公开(公告)号：US06650022B1

公开(公告)日：2003-11-18

申请号：US10241017

申请日：2002-09-11

申请人： Jing Qi ,  Janice Danvir ,  Zhaojin Han ,  Prasanna Kulkarni ,  Nadia Yala ,  Robert Doot

发明人： Jing Qi ,  Janice Danvir ,  Zhaojin Han ,  Prasanna Kulkarni ,  Nadia Yala ,  Robert Doot

IPC分类号： H01L3300

CPC分类号： H01L22/24 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2203/161 ,  H01L2924/00

摘要： A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.

摘要翻译： 凸起的半导体器件（10）在机器视觉系统中被照亮时表现出增强的图案识别。 半导体器件在一个面上具有基本上共面的焊料凸块阵列（16）和底部填充材料（17）的涂层。 包含图像增强剂的助熔剂组合物（18）被选择性地沉积在阵列中的至少两个焊料凸块上，以改变焊料凸块的光学特性，以使得焊料凸块相对于底部填充材料的背景而显得明亮， 半导体器件被选择的波长的光照射（19）。