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公开(公告)号：US20140147600A1
公开(公告)日：2014-05-29
申请号：US14090885
申请日：2013-11-26
IPC分类号： B05D7/14
CPC分类号： B23K35/004 , B23K35/0244 , C23C24/103 , C23C24/106 , F16L58/08
摘要： An apparatus and method of coating and/or lining of the interior of pipes and tubular goods with a performance enhancing layer of metal alloy using a 360° radiant heat source. The use of the disclosed apparatus and methods facilitates the capability to metallurgically bond a layer of metal alloy or composite material to the interior of a steel pipe or similar metal based tubular good with a primary diameter ranging typically from 1.5″ to 8″. The disclosed apparatus and methods are especially useful to produce piping used in the conveyance and/or transportation of hot, corrosive and/or abrasive fluids in the oil and gas, and mining Industries.
摘要翻译： 使用360°辐射热源的具有金属合金的性能增强层的管和管状物品的内部的涂覆和/或内衬的装置和方法。 使用所公开的装置和方法有助于将金属合金或复合材料层冶金结合到钢管或类似的基于金属的管状产品的内部，其初级直径范围通常为1.5“至8”。 所公开的装置和方法特别适用于在石油和天然气和采矿工业中用于运输和/或运输热，腐蚀性和/或磨蚀性流体的管道。
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公开(公告)号：US20150035436A1
公开(公告)日：2015-02-05
申请号：US14379470
申请日：2012-02-24
CPC分类号： H01J61/10 , H01J61/52 , H01J61/523 , H01J61/84
摘要： An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of liquid along an inside surface of the envelope, first and second electrodes within the envelope configured to generate a plasma arc therebetween, and an insulative housing associated surrounding at least a portion of an electrical connection to one of the electrodes. The apparatus further includes a shielding system configured to block electromagnetic radiation emitted by the arc to prevent the electromagnetic radiation from striking all inner surfaces of the insulative housing. The apparatus further includes a cooling system configured to cool the shielding system.
摘要翻译： 一种用于产生电磁辐射的装置包括一个外壳，一个涡流发生器，其配置成沿着该外壳的内表面产生液体的涡旋流，该外壳内的第一和第二电极构造成在其间产生等离子体电弧， 至少一部分电连接到一个电极。 该装置还包括屏蔽系统，其构造成阻挡由电弧发射的电磁辐射，以防止电磁辐射撞击绝缘外壳的所有内表面。 该装置还包括被配置为冷却屏蔽系统的冷却系统。
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公开(公告)号：US09627244B2
公开(公告)日：2017-04-18
申请号：US10742575
申请日：2003-12-19
申请人： David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
发明人： David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
IPC分类号： H01L21/687
CPC分类号： H01L21/68728 , H01L21/68721 , H01L21/68757
摘要： Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions. Alternatively, the support members may be rigid and the system may include a plurality of force applicators such as springs in communication with the support members.
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公开(公告)号：US08454356B2
公开(公告)日：2013-06-04
申请号：US11940983
申请日：2007-11-15
IPC分类号： F27D5/00
CPC分类号： H01L21/68735 , F27D5/0037 , H01L21/6875
摘要： An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.
摘要翻译： 用于在热处理期间支撑工件的装置包括具有非平面上表面的支撑板和支撑系统。 支撑系统构造成在工件的热处理期间将支撑板上方的工件支撑，使得工件的初始形状的下表面以不均匀的间隔被支撑在非平面上表面上方 支撑板，所述不均匀间隔包括在工件的外周边下方的边缘间隙，以及在工件的中心轴线处的中心间隙。
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公开(公告)号：US09245730B2
公开(公告)日：2016-01-26
申请号：US14379470
申请日：2012-02-24
CPC分类号： H01J61/10 , H01J61/52 , H01J61/523 , H01J61/84
摘要： An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of liquid along an inside surface of the envelope, first and second electrodes within the envelope configured to generate a plasma arc therebetween, and an insulative housing associated surrounding at least a portion of an electrical connection to one of the electrodes. The apparatus further includes a shielding system configured to block electromagnetic radiation emitted by the arc to prevent the electromagnetic radiation from striking all inner surfaces of the insulative housing. The apparatus further includes a cooling system configured to cool the shielding system.
摘要翻译： 一种用于产生电磁辐射的装置包括一个外壳，一个涡流发生器，其配置成沿着该外壳的内表面产生液体的涡旋流，该外壳内的第一和第二电极构造成在其间产生等离子体电弧， 至少一部分电连接到一个电极。 该装置还包括屏蔽系统，其构造成阻挡由电弧发射的电磁辐射，以防止电磁辐射撞击绝缘外壳的所有内表面。 该装置还包括被配置为冷却屏蔽系统的冷却系统。
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公开(公告)号：US20080157452A1
公开(公告)日：2008-07-03
申请号：US11940983
申请日：2007-11-15
IPC分类号： B23Q1/25
CPC分类号： H01L21/68735 , F27D5/0037 , H01L21/6875
摘要： An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.
