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公开(公告)号:US07671390B2
公开(公告)日:2010-03-02
申请号:US11628130
申请日:2005-05-25
IPC分类号: H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L29/00
CPC分类号: H01L21/76264 , H01L21/76895 , H01L29/0653 , H01L29/404 , H01L29/407 , H01L29/42368 , H01L29/7816 , H01L29/7824 , H01L29/7835
摘要: A semiconductor device is formed with a lower field plate (32) and optional lateral field plates (34) around semiconductor (20) in which devices are formed, for example power FETs or other transistor or diode types. The semiconductor device is manufactured by forming trenches with insulated sidewalls, etching cavities (26) at the base of the trenches which join up and then filling the trenches with conductor (30).
摘要翻译: 半导体器件形成有下部场板(32)和围绕其形成器件的半导体(20)周围的可选的横向场板(34),例如功率FET或其它晶体管或二极管类型。 通过形成具有绝缘侧壁的沟槽来制造半导体器件,在沟槽的基部处的蚀刻腔(26),其连接起来,然后用导体(30)填充沟槽。
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公开(公告)号:US07361555B2
公开(公告)日:2008-04-22
申请号:US10591352
申请日:2005-02-28
IPC分类号: H01L21/336
CPC分类号: H01L29/7813 , H01L29/407 , H01L29/42368 , H01L29/511 , H01L29/513 , H01L29/518 , H01L29/7811
摘要: A trench-gate transistor has an integral first layer of silicon dioxide extending from the upper surface of the semiconductor body over top corners of each cell array trench. The integral first layer also provides a thin gate dielectric insulating layer for a thick gate electrode and the integral first layer also provides a first part of a stack of materials which constitute a thick trench sidewall insulating layer for a thin field plate. Consistent with an example embodiment, there is a method of manufacture. A hardmask used to etch the trenches is removed before providing the silicon dioxide layer. The layer is then protected by successive selective etching of the oxide layer and the nitride layer in the upper parts of the trenches. After the gate electrodes are provided, layers for the channel accommodating regions and source regions may be formed through the oxide layer on the upper surface.
摘要翻译: 沟槽栅晶体管具有从半导体主体的上表面延伸到每个单元阵列沟槽的顶角上的整体的二氧化硅层。 积分第一层还提供了用于厚栅电极的薄栅介质绝缘层,并且整体第一层还提供构成用于薄场板的厚沟槽侧壁绝缘层的材料堆叠的第一部分。 与示例性实施例一致,存在制造方法。 在提供二氧化硅层之前去除用于蚀刻沟槽的硬掩模。 然后通过对沟槽上部的氧化物层和氮化物层的连续选择性蚀刻来保护该层。 在设置栅电极之后,可以通过上表面上的氧化物层形成用于沟道容纳区和源极区的层。
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公开(公告)号:US07791059B2
公开(公告)日:2010-09-07
申请号:US12294020
申请日:2007-03-21
IPC分类号: H01L47/00
CPC分类号: H01L45/1293 , H01L27/2436 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/1246
摘要: An electric device has an electrically switchable resistor (2′) comprising a phase change material. The resistance value of the resistor can be changed between at least two values by changing the phase of the phase change material within a part of the resistor called the switching zone (12′) using Joule heating of the resistor. The device comprises a body (24′) encapsulating the resistor, which body comprises at least two abutting regions (26′, 28′) having different thermally insulating properties. These regions form a thermally insulating contrast with which the dimension of the switching zone can be determined without having to alter the dimensions of the resistor. Such a device can be used in electronic memory or reconfigurable logic circuits.
摘要翻译: 电气装置具有包括相变材料的电可开关电阻器(2')。 通过使用电阻器的焦耳加热来改变称为开关区(12')的电阻器的一部分内的相变材料的相位,可以在至少两个值之间改变电阻器的电阻值。 该装置包括封装电阻器的本体(24'),该主体包括具有不同绝热性能的至少两个邻接区域(26',28')。 这些区域形成隔热对比度,可以确定开关区域的尺寸,而不必改变电阻器的尺寸。 这种装置可用于电子存储器或可重新配置的逻辑电路中。
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