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公开(公告)号：US11939182B2
公开(公告)日：2024-03-26
申请号：US17315628
申请日：2021-05-10
发明人： Paul J. Waszkowski
CPC分类号： B65H41/00 , B25G1/06 , B25G1/102 , Y10T156/1168 , Y10T156/1184 , Y10T156/1961
摘要： A hand tool is provided for removing a secondary liner from a tape carrier of a two-sided adhesive tape where the opposing primary side of the tape carrier is attached to a surface. The hand tool includes a handle. One end of the handle may include a handle fulcrum depending from the handle. A plurality of sharp points together define a mathematical line. The plurality of sharp points also define point axes which together define a mathematical plane. The mathematical line is coincident with the mathematical plane. The mathematical plane defines an acute angle with respect to the handle and to the handle fulcrum.
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公开(公告)号：US20180126719A1
公开(公告)日：2018-05-10
申请号：US15864528
申请日：2018-01-08
CPC分类号： B32B43/006 , B32B38/10 , B32B43/003 , B32B2471/02 , Y10T156/1168 , Y10T156/1184 , Y10T156/1189 , Y10T156/1961 , Y10T156/1972
摘要： Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.
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公开(公告)号：US20180065356A1
公开(公告)日：2018-03-08
申请号：US15393390
申请日：2016-12-29
IPC分类号： B32B43/00
CPC分类号： B32B43/006 , B32B38/10 , B32B43/003 , B32B2471/02 , Y10T156/1168 , Y10T156/1184 , Y10T156/1189 , Y10T156/1961 , Y10T156/1972
摘要： Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.
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公开(公告)号：US09682544B2
公开(公告)日：2017-06-20
申请号：US15147020
申请日：2016-05-05
发明人： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
IPC分类号： B32B38/10 , B32B43/00 , G02B6/00 , H01L21/67 , B26D1/04 , H01L51/56 , B26D1/00 , H01L27/12 , H01L27/32
CPC分类号： B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
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公开(公告)号：US20170072676A1
公开(公告)日：2017-03-16
申请号：US14854306
申请日：2015-09-15
发明人： Gilberto Cabral
CPC分类号： B32B43/006 , B26B27/002 , B32B38/10 , B32B2607/00 , Y10T83/472 , Y10T83/9292 , Y10T156/1184 , Y10T156/1961 , Y10T156/1967
摘要： The subject invention is directed to a device and method for removing an article attached to a mounting surface by an adhesive mounting. Preferably, the device comprises a first grip, a second grip and a filament having a first end attached to the first grip and a second end attached to the second grip. The filament operates such that when placed between the mounting surface and the adhesive mounting and pulled by the first and second grip in a direction along a bonding plane, it operates to separate the adhesive mounting from the mounting surface.
摘要翻译： 本发明涉及一种用于通过粘合剂安装去除附接到安装表面的物品的装置和方法。 优选地，该装置包括第一把手，第二把手和细丝，其具有附接到第一把手的第一端和附接到第二把手的第二端。 灯丝操作成使得当放置在安装表面和粘合剂安装件之间并且沿着接合平面的方向被第一和第二把手拉动时，其操作以将粘合剂安装件与安装表面分离。
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公开(公告)号：US09583374B2
公开(公告)日：2017-02-28
申请号：US15188189
申请日：2016-06-21
IPC分类号： B32B38/10 , H01L21/683 , H01L21/67 , B32B43/00 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/00 , H01L21/67092 , H01L21/67132 , H01L21/67282 , H01L21/6838 , H01L21/68707 , H01L21/68728 , H01L2221/683 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , Y10T156/11 , Y10T156/1142 , Y10T156/1168 , Y10T156/1179 , Y10T156/1184 , Y10T156/19 , Y10T156/1911 , Y10T156/1961 , Y10T156/1967 , Y10T156/1978
摘要： Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.
