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公开(公告)号:US08279566B2
公开(公告)日:2012-10-02
申请号:US12112209
申请日:2008-04-30
申请人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
发明人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
IPC分类号: H02H9/00
CPC分类号: H01L27/0248
摘要: An electrostatic discharge (ESD) clamp (41, 51, 61, 71, 81, 91), coupled across input-output (I/O) (22) and common (GND) (23) terminals of a protected semiconductor SC device or IC (24), comprises, an ESD transistor (ESDT) (25) with source-drain (26, 27) coupled between the GND (23) and I/O (22), a first resistor (30) coupled between gate (28) and source (26) and a second resistor (30) coupled between ESDT body (29) and source (26). Paralleling the resistors (30, 32) are control transistors (35, 35′) with gates (38, 38′) coupled to one or more bias supplies Vb, Vb′. The main power rail (Vdd) of the device or IC (24) is a convenient source for Vb, Vb′. When the Vdd is off during shipment, handling, equipment assembly, etc., the ESD trigger voltage Vt1 is low, thereby providing maximum ESD protection when ESD risk is high. When Vdd is energized, Vt1 rises to a value large enough to avoid interference with normal circuit operation but still protect from ESD events. Parasitic leakage through the ESDT (25) during normal operation is much reduced.
摘要翻译: 被保护半导体SC器件的输入输出(I / O)(22)和公共(GND)(23)端子耦合的静电放电(ESD)钳位(41,41,61,71,81,91) IC(24)包括耦合在GND(23)和I / O(22)之间的源极 - 漏极(26,27)的ESD晶体管(ESDT)(25),耦合在栅极 28)和源极(26)以及耦合在ESDT体(29)和源极(26)之间的第二电阻器(30)。 并联电阻器(30,32)是与一个或多个偏置电源Vb,Vb'耦合的门(38,38')的控制晶体管(35,35')。 设备或IC(24)的主电源轨(Vdd)是Vb,Vb'的方便源。 当Vdd在装运,处理,设备组装等时关闭时,ESD触发电压Vt1为低,从而在ESD风险高时提供最大的ESD保护。 当Vdd通电时,Vt1上升到足够大的值,以避免与正常电路操作的干扰,但仍然保护ESD事件。 在正常运行期间通过ESDT(25)的寄生泄漏大大减少。
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公开(公告)号:US08432654B2
公开(公告)日:2013-04-30
申请号:US13612466
申请日:2012-09-12
申请人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
发明人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
IPC分类号: H02H9/00
CPC分类号: H01L27/0248
摘要: An electrostatic discharge (ESD) clamp, coupled across input-output (I/O) and common (GND) terminals of a protected semiconductor device or integrated circuit is provided. One ESD clamp comprises an ESD transistor (ESDT) with source-drain coupled between the GND and I/O terminals, a first resistor coupled between the gate and source and a second resistor coupled between the ESDT body and source. Paralleling the resistors are control transistors with gates coupled to one or more bias supplies Vb, Vb′. The main power rail (Vdd) of the device or IC is a convenient source for Vb, Vb′. When the Vdd is off during shipment, handling, equipment assembly, etc., the ESD trigger voltage Vt1 is low, thereby providing maximum ESD protection when ESD risk is high. When Vdd is energized, Vt1 rises to a value large enough to avoid interference with normal circuit operation but still protect from ESD events.
