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    DCM circle shoe having angled wear insert
    3.
    发明授权
    DCM circle shoe having angled wear insert 有权
    DCM圆形鞋具有成角度的磨损插入物

    公开(公告)号：US08869910B2

    公开(公告)日：2014-10-28

    申请号：US12945369

    申请日：2010-11-12

    申请人： Andrew G. Greuel ,  Nikhil Sharma ,  Jacob P. Fawer

    发明人： Andrew G. Greuel ,  Nikhil Sharma ,  Jacob P. Fawer

    IPC分类号： E02F3/00 ,  E02F3/84 ,  E02F3/76 ,  E02F9/26

    CPC分类号： E02F3/764 ,  E02F3/7604 ,  E02F3/844 ,  E02F9/26

    摘要： A DCM circle shoe for a motor grader is disclosed. The DCM circle shoe may have a base having a mounting surface, and a lip portion protruding from the base at an end of the base opposite the mounting surface in a direction generally parallel with the mounting surface. The DCM circle shoe may also have a wear insert mounted at a distal edge of the lip portion, the wear insert having an outer wear surface oriented at an oblique angle relative to the mounting surface of the base.

    摘要翻译： 公开了一种用于平地机的DCM圆形鞋。 DCM圆形鞋可以具有一个具有一个安装表面的底座，以及一个唇缘部分，该唇形部分在与基座平行于安装表面的方向上与底座相对的安装表面的基部突出。 DCM圆形鞋还可以具有安装在唇缘部分的远侧边缘处的磨损插入件，磨损插入件具有相对于基部的安装表面以倾斜角度定向的外部磨损表面。

    PROTECTIVE FILM WITH DYE MATERIALS FOR LASER ABSORPTION ENHANCEMENT FOR VIA DRILLING
    8.
    发明申请
    PROTECTIVE FILM WITH DYE MATERIALS FOR LASER ABSORPTION ENHANCEMENT FOR VIA DRILLING 审中-公开
    用于通过钻孔的激光吸收增强材料的保护膜

    公开(公告)号：US20140299356A1

    公开(公告)日：2014-10-09

    申请号：US13856806

    申请日：2013-04-04

    申请人： Chong Zhang ,  Nikhil Sharma

    发明人： Chong Zhang ,  Nikhil Sharma

    IPC分类号： H05K3/40 ,  H05K1/11 ,  H05K3/00

    CPC分类号： H05K3/0035 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2203/1383 ,  Y10T29/49165 ,  Y10T29/49224

    摘要： Embodiments of preventing unwanted damage to microelectronic substrates from laser drilling are generally described herein. In some embodiments, the method includes forming a microelectronic substrate, and adding a layer of protective material to dielectric material of the microelectronic substrate. The microelectronic substrate is configured for mounting one or more integrated circuits (ICs) thereon and includes interconnection for a plurality of electronic circuits. The protective material is configured to absorb laser energy applied in laser drilling of the microelectronic substrate.

    摘要翻译： 这里通常描述防止激光钻孔对微电子基板的不必要的损坏的实施例。 在一些实施例中，该方法包括形成微电子衬底，并将一层保护材料添加到微电子衬底的介电材料。 微电子衬底被配置用于在其上安装一个或多个集成电路（IC），并且包括用于多个电子电路的互连。 保护材料被配置为吸收在微电子衬底的激光钻孔中施加的激光能量。

    SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION
    10.
    发明申请
    SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION 审中-公开
    通过孔形成激光的基底线

    公开(公告)号：US20140004361A1

    公开(公告)日：2014-01-02

    申请号：US13536709

    申请日：2012-06-28

    申请人： Nikhil Sharma ,  Chong Zhang ,  Tao Wu ,  Islam A. Salama

    发明人： Nikhil Sharma ,  Chong Zhang ,  Tao Wu ,  Islam A. Salama

    IPC分类号： B32B27/02 ,  B23K26/38

    CPC分类号： B32B27/02 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/172 ,  Y10T428/31855

    摘要： Substrate cores for laser through hole formation are described. Substrate core embodiments include a plurality of reinforcement material layers and a microfiller loaded resin disposed between the plurality of reinforcement material layers. Microfiller and reinforcement materials are selected to reduce opto-thermal mismatch for a laser of a predetermined bandwidth. In embodiments, the reinforcement material may include a fibrous polymer, reducing the thermal contrast with the microfiller loaded resin, and/or include a chromophore that absorbs within the laser bandwidth. In further embodiments, the microfiller is of a material having a high melting temperature to reduce thermal contrast with the reinforcement material.

    摘要翻译： 描述了用于激光通孔形成的基板芯。 基底芯实施例包括多个增强材料层和设置在多个增强材料层之间的装载有微粒填料的树脂。 选择微型填充物和增强材料以减少预定带宽的激光器的光热失配。 在实施方案中，增强材料可以包括纤维聚合物，减少与填充微粒填料的树脂的热对比度，和/或包括在激光带宽内吸收的发色团。 在另外的实施方案中，微细粉末是具有高熔融温度以减少与增强材料的热对比度的材料。