Transducer-level microactuator for a magnetic recording system
    2.
    发明授权
    Transducer-level microactuator for a magnetic recording system 有权
    用于磁记录系统的传感器级微致动器

    公开(公告)号:US07277257B2

    公开(公告)日:2007-10-02

    申请号:US10729472

    申请日:2003-12-05

    IPC分类号: G11B5/56 G11B21/21

    CPC分类号: G11B5/5552

    摘要: A transducer-level microactuator selectively positions a transducer portion of a slider radially with respect to circumferential data tracks of a rotatable disc. The slider includes a slider body having a leading edge and a trailing edge, a transducer body and a flexure body. The transducer body is spaced from the trailing edge of the sliding body and includes at least one transducer element. The flexure body extends from the trailing edge of the slider body and includes a first anchor point connected to the slider body and a second anchor point connected to the transducer body. The basecoat layer is deposited on the trailing edge of the slider body and substantially surrounds the flexure body wherein a gap separates the flexure body from the basecoat. A first actuation assembly is formed on the basecoat and a second actuation assembly is formed on the transducer body adjacent the slider body.

    摘要翻译: 传感器级微致动器相对于可旋转盘的周向数据轨道选择性地定位滑块的换能器部分。 滑块包括具有前缘和后缘的滑块体,换能器本体和挠曲体。 换能器主体与滑动体的后缘间隔开并且包括至少一个换能器元件。 弯曲体从滑块主体的后缘延伸并且包括连接到滑块主体的第一锚定点和连接到换能器本体的第二锚定点。 基底层沉积在滑块体的后缘上并且基本上围绕挠曲体,其中间隙将挠曲体与基底分隔开。 第一致动组件形成在底座上,并且第二致动组件形成在邻近滑块主体的换能器本体上。

    Laterally supported handle wafer for through-wafer reactive-ion etch micromachining
    4.
    发明授权
    Laterally supported handle wafer for through-wafer reactive-ion etch micromachining 失效
    用于通过晶片反应离子蚀刻微加工的侧面支撑的处理晶片

    公开(公告)号:US06733681B1

    公开(公告)日:2004-05-11

    申请号:US09707698

    申请日:2000-11-07

    IPC分类号: B81C100

    摘要: A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.

    摘要翻译: 用于晶圆等离子体蚀刻处理晶片的方法包括在晶片接合之间提供的手柄晶片和产品晶片之间的侧向支撑,或者使用配合机械结构的粘合膜。 在没有剥离或清洁的情况下,产品晶片在蚀刻之后容易地与处理晶片分离。 因为晶片之间的连接是机械的,而不是粘合层/接合层,所以可以蚀刻,检查晶片并且随后继续蚀刻晶片,而不会重复地进行接合,分离和清洁。 还提供了在通过蚀刻工艺之后的释放器件的非接合支撑。

    Strain sensor patterned on MEMS flex arms
    7.
    发明授权
    Strain sensor patterned on MEMS flex arms 失效
    应变传感器图案化在MEMS柔性臂上

    公开(公告)号:US07000459B2

    公开(公告)日:2006-02-21

    申请号:US10463775

    申请日:2003-06-17

    IPC分类号: G01B5/28

    CPC分类号: G11B5/5552 G01L1/2206

    摘要: A micromechanical assembly couples to a positioning member and to a body having an aerodynamic surface subject to aerodynamic forces. The micromechanical assembly comprises a substrate including a flexible beam joining a first substrate portion that is attachable to the positioning member to a second substrate portion that is attachable to the body. The substrate includes a substrate surface extending at least over the flexible beam. A lithographic pattern is formed on the substrate surface. The lithographic pattern includes at least a first impedance element that senses flexing of the flexible beam. Contact pads are coupled to the lithographic pattern for coupling to a flex measurement circuit.

    摘要翻译: 微机械组件连接到定位构件和耦合到具有经受空气动力的空气动力学表面的主体。 微机械组件包括基板,该基板包括将可附接到定位构件的第一基板部分连接到可附接到主体的第二基板部分的柔性梁。 衬底包括至少在柔性梁上延伸的衬底表面。 在基板表面上形成平版印刷图案。 光刻图案至少包括感应柔性光束弯曲的第一阻抗元件。 接触焊盘耦合到光刻图案以耦合到柔性测量电路。

    Moving coil micro actuator with reduced rotor mass

    公开(公告)号:US06614628B2

    公开(公告)日:2003-09-02

    申请号:US10051366

    申请日:2002-01-18

    IPC分类号: G11B556

    摘要: A disc drive has a disc rotatable about an axis, a slider carrying a transducing head for transducing data with a disc, and a dual stage actuation assembly supporting the slider to position the transducing head adjacent a selected radial track of the disc. The dual stage actuation assembly includes a movable actuator arm and a suspension assembly supported by the actuator arm. The suspension assembly includes a gimbal. The dual stage actuation assembly further includes a microactuator. The microactuator includes a stator having a top surface and a bottom surface wherein the gimbal is connected to the top surface of the stator. A rotor is operatively connected to the stator and the rotor supports the slider. A magnetic keeper structure is supported by the stator such that the rotor moves with respect to the magnetic keeper structure.

    Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag
    10.
    发明授权
    Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag 有权
    用于使用反应离子蚀刻滞后的微机电系统装置的可破坏的系绳

    公开(公告)号:US06387778B1

    公开(公告)日:2002-05-14

    申请号:US09649536

    申请日:2000-08-28

    IPC分类号: H01L21301

    CPC分类号: B81C1/00873 B81C2201/0132

    摘要: Utilizing reactive ion etching (RIE) lag, tethers are fabricated that reliably hold devices in place during processing and storage, yet are easily broken to remove the parts from the wafer as desired, without requiring excessive force that could damage the devices. The tethers are fabricated by slightly narrowing the periphery etch feature at several places. By adjusting the ratio of the main periphery width to the necked width at the tethers, the final thickness of the tether can be controlled to a small fraction of the wafer thickness, so that tethers defined by readily achievable feature sizes will reliably hold the parts in place until removal is desired. Since the tethers are now only a fraction of the wafer thickness, they will reliably break to release the part at a force level that will not damage the part.

    摘要翻译: 利用反应离子蚀刻(RIE)滞后,制造了在加工和存储期间可靠地将装置保持在适当位置的系链,但是容易断裂以根据需要从晶片中除去部件,而不需要可能损坏装置的过大的力。 系绳是通过在几个地方略微缩小周边蚀刻特征来制造的。 通过调节主臂周边宽度与系绳颈缩宽度的比例,可以将系绳的最终厚度控制在晶片厚度的一小部分,从而可以容易地达到的特征尺寸所限定的系绳将可靠地保持在 地方,直到需要去除。 由于系绳现在只是晶片厚度的一部分,它们将可靠地断裂,以不会损坏零件的力水平释放零件。