Heat Sink For Dissipating A Thermal Load
    1.
    发明申请
    Heat Sink For Dissipating A Thermal Load 审中-公开
    散热器用于散热

    公开(公告)号:US20110192577A1

    公开(公告)日:2011-08-11

    申请号:US13089497

    申请日:2011-04-19

    IPC分类号: F28D15/04

    摘要: A heat sink for dissipating a thermal load is disclosed that includes one or more heat sink bases configured around a central axis of the heat sink so as to define an interior space, at least one heat sink base receiving the thermal load, a thermal transport connected to the at least one heat sink base receiving the thermal load so as to distribute the thermal load in the heat sink, and heat-dissipating fins connected to each heat sink base, the heat-dissipating fins extending from each heat sink base into the interior space of the heat sink, each heat-dissipating fin shaped according to the location of the heat-dissipating fin with respect to the location of the thermal load and the location of the distributed thermal load in the heat sink.

    摘要翻译: 公开了一种用于耗散热负荷的散热器,其包括围绕散热器的中心轴线构造的一个或多个散热器基座,以便限定内部空间,至少一个容纳热负荷的散热器基座, 到所述至少一个散热器基座,其接收所述热负荷,以将散热器中的热负荷分配,以及连接到每个散热器基座的散热翅片,所述散热片从每个散热器基座延伸到内部 散热片的空间,每个散热翅片根据散热翅片的位置相对于热负荷的位置和分布式热负荷在散热器中的位置而成形。