公开(公告)号：US20130305296A1

公开(公告)日：2013-11-14

申请号：US13881296

申请日：2011-12-15

申请人： Izuru Hashimura ,  Masaki Sakata

发明人： Izuru Hashimura ,  Masaki Sakata

IPC分类号： H04N21/637

CPC分类号： H04N21/637 ,  H04N21/4325 ,  H04N21/43615 ,  H04N21/6587

摘要： The in-home equipment comprises: playback availability determining means 11 which, in the case of generation of a playback request for playing back a content on any of the plurality of playback devices, determines whether the playback device requested to play back the content is able to play back the content; and playback instructing means 12 which, in the case where the playback availability determining means 11 determines that the playback device is able to play back the content, causes the playback device to play back the content, wherein, in the case of generation of a handoff request to playback process by the playback device playing back the content to other playback device, the playback availability determining means 11 determines whether the other playback device is able to play back the content, and the in-home equipment further comprises handoff control means 13 which stops the playback of the content and causes the other playback device to play back the content from a handoff position in the case where the playback availability determining means 11 determines that the other playback device is able to play back the content.

摘要翻译： 家用设备包括：播放可用性确定装置11，其在生成用于播放多个播放设备中的任一个上的内容的播放请求的情况下，确定请求播放内容的播放设备是否能够 播放内容; 以及播放指示装置12，在播放可用性确定装置11确定播放装置能够播放内容的情况下，使播放装置回放内容，其中，在产生切换的情况下 再现可否性判定单元11判定其他再现装置是否能够回放内容，而家庭内设备还包括切换控制装置13，该切换控制装置13 在再现可用性确定装置11确定另一播放装置能够播放内容的情况下，停止内容的重放并使其他播放装置从切换位置播放内容。

公开(公告)号：US20100243125A1

公开(公告)日：2010-09-30

申请号：US12729323

申请日：2010-03-23

申请人： Masayuki Yamamoto ,  Masaki Sakata

发明人： Masayuki Yamamoto ,  Masaki Sakata

IPC分类号： B32B38/10

CPC分类号： H01L21/67132

摘要： As a drive block moves that is connected to a movable table of a tape separation device, a pressure occurs from pressing the movable table disposed forward with the drive block. A pressure sensor detects the pressure as a separation load of a protective tape. A control device drives a motor in accordance with the separation load to control a moving speed of the tape separation device.

摘要翻译： 作为与磁带分离装置的移动台连接的驱动块移动，通过按压设置在驱动块前方的可动台而产生压力。 压力传感器将压力检测为保护带的分离负载。 控制装置根据分离负载驱动电动机，以控制带分离装置的移动速度。

公开(公告)号：US07748948B2

公开(公告)日：2010-07-06

申请号：US11639347

申请日：2006-12-15

申请人： Shinichi Yokoyama ,  Kunihiro Tsuzuki ,  Masaki Sakata

发明人： Shinichi Yokoyama ,  Kunihiro Tsuzuki ,  Masaki Sakata

IPC分类号： F01D21/04 ,  F01D21/12 ,  F01B25/00

CPC分类号： F04D29/4226 ,  F04D23/008 ,  F04D27/008 ,  F04D29/161

摘要： A vortex-flow blower device includes an impeller having a plurality of fins, a blower housing that has a vortex flow chamber for accommodating the impeller and extends from a start point on a side of a the fluid inlet port to an end point on a side of a fluid discharge port along the plurality of fins, a partitioning portion that blocks a communication between the end point and the start point in the vortex flow chamber, and a thermal fuse that is provided in the blower housing. The thermal fuse can be fused by a temperature rise so as to discharge the fluid on the side of the fluid discharge port to an outside, or communicate with the side of the fluid discharge port to the side of the fluid inlet port in the vortex flow chamber when the thermal fuse is fused.

