公开(公告)号：US09559080B2

公开(公告)日：2017-01-31

申请号：US14395116

申请日：2013-03-18

申请人： Jae-Sung Lim ,  Ju-Hyung Kim ,  Jin-Wook Jeong ,  Hyun-Joo Kim ,  Hyouk Lee

发明人： Jae-Sung Lim ,  Ju-Hyung Kim ,  Jin-Wook Jeong ,  Hyun-Joo Kim ,  Hyouk Lee

IPC分类号： H01L21/02 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L21/768 ,  H01L23/04 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L21/768 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/4985 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/53257 ,  H01L23/5389 ,  H01L23/564 ,  H01L24/16 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73209 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/00

摘要： An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

摘要翻译： 集成电路器件封装可以包括具有第一布线的柔性基板，具有第二布线的集成电路器件，具有第一开口的柔性绝缘结构和分别暴露第一布线和第二布线的第二开口;第三布线 将第一布线电连接到第二布线，以及覆盖第三布线的柔性保护构件。 层叠的柔性集成电路器件封装可以包括柔性衬底，包括第一连接焊盘的第一柔性集成电路器件，包括第二连接焊盘的第二柔性集成电路器件，将第一和第二连接焊盘电连接到 外部装置和设置在第二柔性集成电路装置上的柔性保护构件。

公开(公告)号：US20150076683A1

公开(公告)日：2015-03-19

申请号：US14395116

申请日：2013-03-18

申请人： Jae-Sung Lim ,  Ju-Hyung Kim ,  Jin-Wook Jeong ,  Hyun-Joo Kim ,  Hyouk Lee

发明人： Jae-Sung Lim ,  Ju-Hyung Kim ,  Jin-Wook Jeong ,  Hyun-Joo Kim ,  Hyouk Lee

IPC分类号： H01L25/065 ,  H01L23/528 ,  H01L21/768 ,  H01L23/522 ,  H01L25/00 ,  H01L23/04 ,  H01L23/00 ,  H01L23/532

CPC分类号： H01L25/0657 ,  H01L21/768 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/4985 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/53242 ,  H01L23/53257 ,  H01L23/5389 ,  H01L23/564 ,  H01L24/16 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/16145 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73209 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/00

摘要： An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

摘要翻译： 集成电路器件封装可以包括具有第一布线的柔性基板，具有第二布线的集成电路器件，具有第一开口的柔性绝缘结构和分别暴露第一布线和第二布线的第二开口;第三布线 将第一布线电连接到第二布线，以及覆盖第三布线的柔性保护构件。 层叠的柔性集成电路器件封装可以包括柔性衬底，包括第一连接焊盘的第一柔性集成电路器件，包括第二连接焊盘的第二柔性集成电路器件，将第一和第二连接焊盘电连接到 外部装置和设置在第二柔性集成电路装置上的柔性保护构件。

公开(公告)号：US10522522B2

公开(公告)日：2019-12-31

申请号：US15746100

申请日：2016-08-01

申请人： Young Hee Song ,  Hyouk Lee ,  Ki Hong Song ,  Jun Hee Jeong

发明人： Young Hee Song ,  Hyouk Lee ,  Ki Hong Song ,  Jun Hee Jeong ,  Sung Sik Yun

IPC分类号： H01L25/10 ,  H01L25/065 ,  H01L23/00

摘要： The semiconductor package according to the present invention comprises: an integrated substrate; a bottom chip stack, which is mounted on the integrated substrate, has multiple memory semiconductor dies stacked chip-on-chip, and takes charge of a part of the whole memory capacity; at least one top chip stack, which is mounted on the bottom package, has multiple memory semiconductor dies mounted therein, and takes charge of the rest of the whole memory capacity; an integration wire for electrically connecting the bottom chip stack and the top chip stack(s); and an integration protection member for sealing the integration wire.

公开(公告)号：US10474192B2

公开(公告)日：2019-11-12

申请号：US15746098

申请日：2016-08-01

申请人： Young Hee Song ,  Hyouk Lee ,  Ki Hong Song ,  Jun Hee Jeong

发明人： Young Hee Song ,  Hyouk Lee ,  Ki Hong Song ,  Jun Hee Jeong ,  Sung Sik Yun

IPC分类号： G06F1/16 ,  H02J7/02 ,  H02J50/10 ,  H01R13/627 ,  G04G17/06 ,  G04G21/04 ,  G06K19/077 ,  G04G17/04 ,  H01L25/065 ,  H04W4/80 ,  H01L23/538 ,  H01R12/70 ,  H01R12/77 ,  H02J7/34 ,  G04G19/00

摘要： A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.