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15 条记录 (耗时 0.027 秒)

    Radiation curable compositions having improved flexibility
    5.
    发明申请
    Radiation curable compositions having improved flexibility 有权
    具有改善柔性的可辐射固化组合物

    公开(公告)号：US20060111477A1

    公开(公告)日：2006-05-25

    申请号：US10995806

    申请日：2004-11-23

    申请人： James Mrvos ,  Girish Patil ,  Karthik Vaideeswaran

    发明人： James Mrvos ,  Girish Patil ,  Karthik Vaideeswaran

    IPC分类号： C08L63/00 ,  C08G67/02

    CPC分类号： C08G59/68 ,  B41J2/1603 ,  B41J2/1637 ,  C08L63/00 ,  G03F7/038

    摘要： A radiation curable resin composition having improved flexibility. The radiation curable composition having from about 5 to about 50 weight percent of a difunctional polymeric compound; from about 1 to about 10 weight percent of a photoinitiator; from about 1 to about 10 weight percent of a flexibilizer agent, wherein the flexibilizer agent has a molecular weight ranging from about 400 to about 10,000; and about 30 to about 90 weight percent of the non-photoreactive solvent, wherein the weight percents are based on the total weight of the resin composition. Ink jet print heads and ink jet printing apparatusess comprising ink jet print heads utilizing the radiation curable resin compositions are also included.

    摘要翻译： 一种具有改善柔性的辐射固化树脂组合物。 所述可辐射固化组合物具有约5至约50重量％的双官能聚合物; 约1至约10重量％的光引发剂; 约1至约10重量％的增韧剂，其中所述增韧剂的分子量范围为约400至约10,000; 和约30至约90重量％的非光反应性溶剂，其中重量百分比基于树脂组合物的总重量。 还包括使用该辐射固化树脂组合物的喷墨打印头和喷墨打印设备，包括喷墨打印头。

    Dry etching methods
    6.
    发明申请
    Dry etching methods 有权
    干蚀刻方法

    公开(公告)号：US20070004215A1

    公开(公告)日：2007-01-04

    申请号：US11173395

    申请日：2005-07-01

    申请人： James Mrvos ,  Girish Patil

    发明人： James Mrvos ,  Girish Patil

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： B81C1/00531 ,  B81C2201/0132 ,  H01J37/321 ,  H01L21/30655 ,  H01L21/3081

    摘要： A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (referred to collectively as “slots”) in the substrates. The process includes applying a first layer to a first surface of substrate to provide an etch mask material layer on the first surface of the substrate. A second layer is applied to a second surface of the substrate to provide an etch stop material layer on the second surface of the substrate. The first layer and the second layer have similar solubilities in one or more organic solvents. The substrate is etched from the first surface of the wafers to provide a slot in the substrate. After etching the substrate, the etch mask material layer and the etch stop material layer are removed by contacting the first surface and the second surface of the substrate with a single organic solvent.

    摘要翻译： 使用深反应离子蚀刻工艺蚀刻半导体衬底以在衬底中产生通孔或槽（统称为“槽”）的工艺。 该方法包括将第一层施加到衬底的第一表面以在衬底的第一表面上提供蚀刻掩模材料层。 将第二层施加到衬底的第二表面，以在衬底的第二表面上提供蚀刻停止材料层。 第一层和第二层在一种或多种有机溶剂中具有相似的溶解度。 从晶片的第一表面蚀刻衬底以在衬底中提供槽。 在蚀刻基板之后，通过用单一有机溶剂接触基板的第一表面和第二表面来去除蚀刻掩模材料层和蚀刻停止材料层。

    Methods of deep reactive ion etching
    7.
    发明申请
    Methods of deep reactive ion etching 失效

    公开(公告)号：US20060054590A1

    公开(公告)日：2006-03-16

    申请号：US10938009

    申请日：2004-09-10

    申请人： John Krawczyk ,  Andrew McNees ,  James Mrvos

    发明人： John Krawczyk ,  Andrew McNees ,  James Mrvos

    IPC分类号： B41J2/04 ,  G11B5/127

    CPC分类号： B41J2/1631 ,  B41J2/1603 ,  B41J2/1628

    摘要： A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.

    Micro-fluid ejection assemblies
    8.
    发明申请
    Micro-fluid ejection assemblies 有权
    微流体喷射组件

    公开(公告)号：US20050231557A1

    公开(公告)日：2005-10-20

    申请号：US10823939

    申请日：2004-04-14

    申请人： John Krawczyk ,  Andrew McNees ,  James Mrvos ,  Carl Sullivan

    发明人： John Krawczyk ,  Andrew McNees ,  James Mrvos ,  Carl Sullivan

    IPC分类号： B41J2/16 ,  C23F1/00

    CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628

    摘要： A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.

    摘要翻译： 一种微流体喷射组件，包括其中具有精确形成的流体路径的硅衬底。 流体路径是通过在具有不超过约5000埃的电介质层厚度的蚀刻之前在具有蚀刻前的表面特性的基底上进行的深反应离子蚀刻工艺形成的，以及基本上不含介质材料的凹坑表面，其中a 表面点蚀的均方根深度小于约500埃，最大表面点蚀深度不超过约2500埃。 这种衬底中的流体路径具有改进的流动特性以便更可靠的流体喷射操作。

    Removable sealing tape with thin adhesive
    10.
    发明申请
    Removable sealing tape with thin adhesive 审中-公开
    可拆卸密封胶带，薄胶粘剂

    公开(公告)号：US20070076044A1

    公开(公告)日：2007-04-05

    申请号：US11241218

    申请日：2005-09-30

    申请人： Richard Corley ,  Brian Hart ,  James Mrvos ,  Paul Spivey

    发明人： Richard Corley ,  Brian Hart ,  James Mrvos ,  Paul Spivey

    IPC分类号： B41J2/165

    CPC分类号： B41J2/17536

    摘要： Sealing tapes, such as those utilizing an ultra-thin adhesive layer for attaching the sealing tape to the nozzle member of an ink jet printhead. One such ultra-thin adhesive has a thickness of 3 microns or less, and can be applied using pressure or both heat and pressure.

    摘要翻译： 密封带，例如利用超薄粘合剂层的密封带，用于将密封带附着到喷墨打印头的喷嘴构件上。 一种这样的超薄粘合剂具有3微米或更小的厚度，并且可以使用压力或热和压力施加。