公开(公告)号：US4377198A

公开(公告)日：1983-03-22

申请号：US196903

申请日：1980-10-14

Applicant: John R. Welling ,  Donald L. Mattox

Inventor： John R. Welling ,  Donald L. Mattox

IPC: F28D15/04 ,  F28D20/02 ,  H01L23/427 ,  H05K7/20 ,  F28F13/00

CPC classification number: H01L23/427 ,  F28D15/04 ,  F28D20/02 ,  H01L2924/0002 ,  Y02E60/145

Abstract: A cooling system is described which is appropriate to many high performance missiles. The invention comprises heat pipe/thermal diode devices, and a heat storage medium. Heat generated by electronic components of a missile is either conducted to the skin of the missile to be dissipated or is stored internally for later dissipation.

Abstract translation: 描述了适用于许多高性能导弹的冷却系统。 本发明包括热管/热二极管装置和储热介质。 导弹的电子部件产生的热量或者被传导到导弹的皮肤上，以消散或者被内部储存以备以后消散。

公开(公告)号：US4255938A

公开(公告)日：1981-03-17

申请号：US21642

申请日：1979-03-19

Applicant: Dean E. Norris ,  John R. Welling

Inventor： Dean E. Norris ,  John R. Welling

IPC: F25B19/00

CPC classification number: F25B19/00 ,  Y10T137/0645

Abstract: A converging/diverging venturi assembly positioned in a subsonic fluid flow stream for producing a supersonic flow velocity in the downstream diverging section with a pressure pickoff system that is located adjacent a minimum static pressure location just prior to a point where shock waves begin to form. The low pressure in the supersonic region in front of the shock wave may be utilized for reducing the boiling temperature of a fluid in a boiler by porting a tube from the low pressure venturi to the boiler, thus improving the heat transfer characteristics of the boiler where the boiler is used for a heat sink for heat sources in a mobile vehicle.

Abstract translation: 位于亚音速流体流中的会聚/发散文丘里组件，用于在下游发散部分中产生超音速流速，压力传感系统位于冲击波开始形成之前的最小静压位置附近。 在冲击波前面的超音速区域中的低压可以用于通过将管从低压文丘里管移送到锅炉来降低锅炉中的流体的沸腾温度，从而提高了锅炉的传热特性 锅炉用于移动车辆中的热源散热器。

公开(公告)号：US4183135A

公开(公告)日：1980-01-15

申请号：US951418

申请日：1978-10-13

Applicant: John R. Welling

Inventor： John R. Welling

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  B01J17/00

CPC classification number: H01L24/83 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49572 ,  H01L24/26 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/49121

Abstract: A semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to the bumps of the die, coating the bumps and active area with unfired glass and firing the glass at a temperature generally below 450.degree. C. The method also includes bonding the film strip leads to the bumps and firing the glass simultaneously or firing the glass and remelting glass covering the bumps to bond the leads to the bumps through the fired glass.

Abstract translation: 一种具有凸起型接触区域的半导体管芯，其上粘合有薄膜条引线，并且仅封装了管芯的活性侧的烧结玻璃和凸点接触区域。 封装的方法包括将薄膜条导线接合到裸片的凸块上，用未烧成的玻璃涂覆凸块和有源区域，并在通常低于450℃的温度下烧制玻璃。该方法还包括将薄膜条导线 同时烧结玻璃，或者烧制玻璃并重熔玻璃覆盖凸块，以将引线通过烧制玻璃将凸块粘结在凸块上。

公开(公告)号：US5175065A

公开(公告)日：1992-12-29

申请号：US392491

申请日：1982-06-28

Applicant: Richard H. Lammers ,  John R. Welling

Inventor： Richard H. Lammers ,  John R. Welling

IPC: H01M6/38

CPC classification number: H01M6/38

Abstract: An electrolyte dispensing ampule for deferred action batteries comprises a spring having means at both ends thereof for forming a closed, generally cylindrical space inside the spring and a metal layer covering the spring to hermetically seal the space. An electrolyte solution is contained in the spring and is dispersed to activate the battery when set-back forces extend the spring and break the sealing layer.

Abstract translation: 用于延迟动作电池的电解液分配安瓿包括弹簧，其两端具有用于在弹簧内部形成封闭的大致圆柱形空间的装置和覆盖弹簧的金属层以气密地密封空间。 电解液被包含在弹簧中并且当回弹力延伸弹簧并破坏密封层时，它被分散以激活电池。

公开(公告)号：US4151638A

公开(公告)日：1979-05-01

申请号：US828588

申请日：1977-08-29

Applicant: John R. Welling

Inventor： John R. Welling

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  B01J17/00

CPC classification number: H01L23/49572 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/01075 ,  H01L2924/09701 ,  Y10T29/49121

Abstract: a semiconductor die having bump type contact areas thereon with film strip leads bonded thereto and fired glass encapsulating only the active side of the die and the bump contact areas. The method of encapsulation includes bonding the film strip leads to the bumps of the die, coating the bumps and active area with unfired glass and firing the glass at a temperature generally below 450.degree. C. The method also includes bonding the film strip leads to the bumps and firing the glass simultaneously or firing the glass and remelting glass covering the bumps to bond the leads to the bumps through the fired glass.

Abstract translation: 具有凸起型接触区域的半导体管芯，其上粘合有膜条引线，并且仅封装了管芯的活性侧的烧结玻璃和凸点接触区域。 封装的方法包括将薄膜条导线接合到裸片的凸块上，用未烧成的玻璃涂覆凸块和有源区域，并在通常低于450℃的温度下烧制玻璃。该方法还包括将薄膜条导线 同时烧结玻璃，或者烧制玻璃并重熔玻璃覆盖凸块，以将引线通过烧制玻璃将凸块粘结在凸块上。