公开(公告)号：US20070054178A1

公开(公告)日：2007-03-08

申请号：US11511580

申请日：2006-08-29

申请人： Jeong Moon ,  Seog Yoon ,  Soon Jung

发明人： Jeong Moon ,  Seog Yoon ,  Soon Jung

IPC分类号： H01M10/50 ,  H01M10/48

CPC分类号： H01M10/052 ,  H01M2/34 ,  H01M2/348 ,  H01M6/5044 ,  H01M10/486 ,  H01M10/488

摘要： Disclosed is a battery having a heat sensor, and more particularly a battery having an irreversible heat senor capable of indicating temperature variation of two or more levels, or three or more levels if necessary.

摘要翻译： 公开了一种具有热传感器的电池，更具体地，具有能够指示两个或更多个电平的温度变化或者如果需要三个或更多个电平的不可逆热量传感器的电池。

公开(公告)号：US20070265393A1

公开(公告)日：2007-11-15

申请号：US11648862

申请日：2006-12-29

申请人： Dong Sohn ,  Je Lee ,  Bong Park ,  Jae Kim ,  Soon Jung ,  Yong Lee

发明人： Dong Sohn ,  Je Lee ,  Bong Park ,  Jae Kim ,  Soon Jung ,  Yong Lee

IPC分类号： C08G63/48

CPC分类号： C08L25/12 ,  C08L25/16 ,  C08L25/18 ,  C08L55/02 ,  C08L2205/035 ,  C08L2666/02 ,  C08L2666/24 ,  C08L2666/04

摘要： The present invention relates to a low-odor thermoplastic resin composition. In particular the resin of the resin composition is prepared by a new bulk polymerization process that is used to reduce the characteristic chemical odor in new cars. The resin minimizes the use of the resin prepared by the conventional emulsion polymerization process, N-substituted maleimide and α-alkylstyrene-based heat-resistant materials which are used to improve heat resistance and the molecular weight of the matrix of the thermoplastic composition. The resin is also improves impact strength, thereby having reduced characteristic chemical odor, while having superior impact strength and heat resistance.

摘要翻译： 本发明涉及一种低气味的热塑性树脂组合物。 特别地，树脂组合物的树脂通过新的本体聚合方法制备，该方法用于降低新车中的特征化学气味。 该树脂使通过常规乳液聚合方法制备的树脂，N-取代马来酰亚胺和α-烷基苯乙烯类耐热材料的用途最小化，这些材料用于改善热塑性组合物的耐热性和基质的分子量。 树脂也提高冲击强度，从而具有降低的特征化学气味，同时具有优异的冲击强度和耐热性。

公开(公告)号：US20050042878A1

公开(公告)日：2005-02-24

申请号：US10922756

申请日：2004-08-20

申请人： Soon Jung

发明人： Soon Jung

IPC分类号： H01L21/28 ,  H01L21/311 ,  H01L21/768 ,  H01L21/4763 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/31116 ,  H01L21/76805

摘要： Semiconductor devices having a via hole and methods for forming a via hole in a semiconductor device are disclosed. A disclosed method comprises performing a first etching process on an insulating layer to form a via hole, and performing a second etching process to enlarge a bottom of the via hole.

摘要翻译： 公开了具有通孔的半导体器件和用于在半导体器件中形成通孔的方法。 所公开的方法包括在绝缘层上执行第一蚀刻工艺以形成通孔，并且执行第二蚀刻工艺以扩大通孔的底部。

公开(公告)号：US20060104184A1

公开(公告)日：2006-05-18

申请号：US11267396

申请日：2005-11-04

申请人： Tetsuo Ariyoshi ,  Ho Jeong ,  Soon Jung

发明人： Tetsuo Ariyoshi ,  Ho Jeong ,  Soon Jung

IPC分类号： G11B7/00

CPC分类号： G11B7/13922 ,  G11B2007/0006

摘要： The present invention is related to a chromatic aberration-correcting element which allows the adoption of BDs even when DVD/CD light beams are incident. The chromatic aberration-correcting element has a diffractive structure formed thereon, which can correct chromatic aberration in BD wavelength light beams in addition to adopting DVD/CD wavelength light beams. Also provided is an optical pickup device whose structure is simplified by employing the chromatic aberration-correcting element.