公开(公告)号：US07213637B2

公开(公告)日：2007-05-08

申请号：US10950083

申请日：2004-09-24

Applicant: Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Jhy-Chain Lin ,  Ga-Lane Chen

IPC: F28D15/00 ,  H05K7/20

CPC classification number: B82Y30/00 ,  C09K5/10 ,  F28D15/0233 ,  F28D15/046

Abstract: A heat pipe (20) includes a pipe (21), a wick (22), and an operating fluid. The wick is a capillary structure including a carbon nanotube layer, and is fixed to an inside wall of the pipe. The operating fluid is sealed in the pipe and soaks into the wick. The operating fluid includes a pure liquid, and a plurality of nanometer-scale particles uniformly suspended in the pure liquid. The nanometer-scale particles can be carbon nanocapsules (30) or particles of a metal (32) with high thermal conductivity. Each carbon nanocapsule can further have a metal with high thermal conductivity filled therein. The carbon nanotube layer contains carbon nanotubes of small size and high thermal conductivity, therefore the capillary performance of the wick is good. Further, because the operating fluid includes nanometer-scale particles with high thermal conductivity, this ensures that the operating fluid has high thermal conductivity.

Abstract translation: 热管（20）包括管（21），芯（22）和工作流体。 芯是包括碳纳米管层的毛细结构，并且被固定到管的内壁。 工作流体被密封在管道中并浸泡到芯中。 工作流体包括纯液体和均匀悬浮在纯液体中的多个纳米级颗粒。 纳米级颗粒可以是具有高导热性的碳纳米胶囊（30）或金属（32）的颗粒。 每个碳纳米胶囊还可以具有填充有高导热性的金属。 碳纳米管层含有尺寸小，导热性高的碳纳米管，因此芯的毛细管性能良好。 此外，由于工作流体包括具有高导热性的纳米级颗粒，因此确保了工作流体具有高导热性。

公开(公告)号：US20070051497A1

公开(公告)日：2007-03-08

申请号：US11175772

申请日：2005-07-06

Applicant: Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Jhy-Chain Lin ,  Ga-Lane Chen

IPC: F28F27/02

CPC classification number: F28D20/0056 ,  H01L23/3733 ,  H01L23/38 ,  H01L2924/0002 ,  Y02E60/142 ,  Y10S165/042 ,  Y10S165/907 ,  Y10S165/909 ,  Y10T428/21 ,  Y10T428/249961 ,  Y10T428/24997 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A heat collector (10, 20) includes a heat absorption surface (12, 22), an opposite heat focus surface (11, 21) and one or more surrounding sides (13, 23). A matrix (24) of the heat collector is a thermally conductive material. There is an adiabatic dope (25) mixed within the matrix. A relative concentration distribution of the adiabatic dope increases from the heat absorption surface to the heat focus surface, and decreases from the surrounding sides to a center of the heat collector. The shape of the heat collector can be rectangular, cylindrical, prismatic, plate-shaped, square, or polyhedral. The heat collector can draw heat generated from electrical components, and collect the generated heat for reuse in order to enhance energy efficiency.

Abstract translation: 集热器（10,20）包括热吸收表面（12,22），相对的热焦面（11,21）和一个或多个周围侧面（13,23）。 集热器的基体（24）是导热材料。 在矩阵内混合绝热涂料（25）。 绝热涂料的相对浓度分布从热吸收表面增加到热聚焦表面，并且从周围侧减少到集热器的中心。 集热器的形状可以是矩形，圆柱形，棱柱形，板状，正方形或多面体。 集热器可以吸收从电气部件产生的热量，并收集所产生的热量以便再利用，以提高能量效率。

公开(公告)号：US07387423B2

公开(公告)日：2008-06-17

申请号：US11023013

申请日：2004-12-23

Applicant: Charles Leu ,  Ching-Yen Lee ,  Ga-Lane Chen ,  Tai-Cherng Yu ,  Jhy-Chain Lin

Inventor： Charles Leu ,  Ching-Yen Lee ,  Ga-Lane Chen ,  Tai-Cherng Yu ,  Jhy-Chain Lin

IPC: F21V8/00 ,  C09K19/52

CPC classification number: G02B6/0023

Abstract: A backlight system has a light guide plate. The light guide plate includes a transparent plate having a light incidence surface and an opposite light emitting surface, and a light transmittance enhancement layer. The light transmittance enhancement layer is provided on either or both of the light emitting surface and the light incidence surface, and is made of silicon dioxide or magnesium fluoride. The thickness of the light transmittance enhancement layer is in the range from 58˜69 nanometers.

