HEAT SINK WITH HEAT BUS AND FIN STRUCTURE
    1.
    发明申请
    HEAT SINK WITH HEAT BUS AND FIN STRUCTURE 审中-公开
    散热与散热和熔体结构

    公开(公告)号:US20130133859A1

    公开(公告)日:2013-05-30

    申请号:US13307562

    申请日:2011-11-30

    IPC分类号: F28F13/00 F28F7/00

    摘要: A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.

    摘要翻译: 散热器,用于从机箱内的处理器移除热量,使空气流过散热片上的翅片结构。 散热器的实施例包括接合处理器的热母线,以将热量从处理器传导到具有相互连接的重复蜂窝空气通道的翅片结构。 U形热母线包括底座以及从翅片结构的相对侧延伸的第一和第二腿部。 热量总线的一个实施例具有固体导电芯,以将热量从处理器传导通过基座,第一和第二支腿传导到翅片结构的侧面。 或者,热量总线的一个实施例具有一个中空的芯,该中空芯含有一种流体,用于将来自处理器的热量从底部以及第一和第二支腿蒸发地传递到翅片结构的侧面。

    Controlling airflow in a computer chassis
    2.
    发明授权
    Controlling airflow in a computer chassis 有权
    控制计算机机箱中的气流

    公开(公告)号:US07595986B2

    公开(公告)日:2009-09-29

    申请号:US11936104

    申请日:2007-11-07

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20727 G06F1/20

    摘要: Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

    摘要翻译: 配置用于受控气流的计算机机箱,包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分,从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕,包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件,用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流,包括将组件板插入计算机机箱; 移位分段帘幕的一段,从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

    Controlling the speed of cooling fans for multiple computer systems based on altitude/fluid density measurements from a centralized sensor
    3.
    发明授权
    Controlling the speed of cooling fans for multiple computer systems based on altitude/fluid density measurements from a centralized sensor 有权
    根据集中传感器的高度/流体密度测量,控制多台计算机系统的冷却风扇的速度

    公开(公告)号:US07538509B1

    公开(公告)日:2009-05-26

    申请号:US12192983

    申请日:2008-08-15

    IPC分类号: H02P5/68

    摘要: The present invention can include an automated method controlling the fan speed of computer system cooling fans with altitude and/or fluid density data from a centralized sensor. Such a method can utilize a centralized sensor to determine the altitude/fluid density within an enclosed area. The centralized sensor can be positioned so as to be unaffected by extraneous activities within the enclosed area. The determined altitude/fluid density can be conveyed to a computer system containing one or more cooling fans. The computer system can be located within the enclosed area. Then, the computer system can determine the need for adjusting the speed of the cooling fans based on the altitude/fluid density. When the need for adjustment exists, the speed of the cooling fans can be adjusted in accordance with the altitude/fluid density.

    摘要翻译: 本发明可以包括一种自动化方法,其控制来自集中式传感器的高度和/或流体密度数据的计算机系统冷却风扇的风扇速度。 这种方法可以利用集中传感器来确定封闭区域内的高度/流体密度。 集中传感器可以定位成不受封闭区域内的外部活动的影响。 确定的高度/流体密度可被传送到包含一个或多个冷却风扇的计算机系统。 计算机系统可以位于封闭区域内。 然后,计算机系统可以根据高度/流体密度确定调整冷却风扇速度的需要。 当需要调整时,可以根据高度/流体密度来调节冷却风扇的速度。

    Controlling Airflow In A Computer Chassis
    4.
    发明申请
    Controlling Airflow In A Computer Chassis 有权
    控制计算机机箱中的气流

    公开(公告)号:US20090116190A1

    公开(公告)日:2009-05-07

    申请号:US11936104

    申请日:2007-11-07

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20727 G06F1/20

    摘要: Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

    摘要翻译: 配置用于受控气流的计算机机箱,包括至少一个组件板; 分段幕帘悬挂在组件板上方的计算机机箱中的气流区域; 以及安装在所述部件板上的至少一个部件移动所述分段幕的至少一个部分,从而在所述移位部分下面形成气流通道。 用于控制计算机机箱中的气流的分段帘幕,包括能够被安装在计算机机箱中的部件板上的部件移位的一个或多个部分; 以及一个或多个紧固件,用于将分段的帘幕悬挂在计算机机箱中的气流区域中。 控制计算机机箱中的气流,包括将组件板插入计算机机箱; 移位分段帘幕的一段,从而形成气流通道; 并且通过由分段帘幕的段的位移产生的气流通道提供气流。

    Heat sink with orientable fins
    5.
    发明授权
    Heat sink with orientable fins 有权
    带定向翅片的散热片

    公开(公告)号:US09507391B2

    公开(公告)日:2016-11-29

    申请号:US13305177

    申请日:2011-11-28

    IPC分类号: G06F1/20 H01L23/34 H01L23/467

    摘要: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

    摘要翻译: 散热器包括多个翅片,其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变,这表现为散热器或发热元件的温度升高。

    HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION
    6.
    发明申请
    HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION 审中-公开
    散热片结构阻塞电磁辐射

    公开(公告)号:US20130145612A1

    公开(公告)日:2013-06-13

    申请号:US13323811

    申请日:2011-12-12

    IPC分类号: G06F1/20 H01P1/22 H05K7/20

    摘要: A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.

