Abstract:
The present invention provides an automatic control device of foldable tent connecting to several roof strut sets consisting of several segments serially connected in radial; wherein, said control device is typically comprised of a central standing base containing a sliding hub, a spring and a tappet roller at inside; said tappet roller is fit in the inside of the sliding hub, and is touched against with one end of said spring axially, another end of said spring is touched against the top inside surface of said central standing base; said sliding hub is connected to connectors in radial respectively and pivotally; said connectors are respectively pivoted on the rim of said central standing base at the middle points, another ends of said connectors are individually connected to the roof strut sets; on the other hand, there are several locking pins built upon the inside of the central standing base for engaging with said tappet roller, coordinating to those said tappet roller has proper number of beveled surfaces for the locking pins pushing to roll, and proper number of catching slots for locking up the locking pins. Cooperating to an extra force exerting on the central standing base to press it down relative to the roof strut sets, the sliding hub brings the tappet roller continuously to go down and up, by means of the special design between the spring and all the pushing lugs and hook slots of the tappet roller, positioning the sliding hub with the locking pin of the central standing base can be carried out, so that the tent can be opened and kept in open configuration automatically; when repeatedly press down the central standing base relative to the roof strut sets, the tent can be closed.
Abstract:
A semiconductor package may include a substrate with a first surface over which bond fingers are formed. At least two semiconductor chips may be stacked on the first surface of the substrate and each chip may have via holes. The semiconductor chips may be stacked such that the respective via holes expose the respective bond fingers of the substrate. Through electrodes may be formed in the via holes. The through electrodes may comprise carbon nanotubes grown from the exposed bond fingers of the substrate, where the through electrodes may be electrically connected with the semiconductor chips.