Abstract translation: 背光系统具有导光板。 导光板包括具有光入射表面和相对发光表面的透明板和透光增强层。 光透射增强层设置在光发射表面和光入射表面中的一个或两个上，并且由二氧化硅或氟化镁制成。 透光率增强层的厚度在58〜69纳米的范围内。

公开(公告)号：US07254019B2

公开(公告)日：2007-08-07

申请号：US11283285

申请日：2005-11-17

Applicant: Charles Leu ,  Tai-Cherng Yu ,  Ga-Lane Chen ,  Jhy-Chain Lin

Inventor： Charles Leu ,  Tai-Cherng Yu ,  Ga-Lane Chen ,  Jhy-Chain Lin

IPC: H05K7/20

CPC classification number: G06F1/203

Abstract: A heat dissipation module for a mobile computer, the mobile computer having a base (10) and a display unit (20) pivotally coupled to the base, the base having a number of through holes (13) defined on a shell (18) thereof, the heat dissipation module including: a cooling fan (14) disposed near the through holes of the shell; and a heat pipe (15) having a evaporating section (52), a condensing section (56), and an intermediate section (54) connecting the evaporating section and the condensing section; wherein the evaporating section of the heat pipe is disposed between the shell and the cooling fan, and the condensing section of the heat pipe is disposed on the display unit of the mobile computer.

Abstract translation: 一种用于移动计算机的散热模块，所述移动计算机具有基座（10）和可枢转地联接到所述基座的显示单元（20），所述基座具有限定在其壳体（18）上的多个通孔（13） 所述散热模块包括：设置在所述壳体的通孔附近的冷却风扇（14）; 和具有蒸发部（52）的热管（15），冷凝部（56）以及连接蒸发部和冷凝部的中间部（54）。 其特征在于，所述热管的蒸发部配置在所述壳体与所述冷却风扇之间，所述热管的冷凝部配置在所述移动式计算机的显示部。

公开(公告)号：US20060107987A1

公开(公告)日：2006-05-25

申请号：US11242394

申请日：2005-10-03

Applicant: Ga-Lane Chen ,  Jhy-Chain Lin ,  Charles Leu

Inventor： Ga-Lane Chen ,  Jhy-Chain Lin ,  Charles Leu

IPC: H01L35/30

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A computer includes a motherboard, a heat-generating device mounted on the motherboard, a heat-conducting device attached to the heat-generating device for absorbing heat energy generated from the heat-generating device, and a thermoelectric converter coupled to the heat-dissipating device for converting the heat energy into electric energy for recycling use. The heat-conducting device includes a heatpipe. The heatpipe contains a working fluid, which has nano-sized particles therein. The nano-sized particles may be composed of carbon and/or a metallic material. The computer may include a heat-conducting plate interposed between the heatpipe and the heat-generating device. The thermoelectric converter may include a circuit with two strips connected in series, the strips each being formed of a different kind of thermoelectric metal. Corresponding ends of the two strips would be coupled to the heat-conducting device so as to receive heat energy therefrom.