摘要翻译： 所描述的方法和装置为装置晶片和载体晶片之间的粘合剂接合提供受控的扰动。 受控的扰动可以是机械的，化学的，热的或辐射的，有助于两个晶片的分离，而不损坏器件晶片。 控制的扰动在粘合剂层（例如在剥离层和粘合剂之间）的界面处，或在晶片/粘合剂界面处在连接两个晶片的粘合剂内部引发裂纹。 然后可以使用用于引发裂纹的任何前述方法或其组合来传播裂纹。
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公开(公告)号：US09511579B2
公开(公告)日：2016-12-06
申请号：US14591339
申请日：2015-01-07
申请人： DISCO CORPORATION
发明人： Hiroshi Morikazu , Tasuku Koyanagi , Shin Tabata
CPC分类号： B32B43/006 , B32B38/10 , B32B2457/14 , Y10T156/1137 , Y10T156/1184 , Y10T156/1906 , Y10T156/1939 , Y10T156/1961 , Y10T156/1967 , Y10T156/1972
摘要： A separation apparatus for separating a composite substrate formed from a first substrate and a second substrate joined together includes an exfoliation unit for advancing into a boundary region between the first substrate and the second substrate of the composite substrate supported by a supporting face of a supporting base and a side face supporting unit to exfoliate the composite substrate into the first substrate and the second substrate. The exfoliation unit includes a wedge portion for advancing into the boundary region between the first substrate and the second substrate, an exfoliation member having a gas outlet open at a tip end of the wedge portion, and an exfoliation member advancing and retracting unit for advancing and retracting the wedge portion of the exfoliation member to and from the boundary region between the first substrate and the second substrate which configure the composite substrate.
摘要翻译： 用于分离由第一基板和第二基板形成的复合基板的分离装置包括：剥离单元，用于前进到由支撑基座的支撑面支撑的复合基板的第一基板和第二基板之间的边界区域 以及侧面支撑单元，用于将复合基板剥离成第一基板和第二基板。 剥离单元包括用于前进到第一基板和第二基板之间的边界区域的楔形部分，具有在楔形部分的尖端处开口的气体出口的剥离构件，以及用于推进的剥离构件前进和后退单元， 将剥离构件的楔形部分从构造复合衬底的第一衬底和第二衬底之间的边界区域缩回。
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公开(公告)号：US20160300747A1
公开(公告)日：2016-10-13
申请号：US15188189
申请日：2016-06-21
IPC分类号： H01L21/683 , B32B38/10 , B32B38/18 , H01L21/67 , B32B43/00
CPC分类号： H01L21/6835 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/00 , H01L21/67092 , H01L21/67132 , H01L21/67282 , H01L21/6838 , H01L21/68707 , H01L21/68728 , H01L2221/683 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , Y10T156/11 , Y10T156/1142 , Y10T156/1168 , Y10T156/1179 , Y10T156/1184 , Y10T156/19 , Y10T156/1911 , Y10T156/1961 , Y10T156/1967 , Y10T156/1978
摘要： Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.
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公开(公告)号：US09420736B2
公开(公告)日：2016-08-16
申请号：US14388409
申请日：2013-09-03
发明人： Minoru Kitani , Kazunori Kanai , Kazuo Kido , Seikou Abe
CPC分类号： H05K13/0417 , B32B43/006 , H05K13/02 , H05K13/021 , H05K13/0408 , H05K13/0419 , Y10T156/1195 , Y10T156/1961
摘要： A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.
摘要翻译： 组件供给装置包括主带进入口，从承载带拾取部件的部件供给口，从主带进入口向组件供给口的下侧的主体部延伸的主带路径， 顶部带去除部分，从组件供应端口上游的主带路径上的载带上移除顶带，子带进入端口，在上游汇聚点处与主带路径的斜坡路径部分相交的子带路径 以及在汇合点下游的主带路径上与载带接合的至少一个链轮。 子带路径的长度短于从主带进入端口到汇合点的主带路径的长度。
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公开(公告)号：US09333736B2
公开(公告)日：2016-05-10
申请号：US14468662
申请日：2014-08-26
发明人： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
CPC分类号： B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
摘要翻译： 提供堆叠的处理装置。 堆叠包括彼此附接的两个基板，其间隙设置在它们的端部之间。 处理装置包括：固定机构，其固定堆叠的一部分;多个吸附夹具，其固定堆叠体的一个基板的外周边缘;以及楔形夹具，其插入到堆叠的角部。 多个吸附夹具包括允许吸附夹具在垂直方向和水平方向上分开移动的机构。 处理装置还包括传感器，其感测堆叠中的端部之间的间隙的位置。 楔形夹具的尖端沿着形成在堆叠的端表面上的倒角移动。 楔形夹具插入到堆叠中的端部之间的间隙中。
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