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公开(公告)号：US08005351B2
公开(公告)日：2011-08-23
申请号：US12053102
申请日：2008-03-21
Applicant: David Malcolm Camm , Steve McCoy , Greg Stuart
Inventor： David Malcolm Camm , Steve McCoy , Greg Stuart
CPC classification number: H01L21/324 , C21D1/34 , C21D11/00 , H01L21/26513 , H01L21/268 , H01L21/2686 , H01L21/67115
Abstract: A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.
Abstract translation: 对工件进行热处理的方法包括产生入射到工件的目标表面区域上的辐照脉冲的初始加热部分和随后的维持部分。 初始加热部分和随后的维持部分的组合持续时间小于工件的热传导时间。 初始加热部分将目标表面积加热至所需温度，随后的维持部分将目标表面积保持在所需温度的期望范围内。 另一种方法包括生成辐照度脉冲的这种初始加热部分和随后的维持部分，在辐照脉冲期间监测指示目前完成的期望热处理量的至少一个参数，以及响应于辐射脉冲的偏差来修改辐照度脉冲 来自预期值的至少一个参数。
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公开(公告)号：US20100276611A1
公开(公告)日：2010-11-04
申请号：US12835589
申请日：2010-07-13
Applicant: David Malcolm Camm , Chee Chin , Rick Doolan , Tony Hewett , Arne Kjorvel , Tony Komasa , Mike Krasnich , Steve McCoy , Joseph Reyers , Igor Rudic , Ludmila Shepelev , Greg Stuart , Tilman Thrum , Alex Viel
Inventor： David Malcolm Camm , Chee Chin , Rick Doolan , Tony Hewett , Arne Kjorvel , Tony Komasa , Mike Krasnich , Steve McCoy , Joseph Reyers , Igor Rudic , Ludmila Shepelev , Greg Stuart , Tilman Thrum , Alex Viel
Abstract: An apparatus for producing electromagnetic radiation includes a flow generator configured to generate a flow of liquid along an inside surface of an envelope, first and second electrodes configured to generate an electrical arc within the envelope to produce the electromagnetic radiation, and an exhaust chamber extending outwardly beyond one of the electrodes, configured to accommodate a portion of the flow of liquid. In another aspect, the flow generator is electrically insulated. In another aspect, the electrodes are configured to generate an electrical discharge pulse to produce an irradiance flash, and the apparatus includes a removal device configured to remove particulate contamination from the liquid, the particulate contamination being released during the flash and being different than that released by the electrodes during continuous operation.
Abstract translation: 一种用于产生电磁辐射的装置包括：流动发生器，其被配置成沿着外壳的内表面产生液体流;第一和第二电极，被配置为在外壳内产生电弧以产生电磁辐射;以及排气室向外延伸 超过一个电极，被配置为容纳液体流的一部分。 在另一方面，流动发生器是电绝缘的。 在另一方面，电极被配置为产生放电脉冲以产生辐照闪光，并且该装置包括被配置为从液体中除去微粒污染物的去除装置，微粒污染在闪光期间被释放，并且与释放的不同 通过电极连续运行。
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3.发明授权Apparatuses and methods for suppressing thermally-induced motion of a workpiece 有权用于抑制工件的热致运动的装置和方法公开(公告)号：US07501607B2
公开(公告)日：2009-03-10
申请号：US11018388
申请日：2004-12-20
Applicant: David Malcolm Camm , Mladen Bumbulovic , Joseph Cibere , J. Kiefer Elliott , Steve McCoy , Greg Stuart
Inventor： David Malcolm Camm , Mladen Bumbulovic , Joseph Cibere , J. Kiefer Elliott , Steve McCoy , Greg Stuart
IPC: H05B6/80
CPC classification number: H01L21/67115 , H01L21/67288 , H01L21/6875
Abstract: Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.
Abstract translation: 用于抑制工件的热致运动的装置和方法。 一种设备包括被配置为热引起工件的运动的工件加热系统，并且还包括与工件间隔开并构造成施加阻尼力以阻尼工件的运动的阻尼构件。 阻尼构件可以与工件的静止位置间隔开足够小的距离，使得阻尼构件和工件之间的气体压力与工件的运动相反。 距离优选是可调节的。
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4.发明申请Apparatuses and methods for suppressing thermally-induced motion of a workpiece 有权用于抑制工件的热致运动的装置和方法公开(公告)号：US20050133167A1
公开(公告)日：2005-06-23
申请号：US11018388
申请日：2004-12-20
Applicant: David Camm , Mladen Bumbulovic , Joseph Cibere , J. Elliott , Steve McCoy , Greg Stuart
Inventor： David Camm , Mladen Bumbulovic , Joseph Cibere , J. Elliott , Steve McCoy , Greg Stuart
CPC classification number: H01L21/67115 , H01L21/67288 , H01L21/6875
Abstract: Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.