    摘要翻译: 用于从计算机机箱内的发热电子部件移除热量并且在形成所述底盘容纳结构的一部分的边框中容纳穿过高通风口的电磁辐射的系统包括散热片,所述散热片具有翅片结构,所述散热片结构具有入口 面,出口面和相互连通的空气通道,底座,以接合部件并将热量从部件转移到散热片结构,其中散热片结构的入口面靠近通风口设置,以阻挡电磁辐射穿过通风口 。 在一个实施例中,热管或扩张杆将热量从接合远离边框的组件的基座移动到具有靠近通风口的进气面的翅片结构。

    HEAT SINK WITH ORIENTABLE FINS
    7.
    发明申请
    HEAT SINK WITH ORIENTABLE FINS 有权
    加热与定向FINS

    公开(公告)号:US20130138262A1

    公开(公告)日:2013-05-30

    申请号:US13305177

    申请日:2011-11-28

    IPC分类号: G05D23/19 G06F1/20 H05K7/20

    摘要: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

    摘要翻译: 散热器包括多个翅片,其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变,这表现为散热器或发热元件的温度升高。

    Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array
    8.
    发明授权
    Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array 有权
    使用非平面离子发射器阵列穿过散热器的电流动力气流

    公开(公告)号:US08807204B2

    公开(公告)日:2014-08-19

    申请号:US12872107

    申请日:2010-08-31

    摘要: A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

    摘要翻译: 用于冷却发热装置的系统包括形成电动力(EHD)空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中,使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势,以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。

    Electrostatic control of air flow to the inlet opening of an axial fan
    9.
    发明授权
    Electrostatic control of air flow to the inlet opening of an axial fan 有权
    静电控制空气流向轴流风扇的入口

    公开(公告)号:US08444754B2

    公开(公告)日:2013-05-21

    申请号:US12855737

    申请日:2010-08-13

    IPC分类号: B03C3/36 B03C3/41 B03C3/49

    摘要: An air moving apparatus includes an axial fan and an electrostatic device. The axial fan has a rotatable shaft defining a central axis of the axial fan, a plurality of blades secured to the shaft, and an air inlet opening. The electrostatic device is disposed immediately upstream of the air inlet opening of the axial fan, and includes a collector and an emitter. In one embodiment, the electrostatic device includes a cylindrical collector coupled to ground and has a central axis aligned with the central axis of the axial fan. The electrostatic device further includes a plurality of emitter wires coupled to a terminal of a direct current source and extending lengthwise within the cylindrical collector. During operation of the axial fan, the application of an electrical potential between an emitter and a collector causes ionic air movement radially outwardly away from a central axis of the axial fan.

    摘要翻译: 空气移动装置包括轴流风扇和静电装置。 轴流风扇具有限定轴流风扇的中心轴线的可旋转轴,固定在轴上的多个叶片和空气入口。 静电装置设置在轴流风扇的空气入口的紧挨上游,并且包括收集器和发射器。 在一个实施例中,静电装置包括耦合到地面并具有与轴流风扇的中心轴线对准的中心轴线的圆柱形收集器。 静电装置还包括耦合到直流源的端子并且在圆柱形收集器内纵向延伸的多个发射极线。 在轴流风扇的运行期间,在发射器和集电器之间施加电势使离子空气径向向外远离轴流风扇的中心轴。

    Independently operable ionic air moving devices for zonal control of air flow through a chassis
    10.
    发明授权
    Independently operable ionic air moving devices for zonal control of air flow through a chassis 有权
    独立可操作的离子空气移动装置用于通过底盘进行气流的区域控制

    公开(公告)号:US08139354B2

    公开(公告)日:2012-03-20

    申请号:US12788532

    申请日:2010-05-27

    IPC分类号: H05K7/20 A63F13/06

    CPC分类号: G06F1/206 F24F2003/1682

    摘要: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

    摘要翻译: 可以增强或减少计算机机箱中的气流,以影响使用离子空气移动装置的发热装置的冷却。 多个离子空气移动装置在由非离子空气移动装置建立的气流方向上增强或减少通过计算机机架的多个流体平行气流区域的气流。 每个离子空气移动装置包括离开集电极间隔距离的离子发射电极,其中控制器独立地控制每个离子空气移动装置的发射极和集电极之间的电位,以影响通过一个或多个 多个气流区域。