摘要:
A head having micro-positioning control. The head includes a slider body and a transducer body coupled to the slider body through a flexible interface. The transducer body is spaced from the slider body to form a gap therebetween. Micro-positioning actuators are coupled to the transducer body in the gap to provide micro-positioning control. In an embodiment for an air bearing slider, the gap includes off-track and fly height positioning control.
摘要:
A transducer-level microactuator selectively positions a transducer portion of a slider radially with respect to circumferential data tracks of a rotatable disc. The slider includes a slider body having a leading edge and a trailing edge, a transducer body and a flexure body. The transducer body is spaced from the trailing edge of the sliding body and includes at least one transducer element. The flexure body extends from the trailing edge of the slider body and includes a first anchor point connected to the slider body and a second anchor point connected to the transducer body. The basecoat layer is deposited on the trailing edge of the slider body and substantially surrounds the flexure body wherein a gap separates the flexure body from the basecoat. A first actuation assembly is formed on the basecoat and a second actuation assembly is formed on the transducer body adjacent the slider body.
摘要:
A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.
摘要:
A method of handling a wafer for through-wafer plasma etching includes lateral support provided between a handle wafer and a product wafer without wafer bonding or an adhesive film using mating mechanical structures. The product wafer is easily separated from the handle wafer following etching without stripping or cleaning. Because the connection between the wafers is mechanical, not from an adhesive layer/bonded layer, a wafer can be etched, inspected, and subsequently continue to be etched without the hindrance of repeated bonding, separation, and cleaning. A non-bonded support for released devices following a through-etch process is also provided.
摘要:
An integrated interface structure for a nested body to provide an electrical connection. The interface structure includes nested bond pads which electrically interface with leads. The nested bond pads are fabricated on a microstructure to provide an interface to drive circuitry for transducer elements of a slider or head supported by the microstructure.
摘要:
A read/write head microactuator includes first and second insulating deposits that are flat, spaced apart by an air gap, and laterally movable responsive to a microactuator electrical drive current. First and second flat, interdigitated drive electrode deposits are deposited on the first insulating deposit. A flat, digitated sense electrode deposit is deposited on the second insulating deposit. The sense electrode deposit provides a relative position output. The sense electrode deposit faces both the drive electrode deposits across the air gap.
摘要:
A micromechanical assembly couples to a positioning member and to a body having an aerodynamic surface subject to aerodynamic forces. The micromechanical assembly comprises a substrate including a flexible beam joining a first substrate portion that is attachable to the positioning member to a second substrate portion that is attachable to the body. The substrate includes a substrate surface extending at least over the flexible beam. A lithographic pattern is formed on the substrate surface. The lithographic pattern includes at least a first impedance element that senses flexing of the flexible beam. Contact pads are coupled to the lithographic pattern for coupling to a flex measurement circuit.
摘要:
A transducer assembly in which an electric current is passed through plating solution in recesses of a metal substrate to plate electrical contact bumps having bump fronts in the recesses and exposed bump backs. The transducer is partially formed on the substrate, sealing the exposed bump backs. One or more vacuum processes are performed to complete formation of the transducer. At least a portion of the metal substrate is etched away to expose the bump fronts of the electrical contact bumps.
摘要:
A disc drive has a disc rotatable about an axis, a slider carrying a transducing head for transducing data with a disc, and a dual stage actuation assembly supporting the slider to position the transducing head adjacent a selected radial track of the disc. The dual stage actuation assembly includes a movable actuator arm and a suspension assembly supported by the actuator arm. The suspension assembly includes a gimbal. The dual stage actuation assembly further includes a microactuator. The microactuator includes a stator having a top surface and a bottom surface wherein the gimbal is connected to the top surface of the stator. A rotor is operatively connected to the stator and the rotor supports the slider. A magnetic keeper structure is supported by the stator such that the rotor moves with respect to the magnetic keeper structure.
摘要:
Utilizing reactive ion etching (RIE) lag, tethers are fabricated that reliably hold devices in place during processing and storage, yet are easily broken to remove the parts from the wafer as desired, without requiring excessive force that could damage the devices. The tethers are fabricated by slightly narrowing the periphery etch feature at several places. By adjusting the ratio of the main periphery width to the necked width at the tethers, the final thickness of the tether can be controlled to a small fraction of the wafer thickness, so that tethers defined by readily achievable feature sizes will reliably hold the parts in place until removal is desired. Since the tethers are now only a fraction of the wafer thickness, they will reliably break to release the part at a force level that will not damage the part.