Abstract translation: 计算机包括主板，安装在母板上的发热装置，附接到发热装置的用于吸收从发热装置产生的热能的导热装置，以及耦合到散热装置的热电转换器 用于将热能转换成电能再循环使用的装置。 导热装置包括热管。 热管中含有纳米尺寸颗粒的工作流体。 纳米尺寸的颗粒可以由碳和/或金属材料构成。 计算机可以包括插入在热管和发热装置之间的导热板。 热电转换器可以包括具有串联连接的两个条的电路，每个条都由不同种类的热电金属形成。 两个条带的相应端部将被耦合到导热装置以便从其接收热能。

公开(公告)号：US20060033203A1

公开(公告)日：2006-02-16

申请号：US11044953

申请日：2005-01-27

Applicant: Charles Leu ,  Tai-Cherng Yu ,  Chuan-De Huang ,  Wen-Jeng Huang ,  Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Charles Leu ,  Tai-Cherng Yu ,  Chuan-De Huang ,  Wen-Jeng Huang ,  Jhy-Chain Lin ,  Ga-Lane Chen

IPC: H01L21/50 ,  H01L23/34

CPC classification number: B82Y10/00 ,  H01L23/373 ,  H01L2224/32225 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152

Abstract: An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and includes an inner face. The array of carbon nanotubes is formed on the inner face of the integrated heat spreader. Top and bottom ends of the carbon nanotubes perpendicularly contact the integrated heat spreader and the die respectively. Each carbon nanotube can be capsulated in a nanometer-scale metal having a high heat conduction coefficient.

Abstract translation: 集成电路封装包括安装在基板上的管芯，位于管芯上方的集成散热器，以及安装在管芯和集成散热器之间的碳纳米管阵列。 集成散热器固定在基板上，并且包括内表面。 碳纳米管阵列形成在集成散热器的内表面上。 碳纳米管的顶端和底端分别与集成散热器和模具垂直接触。 每个碳纳米管可以被封装在具有高导热系数的纳米级金属中。

公开(公告)号：US20050133491A1

公开(公告)日：2005-06-23

申请号：US10951422

申请日：2004-09-28

Applicant: Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Jhy-Chain Lin ,  Ga-Lane Chen

IPC: F27B17/02 ,  F27D11/00 ,  F27D19/00 ,  F27D21/00 ,  G01N25/18 ,  H01L23/34

CPC classification number: F27B17/02 ,  F27D19/00 ,  F27D21/0014 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat generator includes a cubic heat generating member for outputing heat flow. The heat generating member includes a heat flow output face and five heat flow insulation faces. Five thermoelectric coolers are attached on the five heat flow insulation faces respectively. A heat flow compensating circuit is electrically connected between each heat flow insulation face and a corresponding thermoelectric cooler. The circuit is capable of controlling heat generated by the thermoelectric cooler to cause the temperature of the heating face of the thermoelectric cooler to be equal to the temperature of the heat flow insulation face which results in the heat energy of the heat flow outputing from the heat flow output face of the heat generating member substantially equal to the heat energy of the heat generated by the heat generating member.

Abstract translation: 发热体包括用于输出热流的立方体发热体。 发热件包括热流输出面和五个热流绝缘面。 五个热电冷却器分别连接在五个热流绝缘面上。 热流补偿电路电连接在每个热流绝缘面和相应的热电冷却器之间。 该电路能够控制由热电冷却器产生的热量，使得热电冷却器的加热面的温度等于热流绝缘面的温度，导致从热量输出的热流的热能 发热构件的流量输出面基本上等于由发热构件产生的热量的热能。

公开(公告)号：US08071194B2

公开(公告)日：2011-12-06

申请号：US12354105

申请日：2009-01-15

Applicant: Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Jhy-Chain Lin ,  Ga-Lane Chen

IPC: B32B3/02 ,  B32B5/14

CPC classification number: F28D20/0056 ,  H01L23/3733 ,  H01L23/38 ,  H01L2924/0002 ,  Y02E60/142 ,  Y10S165/042 ,  Y10S165/907 ,  Y10S165/909 ,  Y10T428/21 ,  Y10T428/249961 ,  Y10T428/24997 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A heat collector includes a heat absorption surface, an opposite heat focus surface and one or more surrounding sides. A matrix of the heat collector is a thermally conductive material. There is a plurality of adiabatic pores mixed within the matrix. A relative concentration distribution of the adiabatic pores increases from the heat absorption surface to the heat focus surface, and decreases from the surrounding sides to a center of the heat collector. The shape of the heat collector can be rectangular, cylindrical, prismatic, plate-shaped, square, or polyhedral. The heat collector can draw heat generated from electrical components, and collect the generated heat for reuse in order to enhance energy efficiency.

