Cooling fan and shroud with modified profiles
    1.
    发明授权
    Cooling fan and shroud with modified profiles 失效
    冷却风扇和护罩与修改的型材

    公开(公告)号:US07377751B2

    公开(公告)日:2008-05-27

    申请号:US11184195

    申请日:2005-07-19

    IPC分类号: F04D19/00

    摘要: A cooling system includes a cooling fan with an outlet and an inlet and a shroud surrounding at least a portion of the cooling fan. The cooling fan includes a plurality of fan blades, and each fan blade includes an inlet portion and an outlet portion that define an outer periphery of the fan blade. The outlet portion has a profile defined by a radial distance, perpendicular from a central axis of the fan, increasing in a direction towards the outlet. The average angle, relative to a central axis of the fan, of either a profile of the outlet portion or a profile of a portion of the shroud surrounding the outlet portion is between about ±15° of an average angle to the central axis at which a flow of fluid exits the outer periphery of the fan blades or between about 20° and about 70°.

    摘要翻译: 冷却系统包括具有出口的冷却风扇和围绕冷却风扇的至少一部分的入口和护罩。 冷却风扇包括多个风扇叶片,并且每个风扇叶片包括限定风扇叶片外周的入口部分和出口部分。 出口部分具有由与风扇的中心轴垂直的径向距离限定的轮廓,在朝向出口的方向上增加。 相对于风扇的中心轴线,出口部分的轮廓或围绕出口部分的护罩的轮廓的轮廓的平均角度在与中心轴线的平均角度的约±15°之间,在该平均角度处 流体流动离开风扇叶片的外周边缘或者在大约20°和大约70°之间。

    Interposable heat sink for adjacent memory modules
    2.
    发明授权
    Interposable heat sink for adjacent memory modules 有权
    相邻内存模块的可插入散热片

    公开(公告)号:US07339793B2

    公开(公告)日:2008-03-04

    申请号:US11748020

    申请日:2007-05-14

    IPC分类号: H05K7/20

    摘要: A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

    摘要翻译: 用于常规存储器模块(例如DIMM)的散热装置,其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离,使得当放置在相邻的存储器模块之间时,弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物,用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时,单个散热器件便于从两个相邻的存储器模块散热。

    Controlling airflow in a computer chassis
    9.
    发明授权
    Controlling airflow in a computer chassis 有权
    控制计算机机箱中的气流

    公开(公告)号:US07595986B2

    公开(公告)日:2009-09-29

    申请号:US11936104

    申请日:2007-11-07

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20727 G06F1/20

    摘要: Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

    摘要翻译: 配置用于受控气流的计算机机箱,包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分,从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕,包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件,用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流,包括将组件板插入计算机机箱; 移位分段帘幕的一段,从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

    HEAT SINK WITH HEAT BUS AND FIN STRUCTURE
    10.
    发明申请
    HEAT SINK WITH HEAT BUS AND FIN STRUCTURE 审中-公开
    散热与散热和熔体结构

    公开(公告)号:US20130133859A1

    公开(公告)日:2013-05-30

    申请号:US13307562

    申请日:2011-11-30

    IPC分类号: F28F13/00 F28F7/00

    摘要: A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.

    摘要翻译: 散热器,用于从机箱内的处理器移除热量,使空气流过散热片上的翅片结构。 散热器的实施例包括接合处理器的热母线,以将热量从处理器传导到具有相互连接的重复蜂窝空气通道的翅片结构。 U形热母线包括底座以及从翅片结构的相对侧延伸的第一和第二腿部。 热量总线的一个实施例具有固体导电芯,以将热量从处理器传导通过基座,第一和第二支腿传导到翅片结构的侧面。 或者,热量总线的一个实施例具有一个中空的芯,该中空芯含有一种流体,用于将来自处理器的热量从底部以及第一和第二支腿蒸发地传递到翅片结构的侧面。