摘要:
Methods, systems and apparatus for a controller for fast transient response, the controller including a linear compensation circuit for controlling output voltage during steady state operation and a non-linear control circuit to generate a non-linear signal during transient periods, only a first pulse of the non-linear signal is injected during each transient period. The combination linear and non-linear control provides stability and reduces delay times for fast transient response. The non-linear control circuit includes a step up and a step down non-linear control circuit for producing the non-linear signal with a short delay time when the load voltage is less or greater than the reference voltage. An embodiment includes an adaptive circuit or generating a current signal dependent on the load current, the current signal is combined with the output voltage to reduce the difference between the reference and output voltages.
摘要:
A direct current to direct current (DC-to-DC) converter having an active transient voltage compensator (ATVC) coupled with the DC-to-DC converter output terminal to improve a fast transient response of the DC-to-DC converter. The active transient voltage compensator compensates the DC output only during transient operation The ATVC includes a transformer for reducing the ATVC current stresses to improve the compensator efficiency and injecting, absorbing high slew rate current, and a controller circuit for controlling ATVC operation in steady state and normal operation in transients. During step-up load the ATVC operates as a buck converter and during step-down load, the ATVC operates as a boost converter while the main converter operates at low switching frequency for good efficiency.
摘要:
Semiconductor die packaged with air core inductors (ACIs) and magnetic core inductors (MCIs), or with multiple MCIs, are described. In a first example, a semiconductor package includes a semiconductor die, one or more air core inductors (ACIs) coupled to the semiconductor die, and one or more magnetic core inductors (MCIs) coupled to the semiconductor die. In a second example, a semiconductor package includes a semiconductor die, a first magnetic core inductor (MCI) coupled to the semiconductor die and having a first saturation current, and a second MCI coupled to the semiconductor die and having a second, different, saturation current.
摘要:
A transient voltage compensation system is provided. The transient voltage compensation system includes a processor and a first voltage regulator coupled to the processor, wherein the first voltage regulator is to deliver a load current to the processor at an output voltage. The transient voltage compensation system also includes a second voltage regulator coupled to the first voltage regulator, wherein the second voltage regulator is to regulate the output voltage in response to transient loads of the processor.
摘要:
A transient voltage compensation system is provided. The transient voltage compensation system includes a processor and a first voltage regulator coupled to the processor, wherein the first voltage regulator is to deliver a load current to the processor at an output voltage. The transient voltage compensation system also includes a second voltage regulator coupled to the first voltage regulator, wherein the second voltage regulator is to regulate the output voltage in response to transient loads of the processor.