摘要翻译: 提供了耦合在受保护的半导体器件或集成电路的输入输出(I / O)和公共(GND)端子之间的静电放电(ESD)钳位。 一个ESD钳位包括源极 - 漏极耦合在GND和I / O端子之间的ESD晶体管(ESDT),耦合在栅极和源极之间的第一个电阻器和耦合在ESDT体和源极之间的第二个电阻器。 并联电阻器是控制晶体管,其栅极耦合到一个或多个偏置电源Vb,Vb'。 设备或IC的主电源轨(Vdd)是Vb,Vb'的方便源。 当Vdd在装运,处理,设备组装等时关闭时,ESD触发电压Vt1为低,从而在ESD风险高时提供最大的ESD保护。 当Vdd通电时,Vt1上升到足够大的值,以避免与正常电路操作的干扰,但仍然保护ESD事件。
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公开(公告)号:US20090273867A1
公开(公告)日:2009-11-05
申请号:US12112209
申请日:2008-04-30
申请人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
发明人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
IPC分类号: H02H9/04
CPC分类号: H01L27/0248
摘要: An electrostatic discharge (ESD) clamp (41, 51, 61, 71, 81, 91), coupled across input-output (I/O) (22) and common (GND) (23) terminals of a protected semiconductor SC device or IC (24), comprises, an ESD transistor (ESDT) (25) with source-drain (26, 27) coupled between the GND (23) and I/O (22), a first resistor (30) coupled between gate (28) and source (26) and a second resistor (30) coupled between ESDT body (29) and source (26). Paralleling the resistors (30, 32) are control transistors (35, 35′) with gates (38, 38′) coupled to one or more bias supplies Vb, Vb′. The main power rail (Vdd) of the device or IC (24) is a convenient source for Vb, Vb′. When the Vdd is off during shipment, handling, equipment assembly, etc., the ESD trigger voltage Vt1 is low, thereby providing maximum ESD protection when ESD risk is high. When Vdd is energized, Vt1 rises to a value large enough to avoid interference with normal circuit operation but still protect from ESD events. Parasitic leakage through the ESDT (25) during normal operation is much reduced.
摘要翻译: 被保护半导体SC器件的输入输出(I / O)(22)和公共(GND)(23)端子耦合的静电放电(ESD)钳位(41,41,61,71,81,91) IC(24)包括耦合在GND(23)和I / O(22)之间的源极 - 漏极(26,27)的ESD晶体管(ESDT)(25),耦合在栅极 28)和源极(26)和耦合在ESDT体(29)和源极(26)之间的第二电阻器(30)。 并联电阻器(30,32)是与一个或多个偏置电源Vb,Vb'耦合的门(38,38')的控制晶体管(35,35')。 设备或IC(24)的主电源轨(Vdd)是Vb,Vb'的方便源。 当Vdd在装运,处理,设备组装等时关闭时,ESD触发电压Vt1为低,从而在ESD风险高时提供最大的ESD保护。 当Vdd通电时,Vt1上升到足够大的值,以避免与正常电路操作的干扰,但仍然保护ESD事件。 在正常运行期间通过ESDT(25)的寄生泄漏大大减少。
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公开(公告)号:US20130010394A1
公开(公告)日:2013-01-10
申请号:US13612466
申请日:2012-09-12
申请人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
发明人: James D. Whitfield , Chai Ean Gill , Abhijat Goyal , Rouying Zhan
IPC分类号: H02H9/04
CPC分类号: H01L27/0248
摘要: An electrostatic discharge (ESD) clamp, coupled across input-output (I/O) and common (GND) terminals of a protected semiconductor device or integrated circuit is provided. One ESD clamp comprises an ESD transistor (ESDT) with source-drain coupled between the GND and I/O terminals, a first resistor coupled between the gate and source and a second resistor coupled between the ESDT body and source. Paralleling the resistors are control transistors with gates coupled to one or more bias supplies Vb, Vb′. The main power rail (Vdd) of the device or IC is a convenient source for Vb, Vb′. When the Vdd is off during shipment, handling, equipment assembly, etc., the ESD trigger voltage Vt1 is low, thereby providing maximum ESD protection when ESD risk is high. When Vdd is energized, Vt1 rises to a value large enough to avoid interference with normal circuit operation but still protect from ESD events.
