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    RADIO FREQUENCY IDENTIFICATION TAG AND DIAPER, ABSORBER AND SENSING SYSTEM USING THE SAME
    1.
    发明申请
    RADIO FREQUENCY IDENTIFICATION TAG AND DIAPER, ABSORBER AND SENSING SYSTEM USING THE SAME 有权
    无线电频率识别标签和DIAPER，吸收和感应系统

    公开(公告)号：US20130123726A1

    公开(公告)日：2013-05-16

    申请号：US13524192

    申请日：2012-06-15

    申请人： Jiun-Jang Yu ,  Chiung-Hsiung Chen ,  Chun-An Lu ,  Hong-Ching Lin

    发明人： Jiun-Jang Yu ,  Chiung-Hsiung Chen ,  Chun-An Lu ,  Hong-Ching Lin

    IPC分类号： A61F13/42 ,  G06K19/077

    CPC分类号： H01Q1/2225 ,  H01Q1/273 ,  H01Q9/285

    摘要： A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.

    摘要翻译： 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。

    Radio frequency identification tag and diaper, absorber and sensing system using the same
    2.
    发明授权
    Radio frequency identification tag and diaper, absorber and sensing system using the same 有权
    射频识别标签和尿布，吸收器和感应系统使用相同

    公开(公告)号：US09160054B2

    公开(公告)日：2015-10-13

    申请号：US13524192

    申请日：2012-06-15

    申请人： Jiun-Jang Yu ,  Chiung-Hsiung Chen ,  Chun-An Lu ,  Hong-Ching Lin

    发明人： Jiun-Jang Yu ,  Chiung-Hsiung Chen ,  Chun-An Lu ,  Hong-Ching Lin

    IPC分类号： A61F13/15 ,  A61F13/20 ,  H01Q1/22 ,  H01Q1/27 ,  H01Q9/28

    CPC分类号： H01Q1/2225 ,  H01Q1/273 ,  H01Q9/285

    摘要： A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.

    摘要翻译： 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。

    Method for forming nanometer scale dot-shaped materials
    3.
    发明授权
    Method for forming nanometer scale dot-shaped materials 有权
    形成纳米级点状材料的方法

    公开(公告)号：US08911821B2

    公开(公告)日：2014-12-16

    申请号：US12563419

    申请日：2009-09-21

    申请人： Chun-An Lu ,  Hong-Ching Lin ,  Kuo-Chan Chiou ,  Szu-Po Huang

    发明人： Chun-An Lu ,  Hong-Ching Lin ,  Kuo-Chan Chiou ,  Szu-Po Huang

    IPC分类号： B05D5/12 ,  B22F9/30 ,  B22F1/02 ,  C01G1/02 ,  C09D11/52

    CPC分类号： B22F9/30 ,  B22F1/025 ,  B22F2998/00 ,  C01G1/02 ,  C01P2002/72 ,  C01P2006/40 ,  C09D11/52 ,  B22F2301/10 ,  B22F2301/052 ,  B22F2301/15 ,  B22F2301/25 ,  B22F2301/205 ,  B22F2301/30 ,  B22F2301/35

    摘要： A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.

    摘要翻译： 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。

    ELECTRICALLY CONDUCTIVE COMPOSITION AND FABRICATION METHOD THEREOF
    4.
    发明申请
    ELECTRICALLY CONDUCTIVE COMPOSITION AND FABRICATION METHOD THEREOF 有权
    电导电组合物及其制造方法

    公开(公告)号：US20110101283A1

    公开(公告)日：2011-05-05

    申请号：US12813749

    申请日：2010-06-11

    申请人： Chun-An Lu ,  Hong-Ching Lin

    发明人： Chun-An Lu ,  Hong-Ching Lin

    IPC分类号： H01B1/02 ,  H01B1/00 ,  H01B1/12 ,  B05D5/12 ,  H01B1/04 ,  B05D3/06

    CPC分类号： H01B1/22 ,  C08K9/04 ,  C09D5/24 ,  C09D7/62 ,  C09D7/70 ,  C09D11/52 ,  H01B1/24

    摘要： An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.

    摘要翻译： 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3＆OHgr·cm的导电组合物。

    Electrically conductive composition and fabrication method thereof
    5.
    发明授权
    Electrically conductive composition and fabrication method thereof 有权
    导电组合物及其制造方法

    公开(公告)号：US08465677B2

    公开(公告)日：2013-06-18

    申请号：US12813749

    申请日：2010-06-11

    申请人： Chun-An Lu ,  Hong-Ching Lin

    发明人： Chun-An Lu ,  Hong-Ching Lin

    IPC分类号： H01B1/00 ,  H01B1/02 ,  H01B1/12 ,  H01B1/22 ,  B05D5/12

    CPC分类号： H01B1/22 ,  C08K9/04 ,  C09D5/24 ,  C09D7/62 ,  C09D7/70 ,  C09D11/52 ,  H01B1/24

    摘要： An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.

    摘要翻译： 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3Omega·cm的导电组合物。