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公开(公告)号：US08155366B2
公开(公告)日：2012-04-10
申请号：US12456188
申请日：2009-06-12
申请人： John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
发明人： John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
CPC分类号： H04R1/083
摘要： A surface mountable package for use with an audio transducer is provided. In addition to the audio transducer, the surface mountable package includes a substrate, a cover, and a transducer support frame mounted within, and attached to, the substrate and cover. The support frame includes one or more cavities that, in combination with the audio transducer, substrate and cover, define the front and rear acoustic cavity volumes.
摘要翻译： 提供了一种与音频传感器一起使用的可表面安装的封装。 除了音频换能器之外，可表面安装的封装还包括安装在衬底和盖子内并连接到衬底和盖子上的衬底，盖子和换能器支撑框架。 支撑框架包括一个或多个空腔，其与音频换能器组合，衬底和盖子限定前腔和后声腔体积。
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2.发明授权Method for fabricating a transducer package with the transducer die unsupported by a substrate 有权用于制造具有不受衬底支撑的换能器管芯的换能器封装的方法公开(公告)号：US07790492B1
公开(公告)日：2010-09-07
申请号：US12583364
申请日：2009-08-18
申请人： John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
发明人： John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
CPC分类号： H01L24/97 , B81B2201/0257 , B81B2201/0271 , B81C1/0023 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/16152 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099
摘要： A transducer package fabrication process is provided, the completed transducer package achieving a thin package profile. The fabrication process utilizes an encapsulation material to eliminate the need for a transducer support substrate, the encapsulation material isolating the terminal pads from one another while holding the transducer and signal processing IC in position.
摘要翻译： 提供了传感器封装制造工艺，完成的传感器封装实现了薄的封装外形。 该制造工艺利用封装材料来消除对换能器支撑衬底的需要，封装材料将端子焊盘彼此隔离，同时将换能器和信号处理IC保持在适当位置。
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公开(公告)号：US20100290661A1
公开(公告)日：2010-11-18
申请号：US12456188
申请日：2009-06-12
申请人： John Charles Baumhauer, JR. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
发明人： John Charles Baumhauer, JR. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
IPC分类号： H04R11/04
CPC分类号： H04R1/083
摘要： A surface mountable package for use with an audio transducer is provided. In addition to the audio transducer, the surface mountable package includes a substrate, a cover, and a transducer support frame mounted within, and attached to, the substrate and cover. The support frame includes one or more cavities that, in combination with the audio transducer, substrate and cover, define the front and rear acoustic cavity volumes.
摘要翻译： 提供了一种与音频传感器一起使用的可表面安装的封装。 除了音频换能器之外，可表面安装的封装还包括安装在衬底和盖子内并连接到衬底和盖子上的衬底，盖子和换能器支撑框架。 支撑框架包括一个或多个空腔，其与音频换能器组合，衬底和盖子限定前腔和后声腔体积。
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公开(公告)号：US07825509B1
公开(公告)日：2010-11-02
申请号：US12543309
申请日：2009-08-18
申请人： John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
发明人： John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
IPC分类号： H01L23/34
CPC分类号： H01L24/97 , B81B2201/0257 , B81B2201/0271 , B81C1/0023 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/49171 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/16152 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/45099
摘要： A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.
摘要翻译： 提供了可表面安装的换能器封装，其设计允许实现薄的封装形状。 封装层结合到每个端子焊盘的表面，并封装传感器的一部分和信号处理IC的至少一部分。
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公开(公告)号：US20130044899A1
公开(公告)日：2013-02-21
申请号：US13471125
申请日：2012-05-14
申请人： Joshua R. Barber , John Charles Baumhauer, JR. , Jeffrey Phillip McAteer , Alan Dean Michel , James V. Olson
发明人： Joshua R. Barber , John Charles Baumhauer, JR. , Jeffrey Phillip McAteer , Alan Dean Michel , James V. Olson
CPC分类号： H04R19/016 , H04R3/005 , H04R19/005 , H04R2410/03
摘要： A dual backplate microphone is provided that utilizes either an electret condenser or a MEMS condenser configuration and in which an op-amp IC is electrically connected to both backplates and the conductive layer of the diaphragm.
摘要翻译： 提供双背板麦克风，其使用驻极体电容器或MEMS电容器配置，并且其中运算放大器IC电连接到隔板的两个背板和导电层。
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公开(公告)号：US20110308652A1
公开(公告)日：2011-12-22
申请号：US13153929
申请日：2011-06-06
IPC分类号： F16K21/00
CPC分类号： F16K11/0787 , F16K27/045 , Y10T137/86815 , Y10T137/9464
摘要： The present invention relates generally to fluid control valves and, more particularly, to a mixing valve for use within a faucet.
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公开(公告)号：US20100252131A1
公开(公告)日：2010-10-07
申请号：US12818778
申请日：2010-06-18
IPC分类号： F16K11/078 , F16K21/00
CPC分类号： F16K11/0787 , F16K27/045 , Y10T137/86815 , Y10T137/9464
摘要： The present invention relates generally to fluid control valves and, more particularly, to a mixing valve for use within a faucet.
摘要翻译： 本发明一般涉及流体控制阀，更具体地，涉及一种用于水龙头内的混合阀。
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公开(公告)号：US07766043B2
公开(公告)日：2010-08-03
申请号：US11700634
申请日：2007-01-31
申请人： Kurt Judson Thomas , Alfred Charles Nelson , Derek Allen Brown , Joshua R. Barber , Thomas C. Pinette
发明人： Kurt Judson Thomas , Alfred Charles Nelson , Derek Allen Brown , Joshua R. Barber , Thomas C. Pinette
IPC分类号： F16K21/00
CPC分类号： F16K19/006 , E03C1/04 , F16K27/044 , Y10T137/86815 , Y10T137/9464
摘要： A faucet including a molded waterway assembly having a plurality of tubes overmolded within a base.
摘要翻译： 一种水龙头，其包括具有在基底内包覆成型的多个管的模制水路组件。
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公开(公告)号：US08671984B2
公开(公告)日：2014-03-18
申请号：US13153929
申请日：2011-06-06
IPC分类号： F16K11/078
CPC分类号： F16K11/0787 , F16K27/045 , Y10T137/86815 , Y10T137/9464
摘要： The present invention relates generally to fluid control valves and, more particularly, to a mixing valve for use within a faucet.
摘要翻译： 本发明一般涉及流体控制阀，更具体地，涉及一种用于水龙头内的混合阀。
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公开(公告)号：US08365770B2
公开(公告)日：2013-02-05
申请号：US12848737
申请日：2010-08-02
申请人： Kurt Judson Thomas , Alfred Charles Nelson , Derek Allen Brown , Joshua R. Barber , Thomas C. Pinette
发明人： Kurt Judson Thomas , Alfred Charles Nelson , Derek Allen Brown , Joshua R. Barber , Thomas C. Pinette
IPC分类号： F16K11/06
CPC分类号： F16K19/006 , E03C1/04 , F16K27/044 , Y10T137/86815 , Y10T137/9464
摘要： A faucet including a molded waterway assembly having a plurality of tubes overmolded within a valve interface member.
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