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公开(公告)号：US20130079902A1
公开(公告)日：2013-03-28
申请号：US13239791
申请日：2011-09-22
申请人： Jeffry K. Kamenetz , Mark A. Johnston , Edward John Marotta , Cathleen R. Bleier , John M. O'Neil
发明人： Jeffry K. Kamenetz , Mark A. Johnston , Edward John Marotta , Cathleen R. Bleier , John M. O'Neil
IPC分类号： G05B9/03
CPC分类号： G05B19/0421 , G05B19/0428 , G05B2219/14014 , G05B2219/24177 , G05B2219/24183 , G05B2219/24186 , G06F11/2033 , G06F11/2041
摘要： A multi-channel control system includes at least a first primary control microprocessor and a second primary control microprocessor operable to control a device, and at least a first secondary control microprocessor and a second secondary control microprocessor operable to control the device. Each of the first and second primary control microprocessors and the first and second secondary control microprocessors are arranged as an independent control channel.
摘要翻译： 多通道控制系统至少包括可操作以控制设备的第一主控微处理器和第二主控微处理器，以及可操作以控制设备的至少第一副控制微处理器和第二副控微处理器。 第一和第二主要控制微处理器以及第一和第二次级控制微处理器中的每一个被布置为独立的控制通道。
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公开(公告)号：US09625894B2
公开(公告)日：2017-04-18
申请号：US13239791
申请日：2011-09-22
申请人： Jeffry K. Kamenetz , Mark A. Johnston , Edward John Marotta , Cathleen R. Bleier , John M. O'Neil
发明人： Jeffry K. Kamenetz , Mark A. Johnston , Edward John Marotta , Cathleen R. Bleier , John M. O'Neil
CPC分类号： G05B19/0421 , G05B19/0428 , G05B2219/14014 , G05B2219/24177 , G05B2219/24183 , G05B2219/24186 , G06F11/2033 , G06F11/2041
摘要： A multi-channel control system includes a first primary control microprocessor and a second primary control microprocessor operable to control a device, and a first secondary control microprocessor and a second secondary control microprocessor operable to control the device. Each of the first and second primary control microprocessors and the first and second secondary control microprocessors are arranged as an independent control channel.
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公开(公告)号：US09483032B2
公开(公告)日：2016-11-01
申请号：US13239708
申请日：2011-09-22
CPC分类号： G05B9/03 , F01D21/02 , F02C9/46 , F02D41/22 , F02D41/266 , F02D41/28 , F02D2200/101 , F02D2400/08 , F05D2270/021
摘要： A multi-channel controller uses multiple logic gates and multiple control channels to provide fault tolerant protection against undesired events.
摘要翻译： 多通道控制器使用多个逻辑门和多个控制通道来提供针对不期望事件的容错保护。
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公开(公告)号：US20130079894A1
公开(公告)日：2013-03-28
申请号：US13239708
申请日：2011-09-22
CPC分类号： G05B9/03 , F01D21/02 , F02C9/46 , F02D41/22 , F02D41/266 , F02D41/28 , F02D2200/101 , F02D2400/08 , F05D2270/021
摘要： A multi-channel controller uses multiple logic gates and multiple control channels to provide fault tolerant protection against undesired events.
摘要翻译： 多通道控制器使用多个逻辑门和多个控制通道来提供针对不期望事件的容错保护。
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公开(公告)号：US20120176716A1
公开(公告)日：2012-07-12
申请号：US12987219
申请日：2011-01-10
申请人： Kevin P. Roy , Richard A. Poisson , Jay W. Kokas , Edward John Marotta , Robert C. Hoeckele , Luke T. Orsini , Marc S. McCloud , Matthew S. Fitzpatrick
发明人： Kevin P. Roy , Richard A. Poisson , Jay W. Kokas , Edward John Marotta , Robert C. Hoeckele , Luke T. Orsini , Marc S. McCloud , Matthew S. Fitzpatrick
IPC分类号： H02H3/22
CPC分类号： H01L23/49562 , H01L21/561 , H01L23/16 , H01L23/3107 , H01L23/49575 , H01L23/62 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.
摘要翻译： 系统包括具有顶表面和底表面的封装，布置在封装内的多个高功率瞬态电压抑制器，以及稳健的引线框架。 每个瞬态电压抑制器具有大致垂直于封装的顶表面和底表面的第一和第二主表面。 引线框架包括连接到瞬态电压抑制器的主表面的引线。 每个引线在安装部分中具有大于约0.015英寸（或0.381mm）的厚度，以便从瞬态电压抑制器散发热量并抵抗封装上的振动引起的应力。
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公开(公告)号：US08638535B2
公开(公告)日：2014-01-28
申请号：US12987219
申请日：2011-01-10
申请人： Kevin P. Roy , Richard A. Poisson , Jay W. Kokas , Edward John Marotta , Robert C. Hoeckele , Luke T. Orsini , Marc S. McCloud , Matthew S. Fitzpatrick
发明人： Kevin P. Roy , Richard A. Poisson , Jay W. Kokas , Edward John Marotta , Robert C. Hoeckele , Luke T. Orsini , Marc S. McCloud , Matthew S. Fitzpatrick
IPC分类号： H02H3/22
CPC分类号： H01L23/49562 , H01L21/561 , H01L23/16 , H01L23/3107 , H01L23/49575 , H01L23/62 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.
摘要翻译： 系统包括具有顶表面和底表面的封装，布置在封装内的多个高功率瞬态电压抑制器，以及稳健的引线框架。 每个瞬态电压抑制器具有大致垂直于封装的顶表面和底表面的第一和第二主表面。 引线框架包括连接到瞬态电压抑制器的主表面的引线。 每个引线在安装部分中具有大于约0.015英寸（或0.381mm）的厚度，以便从瞬态电压抑制器散发热量并抵抗封装上的振动引起的应力。
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