公开(公告)号：US20170117318A1

公开(公告)日：2017-04-27

申请号：US15330742

申请日：2016-10-31

Applicant: Invensas Corporation

Inventor： Giles Humpston ,  Moshe Kriman

IPC: H01L27/146 ,  H01L27/148

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

公开(公告)号：US09484379B2

公开(公告)日：2016-11-01

申请号：US14557562

申请日：2014-12-02

Applicant: Invensas Corporation

Inventor： Giles Humpston ,  Moshe Kriman

IPC: H01L27/146 ,  H01L21/768

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract translation: 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

公开(公告)号：US08900910B2

公开(公告)日：2014-12-02

申请号：US14148096

申请日：2014-01-06

Applicant: Invensas Corporation

Inventor： Giles Humpston ,  Moshe Kriman

IPC: H01L27/146 ,  H01L21/768

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

公开(公告)号：US20140224419A1

公开(公告)日：2014-08-14

申请号：US14096906

申请日：2013-12-04

Applicant: Invensas Corporation

Inventor： Michael J. Nystrom ,  Giles Humpston

IPC: H01B13/00

CPC classification number: H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Abstract translation: 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。

公开(公告)号：US10249673B2

公开(公告)日：2019-04-02

申请号：US15330742

申请日：2016-10-31

Applicant: Invensas Corporation

Inventor： Giles Humpston ,  Moshe Kriman

IPC: H01L27/146 ,  H01L21/768 ,  H01L27/148

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

公开(公告)号：US09548145B2

公开(公告)日：2017-01-17

申请号：US14096906

申请日：2013-12-04

Applicant: Invensas Corporation

Inventor： Michael J. Nystrom ,  Giles Humpston

IPC: H01L23/10 ,  H01B13/00

CPC classification number: H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Abstract translation: 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。

公开(公告)号：US20150091120A1

公开(公告)日：2015-04-02

申请号：US14557562

申请日：2014-12-02

Applicant: Invensas Corporation

Inventor： Giles Humpston ,  Moshe Kriman

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract translation: 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

公开(公告)号：US20140120650A1

公开(公告)日：2014-05-01

申请号：US14148096

申请日：2014-01-06

Applicant: Invensas Corporation

Inventor： Giles Humpston ,  Moshe Kriman

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract translation: 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。