摘要翻译： 用于在热处理期间支撑工件的装置包括具有非平面上表面的支撑板和支撑系统。 支撑系统构造成在工件的热处理期间将支撑板上方的工件支撑，使得工件的初始形状的下表面以不均匀的间隔被支撑在非平面上表面上方 支撑板，所述不均匀间隔包括在工件的外周边下方的边缘间隙，以及在工件的中心轴线处的中心间隙。
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7.发明授权Methods and systems for supporting a workpiece and for heat-treating the workpiece 有权用于支撑工件和热处理工件的方法和系统公开(公告)号：US08434341B2
公开(公告)日：2013-05-07
申请号：US13359857
申请日：2012-01-27
申请人： David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
发明人： David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
CPC分类号： H01L21/68728 , H01L21/68721 , H01L21/68757
摘要： An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.
摘要翻译： 用于支撑半导体工件的装置包括加热系统，该加热系统构造成通过相对于工件的大部分加热工件的表面来引起半导体工件的热感应运动。 热诱导运动包括工件的外边缘区域和工件相对于彼此的中心的垂直运动。 该装置还包括支撑系统，该支撑系统构造成允许包括工件的外边缘区域的垂直运动和工件中心相对于彼此同时支撑工件的热感应运动。
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8.发明申请公开(公告)号：US20120118867A1
公开(公告)日：2012-05-17
申请号：US13359857
申请日：2012-01-27
申请人： David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
发明人： David Malcolm Camm , Guillaume Sempere , Ljubomir Kaludjercic , Gregory Stuart , Mladen Bumbulovic , Tim Tran , Sergiy Dets , Tony Komasa , Marc Rudolph , Joseph Cibere
IPC分类号： H05B3/00
CPC分类号： H01L21/68728 , H01L21/68721 , H01L21/68757
摘要： An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.
摘要翻译： 用于支撑半导体工件的装置包括加热系统，该加热系统构造成通过相对于工件的大部分加热工件的表面来引起半导体工件的热感应运动。 热诱导运动包括工件的外边缘区域和工件相对于彼此的中心的垂直运动。 该装置还包括支撑系统，该支撑系统构造成允许包括工件的外边缘区域的垂直运动和工件中心相对于彼此同时支撑工件的热感应运动。
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9.发明授权Apparatuses and methods for suppressing thermally-induced motion of a workpiece 有权用于抑制工件的热致运动的装置和方法公开(公告)号：US07501607B2
公开(公告)日：2009-03-10
申请号：US11018388
申请日：2004-12-20
申请人： David Malcolm Camm , Mladen Bumbulovic , Joseph Cibere , J. Kiefer Elliott , Steve McCoy , Greg Stuart
发明人： David Malcolm Camm , Mladen Bumbulovic , Joseph Cibere , J. Kiefer Elliott , Steve McCoy , Greg Stuart
IPC分类号： H05B6/80
CPC分类号： H01L21/67115 , H01L21/67288 , H01L21/6875
摘要： Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.
摘要翻译： 用于抑制工件的热致运动的装置和方法。 一种设备包括被配置为热引起工件的运动的工件加热系统，并且还包括与工件间隔开并构造成施加阻尼力以阻尼工件的运动的阻尼构件。 阻尼构件可以与工件的静止位置间隔开足够小的距离，使得阻尼构件和工件之间的气体压力与工件的运动相反。 距离优选是可调节的。
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10.发明申请Apparatuses and methods for suppressing thermally-induced motion of a workpiece 有权用于抑制工件的热致运动的装置和方法公开(公告)号：US20050133167A1
公开(公告)日：2005-06-23
申请号：US11018388
申请日：2004-12-20
申请人： David Camm , Mladen Bumbulovic , Joseph Cibere , J. Elliott , Steve McCoy , Greg Stuart
发明人： David Camm , Mladen Bumbulovic , Joseph Cibere , J. Elliott , Steve McCoy , Greg Stuart
CPC分类号： H01L21/67115 , H01L21/67288 , H01L21/6875
摘要： Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.
摘要翻译： 用于抑制工件的热致运动的装置和方法。 一种设备包括被配置为热引起工件的运动的工件加热系统，并且还包括与工件间隔开并构造成施加阻尼力以阻尼工件的运动的阻尼构件。 阻尼构件可以与工件的静止位置间隔开足够小的距离，使得阻尼构件和工件之间的气体压力与工件的运动相反。 距离优选是可调节的。
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