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公开(公告)号：US20130027075A1
公开(公告)日：2013-01-31
申请号：US13192938
申请日：2011-07-28
申请人： Jhih Jie Shao , Tang-Hsuan Chung , Szu-Chia Huang , Huan Chi Tseng , Chien-Chang Lee , Yu-Lan Hsiao
发明人： Jhih Jie Shao , Tang-Hsuan Chung , Szu-Chia Huang , Huan Chi Tseng , Chien-Chang Lee , Yu-Lan Hsiao
IPC分类号： G01R31/26
CPC分类号： G01R31/2889 , G01R31/2601 , G01R31/318511 , G01R31/318558 , G01R31/318572
摘要： The present disclosure provides an apparatus testing a semiconductor device. The apparatus includes a plurality of testing pads. The apparatus includes a plurality of testing units. The apparatus includes a switching circuit coupled between the testing pads and the testing units. The switching circuit contains a plurality of switching devices. The apparatus includes a control circuit coupled to the switching circuit. The control circuit is operable to establish electrical coupling between a selected testing unit and one or more of the testing pads by selectively activating a subset of the switching devices.
摘要翻译： 本公开提供了测试半导体器件的装置。 该装置包括多个测试垫。 该装置包括多个测试单元。 该装置包括耦合在测试焊盘和测试单元之间的开关电路。 开关电路包含多个开关器件。 该装置包括耦合到开关电路的控制电路。 控制电路可操作以通过选择性地激活开关装置的子集来建立所选择的测试单元与一个或多个测试焊盘之间的电耦合。
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公开(公告)号：US09151798B2
公开(公告)日：2015-10-06
申请号：US13192938
申请日：2011-07-28
申请人： Jhih Jie Shao , Tang-Hsuan Chung , Szu-Chia Huang , Huan Chi Tseng , Chien-Chang Lee , Yu-Lan Hsiao
发明人： Jhih Jie Shao , Tang-Hsuan Chung , Szu-Chia Huang , Huan Chi Tseng , Chien-Chang Lee , Yu-Lan Hsiao
IPC分类号： G01R31/26 , G01R31/28 , G01R31/3185
CPC分类号： G01R31/2889 , G01R31/2601 , G01R31/318511 , G01R31/318558 , G01R31/318572
摘要： Provided is an apparatus for testing a semiconductor device. The apparatus includes a plurality of testing pads. The apparatus includes a plurality of testing units. The apparatus includes a switching circuit coupled between the testing pads and the testing units. The switching circuit contains a plurality of switching devices. The apparatus includes a control circuit coupled to the switching circuit. The control circuit is operable to establish electrical coupling between a selected testing unit and one or more of the testing pads by selectively activating a subset of the switching devices.
摘要翻译： 提供了一种用于测试半导体器件的装置。 该装置包括多个测试垫。 该装置包括多个测试单元。 该装置包括耦合在测试焊盘和测试单元之间的开关电路。 开关电路包含多个开关器件。 该装置包括耦合到开关电路的控制电路。 控制电路可操作以通过选择性地激活开关装置的子集来建立所选择的测试单元与一个或多个测试焊盘之间的电耦合。
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公开(公告)号：US20130057306A1
公开(公告)日：2013-03-07
申请号：US13225816
申请日：2011-09-06
CPC分类号： G01R31/3004 , G01R31/025 , G01R31/30
摘要： The present disclosure provides a method for testing a semiconductor device. The method includes providing a test unit and an electronic circuit that is electrically coupled to the test unit. The method includes performing a multi-dimensional sweeping process. The multi-dimensional sweeping process includes sweeping a plurality of different electrical parameters across their respective ranges. The method includes monitoring a performance of the electronic circuit during the multi-dimensional sweeping process. The monitoring includes identifying optimum values of the different electrical parameters that yield a satisfactory performance of the electronic circuit. The method includes testing the test unit using the optimum values of the different electrical parameters.