Abstract translation: 用于抑制工件的热致运动的装置和方法。 一种设备包括被配置为热引起工件的运动的工件加热系统，并且还包括与工件间隔开并构造成施加阻尼力以阻尼工件的运动的阻尼构件。 阻尼构件可以与工件的静止位置间隔开足够小的距离，使得阻尼构件和工件之间的气体压力与工件的运动相反。 距离优选是可调节的。
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公开(公告)号：US20070069161A1
公开(公告)日：2007-03-29
申请号：US11521074
申请日：2006-09-14
Applicant: David Camm , Sergiy Dets , Kevin McDonnell , Greg Stuart , Tilman Thrum , Igor Rudic , Ljubomir Kaludjercic
Inventor： David Camm , Sergiy Dets , Kevin McDonnell , Greg Stuart , Tilman Thrum , Igor Rudic , Ljubomir Kaludjercic
IPC: G01J3/10
CPC classification number: F27B17/0025 , H01L21/67115 , H01L21/67248 , H01L22/20
Abstract: A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to produce an irradiance flash incident on a surface of a workpiece, and automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter. A second method involves predicting a heating effect of an irradiance flash to be incident upon a surface of a workpiece, in response to a measurement of a heating parameter of the surface, and pre-adjusting the irradiance flash, in response to the predicted heating effect. A third method involves measuring a temperature of a surface of a workpiece during an initial portion of an irradiance flash incident on the surface, and controlling a power of a remaining portion of the irradiance flash, in response to the temperature.
Abstract translation: 第一热处理方法包括监测与被配置为产生入射在工件表面上的辐照闪光相关联的辐射系统的至少一个热效率参数，并且自动更新由辐照系统使用的控制信息以产生辐照闪光， 响应于热效率参数的监测。 第二种方法包括响应于表面的加热参数的测量以及响应于预测的加热效应来预先调节辐照度闪光来预测辐射闪光的加热效应入射到工件的表面上 。 第三种方法包括测量在入射到表面上的辐照闪光的初始部分期间工件表面的温度，以及响应于温度来控制辐照闪光的剩余部分的功率。
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Patent Agency Ranking
公开(公告)号：US09482468B2
公开(公告)日：2016-11-01
申请号：US11521074
申请日：2006-09-14
Applicant: David Malcolm Camm , Sergiy Dets , Kevin McDonnell , Greg Stuart , Tilman Thrum , Igor Rudic , Ljubomir Kaludjercic
Inventor： David Malcolm Camm , Sergiy Dets , Kevin McDonnell , Greg Stuart , Tilman Thrum , Igor Rudic , Ljubomir Kaludjercic
CPC classification number: F27B17/0025 , H01L21/67115 , H01L21/67248 , H01L22/20
Abstract: A first heat-treating method involves monitoring at least one thermal efficiency parameter associated with an irradiance system configured to produce an irradiance flash incident on a surface of a workpiece, and automatically updating control information used by the irradiance system to produce the irradiance flash, in response to the monitoring of the thermal efficiency parameter. A second method involves predicting a heating effect of an irradiance flash to be incident upon a surface of a workpiece, in response to a measurement of a heating parameter of the surface, and pre-adjusting the irradiance flash, in response to the predicted heating effect. A third method involves measuring a temperature of a surface of a workpiece during an initial portion of an irradiance flash incident on the surface, and controlling a power of a remaining portion of the irradiance flash, in response to the temperature.
Abstract translation: 第一热处理方法包括监测与被配置为产生入射在工件表面上的辐照闪光相关联的辐射系统的至少一个热效率参数，并且自动更新由辐照系统使用的控制信息以产生辐照闪光， 响应于热效率参数的监测。 第二种方法包括响应于表面的加热参数的测量以及响应于预测的加热效应来预先调节辐照度闪光来预测辐射闪光的加热效应入射到工件的表面上 。 第三种方法包括测量在入射到表面上的辐照闪光的初始部分期间工件表面的温度，以及响应于温度来控制辐照闪光的剩余部分的功率。
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公开(公告)号：US09070590B2
公开(公告)日：2015-06-30
申请号：US12993077
申请日：2009-05-15
Applicant: David Malcolm Camm , Joseph Cibere , Greg Stuart , Steve McCoy
Inventor： David Malcolm Camm , Joseph Cibere , Greg Stuart , Steve McCoy
IPC: H01L21/00 , H01L21/66 , C21D11/00 , H01L21/67 , H01L21/324
CPC classification number: H01L22/12 , C21D11/00 , H01L21/324 , H01L21/67098 , H01L21/67115 , H01L21/67248 , H01L21/67253 , H01L22/26 , H01L2924/0002 , H01L2924/00
Abstract: Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.