摘要翻译： 涡流鼓风装置包括具有多个翅片的叶轮，鼓风机壳体，其具有用于容纳叶轮的涡流流动室，并且从流体入口侧的起始点延伸到侧面的终点 沿着所述多个翅片的流体排出口，限制所述涡流流动室中的终点与起始点之间的连通的分隔部分和设置在所述鼓风机壳体中的热熔丝。 热熔丝可以通过温度升高熔化，从而将流体排出口侧的流体排出到外部，或者与流体排放口侧面相连，在涡流中流体入口侧 热熔丝熔断时的室。

公开(公告)号：US20070284038A1

公开(公告)日：2007-12-13

申请号：US11723239

申请日：2007-03-19

申请人： Masayuki Yamamoto ,  Takao Matsushita ,  Masaki Sakata

发明人： Masayuki Yamamoto ,  Takao Matsushita ,  Masaki Sakata

IPC分类号： B32B37/02

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1089 ,  Y10T156/1184 ,  Y10T156/1961

摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。

公开(公告)号：US20070227328A1

公开(公告)日：2007-10-04

申请号：US11727352

申请日：2007-03-26

申请人： Kunihiro Tsuzuki ,  Shinichi Yokoyama ,  Masaki Sakata

发明人： Kunihiro Tsuzuki ,  Shinichi Yokoyama ,  Masaki Sakata

IPC分类号： B26D1/00 ,  B29C45/00 ,  B29C45/40

CPC分类号： F04D23/008 ,  F04D29/26 ,  F04D29/662 ,  Y10T83/929

摘要： A rotary blade molding method, a rotary blade molding die and a rotary blade molded thereby are disclosed. A cavity (79) for molding an impeller (31) is formed between a fixed-side die plate (59) and a movable-side die plate (75). The movable-side die plate (75) has a plurality of outer through holes (81) formed in spaced relation to each other in the peripheral direction on the inner peripheral surface of the cavity (79) and extending in the direction along which the fixed-side die plate (59) and the movable-side die plate (75) move away from or toward each other. Outer ejector pins (83) are removably inserted into the outer through holes (81), respectively. By changing the length of the outer ejector pins (83), the axial position of the forward end surface of each outer ejector pin (83) with respect to the inner peripheral surface of the cavity (79) is changed, so that the thickness of a molded product is changed thereby to adjust the balance of the impeller (31) around the axis thereof. As a result, the unbalance of the rotary blade can be adjusted by an inexpensive and simple method.

摘要翻译： 公开了一种旋转叶片成型方法，旋转叶片成形模和由此模制的旋转叶片。 在固定侧模板（59）和可动侧模板（75）之间形成用于模制叶轮（31）的模腔（79）。 可移动侧模板75具有多个在空腔79的内周面上沿圆周方向间隔开地形成的外部通孔81，并且沿固定的方向 （59）和可动侧模板（75）离开或朝向彼此移动。 外推出销（83）分别可拆卸地插入到外通孔（81）中。 通过改变外推顶销（83）的长度，改变每个外推顶销（83）的前端表面相对于空腔（79）的内周表面的轴向位置，使得厚度 改变成型品，从而调整叶轮31的轴心平衡。 结果，可以通过廉价且简单的方法来调节旋转刀片的不平衡。

公开(公告)号：US20070077138A1

公开(公告)日：2007-04-05

申请号：US11529543

申请日：2006-09-29

申请人： Kunihiro Tsuzuki ,  Shinichi Yokoyama ,  Masaki Sakata ,  Masanori Yasuda

发明人： Kunihiro Tsuzuki ,  Shinichi Yokoyama ,  Masaki Sakata ,  Masanori Yasuda

IPC分类号： F04D5/00

CPC分类号： F04D29/188

摘要： A fluid pumping system is disclosed that includes a housing in which a fluid flows. The fluid pumping system also includes a vane wheel that is rotatably supported in the housing and that has a plurality of vane portions. At least one of the vane portions is swept-forward such that an axial end of the at least one of the vane portions extends toward the direction of rotation of the vane wheel.

