Process for forming a fine pattern using a top-coating composition for a photoresist and product formed by same
    1.
    发明授权
    Process for forming a fine pattern using a top-coating composition for a photoresist and product formed by same 失效
    使用用于光刻胶的顶涂组合物和由其形成的产品形成精细图案的方法

    公开(公告)号:US07329477B2

    公开(公告)日:2008-02-12

    申请号:US10993869

    申请日:2004-11-19

    IPC分类号: G03F7/00 G03F7/004

    CPC分类号: G03F7/11 G03F7/0045

    摘要: The present invention provides a process for using an amine contamination-protecting top-coating composition. Preferably, the amine contamination-protecting top-coating composition of the present invention comprises an amine contamination-protecting compound. Useful amine contamination-protecting compounds include amine derivatives; amino acid derivatives; amide derivatives; urethane derivatives; urea derivatives; salts thereof; and mixtures thereof. The amine contamination-protecting top-coating composition of the present invention reduces or eliminates problems such as T-topping due to a post exposure delay effect and/or difficulties in forming a fine pattern below 100 nm due to acid diffusion associated with conventional lithography processes involving a photoresist polymer containing an alicyclic main chain using a light source, such as KrF (248 nm), ArF (193 nm), F2 (157 nm), E-beam, ion beam and extremely ultraviolet (EUV).

    摘要翻译: 本发明提供了使用胺类污染物保护性顶涂层组合物的方法。 优选地,本发明的胺污染保护性顶涂剂组合物包含胺污染保护化合物。 有用的胺污染保护化合物包括胺衍生物; 氨基酸衍生物; 酰胺衍生物; 氨基甲酸酯衍生物; 尿素衍生物; 的盐; 及其混合物。 本发明的胺污染保护性顶涂剂组合物由于后曝光延迟效应而降低或消除诸如T形顶部的问题和/或由于与常规光刻工艺相关的酸扩散而难以形成低于100nm的精细图案 涉及使用诸如KrF(248nm),ArF(193nm),F 2 N(157nm),电子束,离子束等的光源的含有脂环族主链的光致抗蚀剂聚合物 紫外线(EUV)。

    Photoresist cross-linker and photoresist composition comprising the same
    5.
    发明授权
    Photoresist cross-linker and photoresist composition comprising the same 失效
    光阻抗交联剂和包含其的光致抗蚀剂组合物

    公开(公告)号:US06368773B1

    公开(公告)日:2002-04-09

    申请号:US09448916

    申请日:1999-11-24

    IPC分类号: G03F7027

    摘要: The present invention relates to a cross-linker for photoresist compositions which is suitable for a photolithography process using KrF (248 mn), ArF (193 mn), E-beam, ion beam or EUV light sources. Preferred cross-linkers, according to the present invention, comprise a copolymer of (i) a compound represented by following Chemical Formula 1 and/or (ii) one or more compound(s) selected from the group consisting of acrylic acid, methacrylic acid and maleic anhydride. wherein, R1 and R2 individually represent straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; and R3 represents hydrogen or methyl.

    摘要翻译: 本发明涉及适用于使用KrF(248nm),ArF(193nm),电子束,离子束或EUV光源的光刻工艺的光致抗蚀剂组合物的交联剂。 根据本发明,优选的交联剂包含(i)由以下化学式1表示的化合物和/或(ii)一种或多种选自丙烯酸,甲基丙烯酸 其中R1和R2分别表示直链或支链C1-10烷基,直链或支链C1-10酯,直链或支链C1-10酮,直链或支链C1-10羧酸,直链或支链C1-10 包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10酯,包括至少一个羟基的直链或支链C 1-10酮直链或支链C 1-10 包含至少一个羟基的羧酸,和包含至少一个羟基的直链或支链C 1-10缩醛; 并且R 3表示氢或甲基。

    Photoresist cross-linker and photoresist composition comprising the same
    7.
    发明授权
    Photoresist cross-linker and photoresist composition comprising the same 失效
    光阻抗交联剂和包含其的光致抗蚀剂组合物

    公开(公告)号:US06312868B1

    公开(公告)日:2001-11-06

    申请号:US09501096

    申请日:2000-02-09

    IPC分类号: G03F7004

    CPC分类号: G03F7/0045 G03F7/038

    摘要: The present invention is directed to photoresist cross-linkers selected from the group consisting of a cross-linker monomer represented by following Chemical Formula 1, and homopolymers and copolymers thereof. Such cross-linkers are suitable for use in photolithography processes employing KrF(248nm), ArF(193nm), E-beam, ion-beam or EUV light sources. wherein X1 and X2 individually represent CH2, CH2CH2, O or S; p and s individually represent an integer from 0 to 5; q is 0 or 1; R′ and R″ independently represent hydrogen or methyl; R represents straight or branched C1-10 alkyl, straight or branched C1-10 ether, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ether including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; R1 and R2 independently represent hydrogen, straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group.

