摘要:
A micromechanical assembly couples to a positioning member and to a body having an aerodynamic surface subject to aerodynamic forces. The micromechanical assembly comprises a substrate including a flexible beam joining a first substrate portion that is attachable to the positioning member to a second substrate portion that is attachable to the body. The substrate includes a substrate surface extending at least over the flexible beam. A lithographic pattern is formed on the substrate surface. The lithographic pattern includes at least a first impedance element that senses flexing of the flexible beam. Contact pads are coupled to the lithographic pattern for coupling to a flex measurement circuit.
摘要:
A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.
摘要:
A head having micro-positioning control. The head includes a slider body and a transducer body coupled to the slider body through a flexible interface. The transducer body is spaced from the slider body to form a gap therebetween. Micro-positioning actuators are coupled to the transducer body in the gap to provide micro-positioning control. In an embodiment for an air bearing slider, the gap includes off-track and fly height positioning control.
摘要:
An integrated interface structure for a nested body to provide an electrical connection. The interface structure includes nested bond pads which electrically interface with leads. The nested bond pads are fabricated on a microstructure to provide an interface to drive circuitry for transducer elements of a slider or head supported by the microstructure.
摘要:
A read/write head microactuator includes first and second insulating deposits that are flat, spaced apart by an air gap, and laterally movable responsive to a microactuator electrical drive current. First and second flat, interdigitated drive electrode deposits are deposited on the first insulating deposit. A flat, digitated sense electrode deposit is deposited on the second insulating deposit. The sense electrode deposit provides a relative position output. The sense electrode deposit faces both the drive electrode deposits across the air gap.
摘要:
A transducer assembly in which an electric current is passed through plating solution in recesses of a metal substrate to plate electrical contact bumps having bump fronts in the recesses and exposed bump backs. The transducer is partially formed on the substrate, sealing the exposed bump backs. One or more vacuum processes are performed to complete formation of the transducer. At least a portion of the metal substrate is etched away to expose the bump fronts of the electrical contact bumps.
摘要:
A disc drive has a disc rotatable about an axis, a slider carrying a transducing head for transducing data with a disc, and a dual stage actuation assembly supporting the slider to position the transducing head adjacent a selected radial track of the disc. The dual stage actuation assembly includes a movable actuator arm and a suspension assembly supported by the actuator arm. The suspension assembly includes a gimbal. The dual stage actuation assembly further includes a microactuator. The microactuator includes a stator having a top surface and a bottom surface wherein the gimbal is connected to the top surface of the stator. A rotor is operatively connected to the stator and the rotor supports the slider. A magnetic keeper structure is supported by the stator such that the rotor moves with respect to the magnetic keeper structure.
摘要:
Utilizing reactive ion etching (RIE) lag, tethers are fabricated that reliably hold devices in place during processing and storage, yet are easily broken to remove the parts from the wafer as desired, without requiring excessive force that could damage the devices. The tethers are fabricated by slightly narrowing the periphery etch feature at several places. By adjusting the ratio of the main periphery width to the necked width at the tethers, the final thickness of the tether can be controlled to a small fraction of the wafer thickness, so that tethers defined by readily achievable feature sizes will reliably hold the parts in place until removal is desired. Since the tethers are now only a fraction of the wafer thickness, they will reliably break to release the part at a force level that will not damage the part.
摘要:
A slider for carrying and finely adjusting both a radial position and a flying height of a transducing head with respect to a track of a rotatable disc includes a stator portion carried by a support structure such as a flexure of a disc drive system. A plurality of springs extend from the stator portion and are flexible in a lateral direction (for radial positioning) and in a vertical direction (for flying height control). A rotor portion is connected to the stator portion by the plurality of springs. The rotor portion carries the transducing head. The stator portion includes a plurality of stator electrodes, and the rotor portion includes a plurality of rotor electrodes suspended between the stator electrodes. Selected voltages are applied to the stator electrodes and the rotor electrodes to create a selected force in the lateral and vertical directions for moving the rotor portion with respect to the stator portion to finely adjust the radial position and flying height of the transducing head.
摘要:
A method for fabricating an integrated coil-on-keeper assembly for use in a magnetic circuit to actuate a microactuator. The assembly is formed on a keeper substrate by patterning an insulator layer, plating at least one coil layer and patterning another insulator layer on top of each coil layer. The keeper substrate is etched to form the top keeper of the coil-on-keeper assembly.