Abstract translation: 公开了用于热处理工件的方法和装置。 一种说明性方法包括测量工件的热处理过程中的变形，并且响应于测量工件的变形而采取与工件的热处理相关的作用。 工件可以包括半导体晶片。 采取动作可以包括在热处理期间对晶片的温度或反射率测量应用变形校正，或者可以包括例如修改晶片的热处理。
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公开(公告)号：US20110274417A1
公开(公告)日：2011-11-10
申请号：US13182341
申请日：2011-07-13
Applicant: David Malcolm Camm , Steve McCoy , Greg Stuart
Inventor： David Malcolm Camm , Steve McCoy , Greg Stuart
IPC: F27D11/12
CPC classification number: H01L21/324 , C21D1/34 , C21D11/00 , H01L21/26513 , H01L21/268 , H01L21/2686 , H01L21/67115
Abstract: A method of heat-treating a workpiece includes generating an initial heating portion and a subsequent sustaining portion of an irradiance pulse incident on a target surface area of the workpiece. A combined duration of the initial heating portion and the subsequent sustaining portion is less than a thermal conduction time of the workpiece. The initial heating portion heats the target surface area to a desired temperature and the subsequent sustaining portion maintains the target surface area within a desired range from the desired temperature. Another method includes generating such an initial heating portion and subsequent sustaining portion of an irradiance pulse, monitoring at least one parameter indicative of a presently completed amount of a desired thermal process during the irradiance pulse, and modifying the irradiance pulse in response to deviation of the at least one parameter from an expected value.
Abstract translation: 对工件进行热处理的方法包括产生入射到工件的目标表面区域上的辐照脉冲的初始加热部分和随后的维持部分。 初始加热部分和随后的维持部分的组合持续时间小于工件的热传导时间。 初始加热部分将目标表面积加热至所需温度，随后的维持部分将目标表面积保持在所需温度的期望范围内。 另一种方法包括生成辐照度脉冲的这种初始加热部分和随后的维持部分，在辐照脉冲期间监测指示目前完成的期望热处理量的至少一个参数，以及响应于辐射脉冲的偏差来修改辐照度脉冲 来自预期值的至少一个参数。
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公开(公告)号：US20110177624A1
公开(公告)日：2011-07-21
申请号：US12993077
申请日：2009-05-15
Applicant: David Malcolm Camm , Joseph Cibere , Greg Stuart , Steve McCoy
Inventor： David Malcolm Camm , Joseph Cibere , Greg Stuart , Steve McCoy
CPC classification number: H01L22/12 , C21D11/00 , H01L21/324 , H01L21/67098 , H01L21/67115 , H01L21/67248 , H01L21/67253 , H01L22/26 , H01L2924/0002 , H01L2924/00
Abstract: Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.
Abstract translation: 公开了用于热处理工件的方法和装置。 一种说明性方法包括测量工件的热处理过程中的变形，并且响应于测量工件的变形而采取与工件的热处理相关的作用。 工件可以包括半导体晶片。 采取动作可以包括在热处理期间对晶片的温度或反射率测量应用变形校正，或者可以包括例如修改晶片的热处理。
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公开(公告)号：US20050179354A1
公开(公告)日：2005-08-18
申请号：US10777995
申请日：2004-02-12
Applicant: David Camm , Chee Chin , Rick Doolan , Tony Hewett , Arne Kjorvel , Tony Komasa , Mike Krasnich , Steve McCoy , Joseph Reyers , Igor Rudic , Ludmila Shepelev , Greg Stuart , Tilman Thrum , Alex Viel
Inventor： David Camm , Chee Chin , Rick Doolan , Tony Hewett , Arne Kjorvel , Tony Komasa , Mike Krasnich , Steve McCoy , Joseph Reyers , Igor Rudic , Ludmila Shepelev , Greg Stuart , Tilman Thrum , Alex Viel
Abstract: An apparatus for producing electromagnetic radiation includes a flow generator configured to generate a flow of liquid along an inside surface of an envelope, first and second electrodes configured to generate an electrical arc within the envelope to produce the electromagnetic radiation, and an exhaust chamber extending outwardly beyond one of the electrodes, configured to accommodate a portion of the flow of liquid. In another aspect, the flow generator is electrically insulated. In another aspect, the electrodes are configured to generate an electrical discharge pulse to produce an irradiance flash, and the apparatus includes a removal device configured to remove particulate contamination from the liquid, the particulate contamination being released during the flash and being different than that released by the electrodes during continuous operation.
Abstract translation: 一种用于产生电磁辐射的装置包括：流动发生器，其被配置成沿着外壳的内表面产生液体流;第一和第二电极，被配置为在外壳内产生电弧以产生电磁辐射;以及排气室向外延伸 超过一个电极，被配置为容纳液体流的一部分。 在另一方面，流动发生器是电绝缘的。 在另一方面，电极被配置为产生放电脉冲以产生辐照闪光，并且该装置包括被配置为从液体中除去微粒污染物的去除装置，微粒污染物在闪光期间被释放并且与释放的不同 通过电极连续运行。
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