摘要翻译： 本公开提供了一种用于测试半导体器件的方法。 该方法包括提供测试单元和电耦合到测试单元的电子电路。 该方法包括执行多维扫描处理。 多维扫描过程包括在其各自的范围内扫描多个不同的电参数。 该方法包括在多维扫描过程中监视电子电路的性能。 监测包括识别产生电子电路令人满意的性能的不同电参数的最佳值。 该方法包括使用不同电参数的最佳值测试测试单元。
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公开(公告)号：US09459316B2
公开(公告)日：2016-10-04
申请号：US13225816
申请日：2011-09-06
CPC分类号： G01R31/3004 , G01R31/025 , G01R31/30
摘要： The present disclosure provides a method for testing a semiconductor device. The method includes providing a test unit and an electronic circuit that is electrically coupled to the test unit. The method includes performing a multi-dimensional sweeping process. The multi-dimensional sweeping process includes sweeping a plurality of different electrical parameters across their respective ranges. The method includes monitoring a performance of the electronic circuit during the multi-dimensional sweeping process. The monitoring includes identifying optimum values of the different electrical parameters that yield a satisfactory performance of the electronic circuit. The method includes testing the test unit using the optimum values of the different electrical parameters.
摘要翻译： 本公开提供了一种用于测试半导体器件的方法。 该方法包括提供测试单元和电耦合到测试单元的电子电路。 该方法包括执行多维扫描处理。 多维扫描过程包括在其各自的范围内扫描多个不同的电参数。 该方法包括在多维扫描过程中监视电子电路的性能。 监测包括识别产生电子电路令人满意的性能的不同电参数的最佳值。 该方法包括使用不同电参数的最佳值测试测试单元。
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公开(公告)号：US08531201B2
公开(公告)日：2013-09-10
申请号：US13183962
申请日：2011-07-15
CPC分类号： G01R31/26 , G01R31/2607 , G01R31/275
摘要： The present disclosure provides a method for testing a semiconductor device. The method includes providing a testing unit and an electronic circuit coupled to the testing unit and applying a first electrical signal to the testing unit. The method includes sweeping a second electrical signal across a range of values, the second electrical signal supplying power to the electronic circuit, wherein the sweeping is performed while a value of the first electrical signal remains the same. The method includes measuring a third electrical signal during the sweeping, the measured third electrical signal having a range of values that each correspond to one of the values of the second electrical signal. The method includes adopting an optimum value of the second electrical signal that yields a minimum value of the third electrical signal. The method includes testing the testing unit while the second electrical signal is set to the optimum value.
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公开(公告)号：US20130015877A1
公开(公告)日：2013-01-17
申请号：US13183962
申请日：2011-07-15
IPC分类号： G01R31/26
CPC分类号： G01R31/26 , G01R31/2607 , G01R31/275
摘要： The present disclosure provides a method for testing a semiconductor device. The method includes providing a testing unit and an electronic circuit coupled to the testing unit and applying a first electrical signal to the testing unit. The method includes sweeping a second electrical signal across a range of values, the second electrical signal supplying power to the electronic circuit, wherein the sweeping is performed while a value of the first electrical signal remains the same. The method includes measuring a third electrical signal during the sweeping, the measured third electrical signal having a range of values that each correspond to one of the values of the second electrical signal. The method includes adopting an optimum value of the second electrical signal that yields a minimum value of the third electrical signal. The method includes testing the testing unit while the second electrical signal is set to the optimum value.
摘要翻译： 本公开提供了一种用于测试半导体器件的方法。 该方法包括提供耦合到测试单元的测试单元和电子电路，并向测试单元施加第一电信号。 该方法包括跨越一定范围的值扫描第二电信号，第二电信号向电子电路供电，其中在第一电信号的值保持相同时进行扫描。 该方法包括在扫描期间测量第三电信号，所测量的第三电信号具有各自对应于第二电信号中的一个值的值的范围。 该方法包括采用产生第三电信号的最小值的第二电信号的最佳值。 该方法包括测试单元，而第二电信号被设置为最佳值。
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