摘要翻译: 提供了耦合在受保护的半导体器件或集成电路的输入输出(I / O)和公共(GND)端子之间的静电放电(ESD)钳位。 一个ESD钳位包括源极 - 漏极耦合在GND和I / O端子之间的ESD晶体管(ESDT),耦合在栅极和源极之间的第一个电阻器和耦合在ESDT体和源极之间的第二个电阻器。 并联电阻器是控制晶体管,其栅极耦合到一个或多个偏置电源Vb,Vb'。 设备或IC的主电源轨(Vdd)是Vb,Vb'的方便源。 当Vdd在装运,处理,设备组装等时关闭时,ESD触发电压Vt1为低,从而在ESD风险高时提供最大的ESD保护。 当Vdd通电时,Vt1上升到足够大的值,以避免与正常电路操作的干扰,但仍然保护ESD事件。
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公开(公告)号:US20090195944A1
公开(公告)日:2009-08-06
申请号:US12023181
申请日:2008-01-31
申请人: Abhijat Goyal , Chai Ean Gill , James D. Whitfield
发明人: Abhijat Goyal , Chai Ean Gill , James D. Whitfield
IPC分类号: H02H9/04
CPC分类号: H02H9/046
摘要: An electrostatic discharge (ESD) protection device (61, 71), coupled across input-output (I/O) (22) and common (23) terminals of a core circuit (24) that it is intended to protect from ESD events, comprises, multiple serially coupled ESD clamp stages (41, 41′), each stage (41, 41′) comprising an interior node (52, 52′) and first (32, 32′) and second terminal (42, 42′) nodes wherein the first terminal node (42) of the first clamp stage (41) is coupled to the common terminal (23) and the second terminal node (42′) of the last clamp stages (41′) is coupled to the I/O terminals (22). A resistance-capacitance ladder (60) is provided in parallel with some of the clamp stages (41, 41′), with a resistance (R1, R2, R3 etc.) coupled to each of the nodes (32, 52, 65 (42; 32′)) of one of the ESD clamp stages (41, 41′) by first terminals thereof and capacitors (C1, C2, etc.) are coupled between second terminals of the resistances (R1, R2, R3 etc.). The clamp stages (41, 41′) are desirably bi-directional and a diode (D1) may bridge one or more of the clamp stages (e.g., 41) to provide different clamp voltages for different polarity ESD events.
摘要翻译: 一个静电放电(ESD)保护装置(61,71),耦合在芯片电路(24)的输入输出(I / O)(22)和公共(23)端子之间,以防止ESD事件, 包括多个串联的ESD钳位级(41,41'),每个级(41,41')包括内部节点(52,52')和第一(32,32')和第二端子(42,42'), 其中第一钳位级(41)的第一端子节点(42)耦合到公共端子(23)并且最后钳位级(41')的第二端子节点(42')耦合到I / O端子(22)。 电阻 - 电容梯(60)与一些钳位级(41,41')并联设置,其中电阻(R1,R2,R3等)耦合到每个节点(32,52,65( (R1,R2,R3等)的第二端子之间耦合电容器(C1,C2等)中的一个ESD钳位级(41,41')的第一端, 。 钳位级(41,41')希望是双向的,并且二极管(D1)可桥接一个或多个钳位级(例如41),以为不同极性的ESD事件提供不同的钳位电压。
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公开(公告)号:US07723823B2
公开(公告)日:2010-05-25
申请号:US12178800
申请日:2008-07-24
申请人: Chai Ean Gill , Changsoo Hong , James D. Whitfield , Rouying Zhan
发明人: Chai Ean Gill , Changsoo Hong , James D. Whitfield , Rouying Zhan
IPC分类号: H01L23/62
CPC分类号: H01L27/0259 , H01L29/735 , H01L29/861
摘要: An improved lateral bipolar electrostatic discharge (ESD) protection device (40) comprises a semiconductor (SC) substrate (42), an overlying epitaxial SC layer (44), emitter-collector regions (48, 50) laterally spaced apart by a first distance (52) in the SC layer, a base region (54) adjacent the emitter region (48) extending laterally toward and separated from the collector region (50) by a base-collector spacing (56) that is selected to set the desired trigger voltage Vt1. By providing a buried layer region (49) under the emitter region (48) Ohmically coupled thereto, but not providing a comparable buried layer region (51) under the collector region (50), an asymmetrical structure is obtained in which the DC trigger voltage (Vt1DC) and transient trigger voltage (Vt1TR) are closely matched so that |Vt1TR−Vt1DC|˜0. This close matching increases the design margin and provides a higher performance ESD device (40) that is less sensitive to process variations, thereby improving manufacturing yield and reducing cost.
