公开(公告)号：US20230082385A1

公开(公告)日：2023-03-16

申请号：US17474255

申请日：2021-09-14

申请人： Jeremy D. Ecton ,  Kristof Darmawikarta ,  Sashi S. Kandanur ,  Srinivas Venkata Ramanuja Pietambaram ,  Darko Grujicic ,  Marcel Arlan Wall ,  Suddhasattwa Nad ,  Benjamin Duong ,  Rengarajan Shanmugam ,  Bai Nie ,  Helme Castro De La Torre

发明人： Jeremy D. Ecton ,  Kristof Darmawikarta ,  Sashi S. Kandanur ,  Srinivas Venkata Ramanuja Pietambaram ,  Darko Grujicic ,  Marcel Arlan Wall ,  Suddhasattwa Nad ,  Benjamin Duong ,  Rengarajan Shanmugam ,  Bai Nie ,  Helme Castro De La Torre

IPC分类号： H01L21/48 ,  H01L23/498

摘要： An electronic device comprises an electronic package with a glass core. The glass core includes a first surface and a second surface opposite the first surface, at least one through-glass via (TGV) extending through the glass core from the first surface to the second surface, and including an electrically conductive material, and wherein the at least one TGV includes a first portion having a first width and a second portion having a second width different from the first width.

公开(公告)号：US20230087124A1

公开(公告)日：2023-03-23

申请号：US17483013

申请日：2021-09-23

申请人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

发明人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

IPC分类号： G02B6/42

摘要： Various embodiments disclosed relate to photonic assemblies. The present disclosure includes methods for packaging a photonic assembly, including attaching a bridge die to a glass substrate, attaching an electronic integrated circuit die to the glass substrate and the bridge die, attaching a photonic integrated circuit die to the glass substrate and the bridge die, bonding a coupling adapter to the glass substrate and in situ forming a waveguide in the coupling adapted, the waveguide aligning with the photonic integrated circuit die.

公开(公告)号：US20230090133A1

公开(公告)日：2023-03-23

申请号：US17481027

申请日：2021-09-21

申请人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

发明人： Bai Nie ,  Pooya Tadayon ,  Leonel R. Arana ,  Yonggang Li ,  Changhua Liu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Tarek A. Ibrahim ,  Hari Mahalingam ,  Benjamin Duong

IPC分类号： G02B6/42 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00

摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.

公开(公告)号：US20230083425A1

公开(公告)日：2023-03-16

申请号：US17474277

申请日：2021-09-14

申请人： Jeremy D. Ecton ,  Darko Grujicic ,  Suddhasattwa Nad ,  Benjamin Duong

发明人： Jeremy D. Ecton ,  Darko Grujicic ,  Suddhasattwa Nad ,  Benjamin Duong

IPC分类号： H01L21/48 ,  H01L23/498

摘要： An electronic device comprises an electronic package with a glass core. The glass core includes a first surface and a second surface opposite the first surface, at least one through-glass via (TGV) extending through the glass core from the first surface to the second surface and including an electrically conductive material, and wherein the at least one TGV includes a first portion having a first sidewall and a second portion that includes a second sidewall, wherein the first sidewall includes seed metallization and the second sidewall excludes the seed metallization.