Abstract translation: 集热器包括吸热表面，相对的热焦面和一个或多个周围的侧面。 集热器的基体是导热材料。 在基质内混合有多个绝热孔。 绝热孔的相对浓度分布从热吸收表面增加到热聚焦表面，并且从周围侧减少到集热器的中心。 集热器的形状可以是矩形，圆柱形，棱柱形，板状，正方形或多面体。 集热器可以吸收从电气部件产生的热量，并收集所产生的热量以便再利用，以提高能量效率。

公开(公告)号：US07301232B2

公开(公告)日：2007-11-27

申请号：US11044953

申请日：2005-01-27

Applicant: Charles Leu ,  Tai-Cherng Yu ,  Chuan-De Huang ,  Wen-Jeng Huang ,  Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Charles Leu ,  Tai-Cherng Yu ,  Chuan-De Huang ,  Wen-Jeng Huang ,  Jhy-Chain Lin ,  Ga-Lane Chen

IPC: H01L23/34 ,  H01L23/373 ,  H01L23/367 ,  H01L21/02 ,  B29C47/00

CPC classification number: B82Y10/00 ,  H01L23/373 ,  H01L2224/32225 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152

Abstract: An integrated circuit package includes a die mounted on a substrate, an integrated heat spreader set above the die, and an array of carbon nanotubes mounted between the die and the integrated heat spreader. The integrated heat spreader is fixed on the substrate, and includes an inner face. The array of carbon nanotubes is formed on the inner face of the integrated heat spreader. Top and bottom ends of the carbon nanotubes perpendicularly contact the integrated heat spreader and the die respectively. Each carbon nanotube can be capsulated in a nanometer-scale metal having a high heat conduction coefficient.

Abstract translation: 集成电路封装包括安装在基板上的管芯，位于管芯上方的集成散热器，以及安装在管芯和集成散热器之间的碳纳米管阵列。 集成散热器固定在基板上，并且包括内表面。 碳纳米管阵列形成在集成散热器的内表面上。 碳纳米管的顶端和底端分别与集成散热器和模具垂直接触。 每个碳纳米管可以被封装在具有高导热系数的纳米级金属中。

公开(公告)号：US20050271883A1

公开(公告)日：2005-12-08

申请号：US11046954

申请日：2005-01-31

Applicant: Charles Leu ,  Ching-Yen Lee ,  Tai-Cheng Yu ,  Jhy-Chain Lin ,  Ga-Lane Chen

Inventor： Charles Leu ,  Ching-Yen Lee ,  Tai-Cheng Yu ,  Jhy-Chain Lin ,  Ga-Lane Chen

IPC: B05D5/06 ,  B32B9/00 ,  B32B27/40 ,  G02B1/04 ,  G02B1/10 ,  G02F1/1333

CPC classification number: G02B1/10 ,  Y10T428/265 ,  Y10T428/31573

Abstract: A light-transmitting element (10) includes a substrate (12) made of polymethyl methacrylate, and at least one coating film (14). The substrate has a first surface (122), and a second surface (124) opposite to the first surface. The coating film is deposited on at least one of the surfaces of the substrate by electron beam evaporation. The coating film is selected from the group consisting of a single layer and a plurality of layers, and comprises a material selected from the group consisting of tantalum pentoxide, magnesium fluoride, silicon oxide, and any mixture or combination thereof. The light-transmitting element provides improved light transmittance for an imaging system. A method for making the light-transmitting element is also provided.

Abstract translation: 透光元件（10）包括由聚甲基丙烯酸甲酯制成的基底（12）和至少一个涂膜（14）。 衬底具有第一表面（122）和与第一表面相对的第二表面（124）。 通过电子束蒸发将涂膜沉积在基板的至少一个表面上。 涂膜选自单层和多层，并且包括选自五氧化二钽，氟化镁，氧化硅及其任何混合物或组合的材料。 透光元件为成像系统提供改善的透光率。 还提供了制造透光元件的方法。