摘要翻译： 公开了一种流体泵送系统，其包括其中流体流动的壳体。 流体泵送系统还包括可旋转地支撑在壳体中并且具有多个叶片部分的叶轮。 叶片部分中的至少一个向前扫掠，使得至少一个叶片部分的轴向端部朝向叶轮的旋转方向延伸。

公开(公告)号：US20060231202A1

公开(公告)日：2006-10-19

申请号：US11389122

申请日：2006-03-27

申请人： Masaki Sakata ,  Masayuki Yamamoto

发明人： Masaki Sakata ,  Masayuki Yamamoto

IPC分类号： B29C63/00 ,  H01L21/304

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T29/49126 ,  Y10T156/1179 ,  Y10T156/19

摘要： An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof The separated semiconductor wafer and support board are collected independently.

摘要翻译： 对准的工件安装在保持台上并由保持台保持，并且支撑板分离机构将支撑板与半导体晶片分离。 这里，双面胶带留在支撑板和半导体晶片之一上。 将双面胶带留在其上的支撑板或半导体晶片被保持台传送到胶带剥离机构，双面胶带从表面剥离 分离的半导体晶片和支撑板被独立地收集。

公开(公告)号：US20060037310A1

公开(公告)日：2006-02-23

申请号：US11175433

申请日：2005-07-07

申请人： Masaki Sakata ,  Satoshi Ishigaki

发明人： Masaki Sakata ,  Satoshi Ishigaki

IPC分类号： F01N3/00

CPC分类号： F01N3/30 ,  Y02T10/20

摘要： An airflow control valve is composed of a housing forming an air passage therein and an electromagnetically driven valve disposed in the air passage. The valve divides the air passage into an upstream passage having an air inlet port and a downstream passage having an outlet port open to an exhaust pipe. A barrier facing an exhaust gas blown back from the exhaust pipe is formed in the downstream passage in order to reduce an amount of deposits accumulating on and around the valve due to foreign particles contained in the exhaust gas. The barrier may be a dead end space in which the exhaust gas stagnates or a wall interfering with a flow of the exhaust gas. A one-way valve may be disposed immediately downstream of the valve to prevent the exhaust gas from flowing toward the valve.

摘要翻译： 气流控制阀由形成有空气通道的壳体和设置在空气通道中的电磁驱动阀组成。 阀将空气通道分成具有进气口和下游通道的上游通道，其具有通向排气管的出口。 在下游通道中形成面向从排气管吹出的废气的阻挡物，以便减少由于废气中包含的异物而积聚在阀上和周围的沉积物的量。 阻挡层可以是其中排气停滞的死端空间或干扰排气流动的壁。 单向阀可以直接设置在阀的下游，以防止废气流向阀。

公开(公告)号：US07938930B2

公开(公告)日：2011-05-10

申请号：US11389122

申请日：2006-03-27

申请人： Masaki Sakata ,  Masayuki Yamamoto

发明人： Masaki Sakata ,  Masayuki Yamamoto

IPC分类号： B29C63/00

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/6839 ,  Y10T29/49126 ,  Y10T156/1179 ,  Y10T156/19

摘要： An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.

摘要翻译： 对准的工件安装在保持台上并由保持台保持，并且支撑板分离机构将支撑板与半导体晶片分离。 这里，双面胶带留在支撑板和半导体晶片之一上。 将双面胶带留在其上的支撑板或半导体晶片被保持台传送到胶带剥离机构，双面胶带从表面剥离 其中。 分离的半导体晶片和支撑板被独立地收集。

公开(公告)号：US07789988B2

公开(公告)日：2010-09-07

申请号：US11723239

申请日：2007-03-19

申请人： Masayuki Yamamoto ,  Takao Matsushita ,  Masaki Sakata

发明人： Masayuki Yamamoto ,  Takao Matsushita ,  Masaki Sakata

IPC分类号： B29C65/50 ,  B32B38/10 ,  B32B43/00

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1089 ,  Y10T156/1184 ,  Y10T156/1961

摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。