facing surfaces of the substrate, the opening elongated in a first direction; and at least one microelectronic element having a front face facing and attached to the first surface of the substrate and a plurality of contacts at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges extending away from the front face. The first peripheral edge extends beyond, or is aligned in the first direction with, an inner edge of the opening, and the opening extends beyond the second peripheral edge.
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公开(公告)号：US20150123293A1
公开(公告)日：2015-05-07
申请号：US14597534
申请日：2015-01-15
Applicant: Invensas Corporation
Inventor： Wael Zohni , Chung-Chuan Tseng
IPC: H01L25/065 , H01L23/00 , H01L23/31
CPC classification number: H01L25/0655 , H01L21/56 , H01L23/13 , H01L23/3128 , H01L23/3157 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2224/06136 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/4824 , H01L2224/49 , H01L2924/00014 , H01L2924/15311 , H01L2924/2064 , H01L2924/20641 , H01L2224/45099 , H01L2224/05599
Abstract: A microelectronic assembly may include a substrate having an opening extending between first and second oppositely facing surfaces of the substrate, the opening elongated in a first direction; and at least one microelectronic element having a front face facing and attached to the first surface of the substrate and a plurality of contacts at the front face overlying the opening, the microelectronic element having first and second opposite peripheral edges extending away from the front face. The first peripheral edge extends beyond, or is aligned in the first direction with, an inner edge of the opening, and the opening extends beyond the second peripheral edge.
Abstract translation: 微电子组件可以包括具有在基板的第一和第二相对面对的表面之间延伸的开口的基板，该开口在第一方向上伸长; 以及至少一个微电子元件，其具有面向并连接到所述基板的第一表面的正面和在所述开口的上方的前表面处的多个触点，所述微电子元件具有远离所述前表面延伸的第一和第二相对的周边边缘。 第一周边边缘在开口的内边缘延伸超过第一方向或与第一方向对齐，并且开口延伸超出第二周边边缘。
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