摘要翻译: 改进的侧向双极性静电放电(ESD)保护装置(40)包括半导体(SC)衬底(42),上覆外延SC层(44),发射极 - 集电区域(48,50),横向间隔开第一距离 (52),邻近所述发射极区域(48)的基极区域(54),所述基极区域(54)通过基极 - 集电极间隔(56)侧向朝向并且与所述集电极区域(50)分离,所述基极集电极间隔(56)被选择以设定所述期望的触发 电压Vt1。 通过在发射极区域(48)的下方设置一个掩埋层区域(49),所述掩埋层区域(49)与其集电极区域(50)的欧姆耦合,但不提供可比较的掩埋层区域(51),获得非对称结构,其中直流触发电压 (Vt1DC)和瞬态触发电压(Vt1TR)紧密匹配,使得| Vt1TR-Vt1DC | ~0。 这种紧密匹配增加了设计裕度,并提供了对工艺变化不那么敏感的更高性能的ESD器件(40),从而提高了制造产量并降低了成本。
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公开(公告)号:US20100019341A1
公开(公告)日:2010-01-28
申请号:US12178800
申请日:2008-07-24
申请人: Chai Ean Gill , Changsoo Hong , James D. Whitfield , Rouying Zhan
发明人: Chai Ean Gill , Changsoo Hong , James D. Whitfield , Rouying Zhan
IPC分类号: H01L23/62
CPC分类号: H01L27/0259 , H01L29/735 , H01L29/861
摘要: An improved lateral bipolar electrostatic discharge (ESD) protection device (40) comprises a semiconductor (SC) substrate (42), an overlying epitaxial SC layer (44), emitter-collector regions (48, 50) laterally spaced apart by a first distance (52) in the SC layer, a base region (54) adjacent the emitter region (48) extending laterally toward and separated from the collector region (50) by a base-collector spacing (56) that is selected to set the desired trigger voltage Vt1. By providing a buried layer region (49) under the emitter region (48) Ohmically coupled thereto, but not providing a comparable buried layer region (51) under the collector region (50), an asymmetrical structure is obtained in which the DC trigger voltage (Vt1DC) and transient trigger voltage (Vt1TR) are closely matched so that ∥Vt1TR−Vt1DC∥˜0. This close matching increases the design margin and provides a higher performance ESD device (40) that is less sensitive to process variations, thereby improving manufacturing yield and reducing cost.
摘要翻译: 改进的侧向双极性静电放电(ESD)保护装置(40)包括半导体(SC)衬底(42),上覆外延SC层(44),发射极 - 集电区域(48,50),横向间隔开第一距离 (52),邻近所述发射极区域(48)的基极区域(54),所述基极区域(54)通过基极 - 集电极间隔(56)侧向朝向并且与所述集电极区域(50)分离,所述基极集电极间隔(56)被选择以设定所述期望的触发 电压Vt1。 通过在发射极区域(48)的下方设置一个掩埋层区域(49),所述掩埋层区域(49)与其集电极区域(50)的欧姆耦合,但不提供可比较的掩埋层区域(51),获得非对称结构,其中直流触发电压 (Vt1DC)和瞬态触发电压(Vt1TR)紧密匹配,使得‖Vt1TR-Vt1DC‖〜0。 这种紧密匹配增加了设计裕度,并提供了对工艺变化不那么敏感的更高性能的ESD器件(40),从而提高了制造产量并降低了成本。
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公开(公告)号:US20090213506A1
公开(公告)日:2009-08-27
申请号:US12038146
申请日:2008-02-27
申请人: Rouying Zhan , Chai Ean Gill , James D. Whitfield , Hongzhong Xu
发明人: Rouying Zhan , Chai Ean Gill , James D. Whitfield , Hongzhong Xu
IPC分类号: H02H9/04
CPC分类号: H01L27/0262 , H01L29/86 , H01L29/87
摘要: An electrostatic discharge (ESD) protection device (41, 51, 61, 71, 81) coupled across input-output (I/O) (22) and common (23) terminals of a core circuit (24) that it is intended to protect from ESD events, comprises, one or more serially coupled resistor triggered ESD clamp stages (41, 41′, 41″; 71, 71′, 71″), each stage (41, 41+, 41″; 71, 71′, 71″) comprising first (T1, T1′, T1″, etc.) and second transistors (T2, T2′, T2′″ etc.) having a common collector (52, 52′, 52″) and first (26, 26′, 26″) and second (36, 36′, 36″) emitters providing terminals (32, 42; 32′, 42′; 32″, 42″) of each clamp stage (41, 41′, 41″; 71, 71′, 71. A first emitter (25) of the first stage (41, 71) couples to the common terminal (23) and a second emitter (42″) of the last stage (41″, 71′) couples to the I/O terminals (22). Zener diode triggers are not used. Integrated external ESD trigger resistors (29, 29′, 29″; 39, 39′, 39″) (e.g., of poly SC) are coupled between the base (28, 28′, 28″; 38, 38′, 38″) and emitter (26, 26′, 26″; 36, 36′, 36″) of each transistor (T1, T1′, T1″; T2, T2′, T2″). Different resistor values (e.g., ˜0.5 k to 150 k Ohms) give different ESD trigger voltages. Cascading the clamp stages (41, 41′, 41″; 71, 71′) gives even higher trigger voltages. The ESD trigger resistances (29, 29′, 29″; 39, 39′, 39″) are desirably located outside the common collector-isolation wall (741, 742, 743; 741′, 742′, 743″) surrounding the transistors (T1, T1′, T1″; T2, T2′, T2″).