    摘要翻译: 本发明涉及选自由以下化学式1表示的交联剂单体和其均聚物和共聚物的光致抗蚀剂交联剂。 这种交联剂适用于采用KrF(248nm),ArF(193nm),电子束,离子束或EUV光源的光刻工艺.X1和X2分别表示CH2,CH2CH2,O或S; p和s各自表示0至5的整数; q为0或1; R'和R“独立地表示氢或甲基; R代表直链或支链C 1-10烷基,直链或支链C1-10醚,直链或支链C1-10酯,直链或支链C 1-10酮,直链或支链C 1-10羧酸,直链或支链C 1-10缩醛 包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10醚,包括至少一个羟基的直链或支链C 1-10酯,直链或支链C 1-10酮 包括至少一个羟基,包括至少一个羟基的直链或支链C 1-10羧酸,和包含至少一个羟基的直链或支链C 1-10缩醛; R 1和R 2独立地表示氢,直链或支链C 1-10烷基,直链或支链C 1-10酯,直链或支链C 1-10酮,直链或支链C 1-10羧酸,直链或支链C 1-10缩醛,直链或 包括至少一个羟基的支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10酯,包括至少一个羟基,直链或支链C 1-10羧酸的直链或支链C 1-10酮包括 至少一个羟基,以及包含至少一个羟基的直链或支链C 1-10缩醛。

    Photoresist cross-linker and photoresist composition comprising the same
    8.
    发明授权
    Photoresist cross-linker and photoresist composition comprising the same 失效
    光阻抗交联剂和包含其的光致抗蚀剂组合物

    公开(公告)号:US06482565B1

    公开(公告)日:2002-11-19

    申请号:US09448964

    申请日:1999-11-24

    IPC分类号: G03F7004

    摘要: The present invention relates to a cross-linker for use in a photoresist which is suitable for a photolithography process using KrF (248 ru), ArF (193 nm), E-beam, ion beam or EUV light source. According to the present invention, preferred cross-linkers comprise a copolymer having repeating units derived from: (i) a compound represented by following Chemical Formula 1 and/or (ii) one or more compound(s) selected from the group consisting of acrylic acid, methacrylic acid and maleic anhydride. wherein, R1, R2 and R individually represent straight or branched C1-10 alkyl, straight or branched C1-10 ester, straight or branched C1-10 ketone, straight or branched C1-10 carboxylic acid, straight or branched C1-10 acetal, straight or branched C1-10 alkyl including at least one hydroxyl group, straight or branched C1-10 ester including at least one hydroxyl group, straight or branched C1-10 ketone including at least one hydroxyl group, straight or branched C1-10 carboxylic acid including at least one hydroxyl group, and straight or branched C1-10 acetal including at least one hydroxyl group; R3 represents hydrogen or methyl; m represents 0 or 1; and n represents a number of 1 to 5.

    摘要翻译: 本发明涉及用于光致抗蚀剂的交联剂,其适用于使用KrF(248uR),ArF(193nm),电子束,离子束或EUV光源的光刻工艺。 根据本发明,优选的交联剂包含具有衍生自以下的重复单元的共聚物:(i)由以下化学式1表示的化合物和/或(ii)一种或多种选自丙烯酸的化合物 酸,甲基丙烯酸和马来酸酐。其中R1,R2和R各自表示直链或支链C1-10烷基,直链或支链C1-10酯,直链或支链C1-10酮,直链或支链C1-10羧酸, 包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10烷基,包括至少一个羟基的直链或支链C 1-10酮, 包含至少一个羟基的直链或支链C 1-10羧酸,和包含至少一个羟基的直链或支链C 1-10缩醛; R3表示氢或甲基; m表示0或1; n表示1〜5的数。

    Photoresist polymers and photoresist composition containing the same
    10.
    发明授权
    Photoresist polymers and photoresist composition containing the same 失效
    光阻聚合物和含有它的光致抗蚀剂组合物

    公开(公告)号:US06455226B1

    公开(公告)日:2002-09-24

    申请号:US09704053

    申请日:2000-11-01

    IPC分类号: C08F23204

    摘要: The present invention provides photoresist polymers and photoresist compositions comprising the same. In one aspect, the photoresist polymer is of the Formula: where Y, R1, a, b and c are as described herein. Photoresist compositions of the present invention have good transmittance at wavelengths of 193 nm and 157 nm, etching resistance, heat resistance, and adhesiveness. In addition, photoresist compositions of the present invention can be developed easily in aqueous TMAH solution, and are therefore suitable for lithography processes using VUV (157 nm) and EUV (13 nm) wavelength-light sources for fabricating a minute circuit of a high integration semiconductor device.

    摘要翻译: 本发明提供了包含其的光致抗蚀剂聚合物和光致抗蚀剂组合物。 在一个方面,光致抗蚀剂聚合物具有下式:其中Y,R 1,a,b和c如本文所述。 本发明的光致抗蚀剂组合物在193nm和157nm的波长下具有良好的透光率,耐腐蚀性,耐热性和粘合性。 此外,本发明的光致抗蚀剂组合物可以在TMAH水溶液中容易地开发,因此适用于使用VUV(157nm)和EUV(13nm)波长光源的光刻工艺,用于制造高集成度的微小电路 半导体器件。