公开(公告)号：US4912772A

公开(公告)日：1990-03-27

申请号：US319503

申请日：1989-03-06

申请人： John S. Beaudry, Jr. ,  Peter A. Engel ,  James R. Petrozello ,  Steven R. Shinners

发明人： John S. Beaudry, Jr. ,  Peter A. Engel ,  James R. Petrozello ,  Steven R. Shinners

IPC分类号： H01R11/01 ,  H01R12/50 ,  H01R12/71 ,  H01R24/00 ,  H01R33/74 ,  H01R33/76 ,  H05K1/11 ,  H05K3/32 ,  H05K7/10

CPC分类号： H05K3/326 ,  H01R12/716 ,  H05K1/119 ,  H05K7/1084 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/1059 ,  Y10S439/931

摘要： In a circuit package having a connector for connecting a pin array circuit module and a printed circuit board, the connector is a molded plastic planar member with a plurality of openings extending through the member. In each opening, the member has two integral and spaced first and second parts having respectively oppositely aligned faces for receiving therebetween one of the pins. At least one of the parts resiliently extends across the opening, and at least one of the faces is a contact surface which mates with a pin of the module. A conductive layer with a predetermined circuit pattern is disposed on the member and includes conductors which extend from the contact surface to terminals disposed on the bottom surface of the member. The terminals are mateable with the input/output pads of the board. The member is disposed between the board and the module to provide the connection between the module and the board with the terminals of the member and the pads of the board being in contacting relationship. The pins of the module are disposed in the openings from the opposite surface of the member and each pin is extended and engaged by and between the respective faces of the paired parts in the particular opening in which the pin is inserted.

公开(公告)号：US4514752A

公开(公告)日：1985-04-30

申请号：US598631

申请日：1984-04-10

申请人： Peter A. Engel ,  Douglas H. Strope ,  Thomas E. Wray

发明人： Peter A. Engel ,  Douglas H. Strope ,  Thomas E. Wray

IPC分类号： H01L23/34 ,  H01L21/50 ,  H01L23/02 ,  H01L23/057 ,  H01L23/10 ,  H01L23/16 ,  H01L23/42

CPC分类号： H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15312 ,  Y10T29/49172

摘要： A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape, is disposed between an epoxy composition and the back surface of a substrate and between the epoxy composition and the inner surface of a cap for blocking the movement of the epoxy composition into a gap area during the manufacture of the module. An electronic module comprises a substrate, an integrated circuit chip disposed on the substrate, a cap disposed over and enclosing the chip and the substrate, a heat dissipator disposed between the cap and the chip for carrying away the heat dissipated by the chip, and an epoxy composition secured to the back surface of the substrate for sealing the module, and specifically, the chip within the module from harmful external influences. The boundary of a gap is defined by the edge of the substrate and the inner surface of the cap. A blocking article, such as a polyimide tape, is disposed between the epoxy composition on one side and the back side of the substrate coupled with the inner surface of the cap on the other side for holding the epoxy composition external to the gap and preventing the epoxy composition from being disposed within the gap during the manufacture of the module. As a result, the cap is relatively free to move with respect to the substrate. Unnecessary distortion of the cap is minimized and resultant damage to the chips within the cap is avoided.

摘要翻译： 公开了一种位移补偿模块，其中诸如聚酰亚胺胶带的阻挡制品设置在环氧组合物和基底的背面之间以及在环氧组合物和盖的内表面之间，用于阻止环氧组合物的运动 在模块的制造期间进入间隙区域。 电子模块包括基板，设置在基板上的集成电路芯片，设置在芯片和基板上并封装的盖子，设置在盖子和芯片之间的散热器，用于带走由芯片散热的热量，以及 环氧树脂组合物固定在基板的背面，用于密封模块，特别是模块内的芯片受到有害的外部影响。 间隙的边界由衬底的边缘和盖的内表面限定。 诸如聚酰亚胺带的封闭制品设置在与另一侧的盖子的内表面相耦合的一侧的环氧组合物和背面之间，用于将环氧组合物保持在间隙外部，并防止 环氧组合物在模块的制造期间设置在间隙内。 结果，帽相对于基底相对自由移动。 盖的不必要的变形被最小化并且避免了对盖内的芯片造成的损坏。