摘要翻译: 耦合在核心电路(24)的输入输出(I / O)(22)和公共(23)端子之间的静电放电(ESD)保护装置(41,41,61,71,81),其旨在 包括一个或多个串联电阻触发的ESD钳位级(41,41',41“; 71,71',71”),每个级(41,41+,41“,71”) ,包括第一(T1,T1',T1“等)的第二晶体管(T2,T2',T2”'等),其具有公共集电极(52,52',52' “)和第一(26,26',26”)和第二(36,36',36“)发射器提供端子(32,42; 32',42'; 32”,42“) 第一级(41,71)的第一发射极(25)耦合到公共端子(23)和第二发射极(42'), 最后级(41“,71”)耦合到I / O端子(22),不使用齐纳二极管触发。集成外部ESD触发电阻(29,29',29“; 39,39 ',39“)(例如,聚SC)连接在基座(28,28',28”,38“ 38',38“)和发射器(26,26',26”; (T1,T1',T1“; T2,T2',T2”)的每个晶体管(36,36',36“)。 不同的电阻值(例如〜0.5k至150kΩ)给出不同的ESD触发电压。 级联钳位级(41,41',41“,71,71')给出更高的触发电压。 ESD触发电阻(29,29',29“; 39,39',39”)理想地位于公共集电极隔离壁(741,742,743; 741',742',743“)的外侧, 围绕晶体管(T1,T1',T1“; T2,T2',T2”)。
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公开(公告)号:US09786652B2
公开(公告)日:2017-10-10
申请号:US14854366
申请日:2015-09-15
IPC分类号: H01L29/74 , H01L29/747 , H01L29/00 , H01L21/331 , H01L27/082 , H01L29/73 , H01L27/02 , H01L29/66 , H01L23/60 , H01L29/06 , H01L29/08 , H01L29/10
CPC分类号: H01L27/0259 , H01L23/60 , H01L27/0248 , H01L27/0262 , H01L27/082 , H01L29/0649 , H01L29/0808 , H01L29/0821 , H01L29/1008 , H01L29/66234 , H01L29/6625 , H01L29/73 , H01L29/7317 , H01L2924/0002 , H01L2924/00
摘要: An ESD protection device is fabricated in a semiconductor substrate that includes a semiconductor layer having a first conductivity type. A first well implantation procedure implants dopant of a second conductivity type in the semiconductor layer to form inner and outer sinker regions. The inner sinker region is configured to establish a common collector region of first and second bipolar transistor devices. A second well implantation procedure implants dopant of the first conductivity type in the semiconductor layer to form respective base regions of the first and second bipolar transistor devices. Conduction of the first bipolar transistor device is triggered by breakdown between the inner sinker region and the base region of the first bipolar transistor device. Conduction of the second bipolar transistor device is triggered by breakdown between the outer sinker region and the base region of the second bipolar transistor device.
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公开(公告)号:US20130279051A1
公开(公告)日:2013-10-24
申请号:US13451312
申请日:2012-04-19
申请人: Chai Ean Gill , Rouying Zhan
发明人: Chai Ean Gill , Rouying Zhan
IPC分类号: H02H9/04
CPC分类号: H01L27/0259 , H02H9/041
摘要: An area-efficient, high voltage, dual polarity ESD protection device (200) is provided for protecting multiple pins (30, 40) against ESD events by using a plurality of stacked NPN devices (38, 48, 39) which have separately controllable breakdown voltages and which share one or common NPN devices (39), thereby reducing the footprint of the high voltage ESD protection circuits without reducing robustness and functionality.
摘要翻译: 提供了一种区域高效,高电压,双极性ESD保护装置(200),用于通过使用多个堆叠的NPN装置(38,48,39)来保护多个针脚(30,40)免受ESD事件的影响,这些NPN装置具有分别可控的击穿 电压并且共享一个或公共NPN器件(39),从而减少高压ESD保护电路的覆盖,而不降低鲁棒性和功能性。
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