公开(公告)号：US06122538A

公开(公告)日：2000-09-19

申请号：US784973

申请日：1997-01-16

申请人： John William Sliwa, Jr. ,  Paul E. Chandler ,  John D. Marshall ,  Gelston Howell ,  S. Lawrence Marple, Jr. ,  Sassan Shahidi

发明人： John William Sliwa, Jr. ,  Paul E. Chandler ,  John D. Marshall ,  Gelston Howell ,  S. Lawrence Marple, Jr. ,  Sassan Shahidi

IPC分类号： A61B8/00 ,  A61B8/12 ,  A61B19/00 ,  G01C23/00

CPC分类号： A61B8/0841 ,  A61B8/00 ,  A61B8/4254 ,  A61B8/483 ,  A61B8/12 ,  A61B8/4488

摘要： A system and method for tracking the position and orientation of a movable medical imaging device using a first and second sensor disposed on the device. The second sensor is of a different type than the first sensor and measures a P/O parameter different from that of the first sensor. The system and method also include techniques for recalibrating sensors using measurements from other sensors and improving the measurements made by some sensors using measurements from other sensors. The system and method also include measuring the position of a medical implement relative to a movable medical imaging device by providing a first and second subsystem on the medical implement and a third and fourth subsystem on the movable medical imaging device. The first subsystem has a sensor of a first type and the second subsystem has a sensor of a second type different from the sensor of the first type. The third subsystem has a sensor of a third type and the fourth subsystem has a sensor of a fourth type different from the third type.

摘要翻译： 一种使用设置在该装置上的第一和第二传感器跟踪可动医疗成像装置的位置和方向的系统和方法。 第二传感器与第一传感器不同，测量与第一传感器不同的P / O参数。 该系统和方法还包括使用来自其他传感器的测量重新校准传感器的技术，并且使用来自其它传感器的测量来改进由一些传感器进行的测量。 该系统和方法还包括通过在医疗器具上提供第一和第二子系统以及可动医疗成像装置上的第三和第四子系统来测量医疗器具相对于可移动医疗成像装置的位置。 第一子系统具有第一类型的传感器，并且第二子系统具有与第一类型的传感器不同的第二类型的传感器。 第三子系统具有第三类型的传感器，第四子系统具有与第三类型不同的第四类型的传感器。

公开(公告)号：US20070062028A1

公开(公告)日：2007-03-22

申请号：US11469170

申请日：2006-08-31

申请人： Robert Biskeborn ,  Luis Borja ,  Calvin Lo ,  Kevin Luong ,  Sassan Shahidi

发明人： Robert Biskeborn ,  Luis Borja ,  Calvin Lo ,  Kevin Luong ,  Sassan Shahidi

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/39 ,  G11B5/40 ,  Y10T29/49021 ,  Y10T29/49036 ,  Y10T29/49041 ,  Y10T29/49048

摘要： A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

摘要翻译： 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面（TBS）的边缘的边缘。 然后，例如通过研磨，形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。

公开(公告)号：US20050122631A1

公开(公告)日：2005-06-09

申请号：US10727788

申请日：2003-12-03

申请人： Robert Biskeborn ,  Luis Borja ,  Calvin Lo ,  Kevin Luong ,  Sassan Shahidi

发明人： Robert Biskeborn ,  Luis Borja ,  Calvin Lo ,  Kevin Luong ,  Sassan Shahidi

IPC分类号： G11B5/127 ,  G11B5/187 ,  G11B5/39 ,  G11B5/40

CPC分类号： G11B5/39 ,  G11B5/40 ,  Y10T29/49021 ,  Y10T29/49036 ,  Y10T29/49041 ,  Y10T29/49048

摘要： A method is provided for providing air-skiving edges of a tape head. A slot is created in an upper face of a substrate of a tape head. The slot includes at least one edge defining an edge of a tape bearing surface (TBS) of the tape head. The surface of the tape head is then formed and finished, such as by lapping. A grind operation is subsequently conducted to form a notch in the upper face of the substrate of the tape head. Such notch extends from the slot to an outside end of the substrate of the tape head.

摘要翻译： 提供了一种用于提供磁头的空气刮除边缘的方法。 在磁带头的基板的上表面上形成槽。 所述槽包括至少一个限定所述带头的带支承表面（TBS）的边缘的边缘。 然后，例如通过研磨，形成并完成带头的表面。 随后进行研磨操作以在带头的基材的上表面形成切口。 这样的缺口从带头的基底的狭缝延伸到外端。

公开(公告)号：US20080019049A1

公开(公告)日：2008-01-24

申请号：US11833973

申请日：2007-08-04

申请人： Annayya Deshpande ,  Hoodin Hamidi ,  Icko Iben ,  Kevin Luong ,  Sassan Shahidi ,  Abel Taina

发明人： Annayya Deshpande ,  Hoodin Hamidi ,  Icko Iben ,  Kevin Luong ,  Sassan Shahidi ,  Abel Taina

IPC分类号： G11B5/60

CPC分类号： G11B5/105 ,  G11B5/00821 ,  G11B5/60 ,  G11B15/62

摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

摘要翻译： 具有复合空气轴承表面的磁头读/写模块，以及用于将芯片嵌入基板以形成复合空气轴承表面的方法和装置。 模块的示例包括具有空气轴承表面，前部，后部和芯片接收槽的基板。 衬底的空气轴承表面具有邻接芯片接收槽的第一侧的第一部分和与芯片接收槽的第二侧相邻的第二部分。 该模块还包括具有空气轴承表面，底面，前部，后部和有源元件的芯片。 有源元件靠近芯片的前部。 芯片位于基板中的芯片接收槽中，芯片的空气轴承表面基本上与基板的空气轴承表面对准。

公开(公告)号：US20070284133A1

公开(公告)日：2007-12-13

申请号：US11781850

申请日：2007-07-23

申请人： Icko Iben ,  Sassan Shahidi ,  George Zamora

发明人： Icko Iben ,  Sassan Shahidi ,  George Zamora

IPC分类号： H01B9/02 ,  G01N21/00

CPC分类号： G11B5/486 ,  G11B5/4853

摘要： A cable in one embodiment includes a plurality of leads; and an electrostatic discharge (ESD) dissipative layer operatively coupled to the leads, the ESD dissipative layer being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; an ESD dissipative layer operatively coupled to the leads, the ESD dissipative layer; and a metallic layer operatively coupled to the leads, the metallic and ESD dissipative layers being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; a metallic layer operatively coupled to the leads, the metallic layer being characterized as being at least one of translucent, semi-transparent or transparent, wherein the metallic layer has a volume resistivity of greater than 1×104 ohm cm as defined by ANSI/EIA-541-1988; and an insulating layer positioned between the metallic layer and the leads.

摘要翻译： 一个实施例中的电缆包括多个引线; 以及可操作地耦合到所述引线的静电放电（ESD）耗散层，所述ESD耗散层被表征为半透明，半透明或透明中的至少一个。 另一实施例中的电缆包括多个引线; 可操作地耦合到引线的ESD耗散层，ESD耗散层; 以及可操作地耦合到所述引线的金属层，所述金属和ESD耗散层被表征为半透明，半透明或透明中的至少一个。 另一实施例中的电缆包括多个引线; 金属层，其可操作地耦合到所述引线，所述金属层的特征在于为半透明，半透明或透明中的至少一种，其中所述金属层具有大于1×10 4欧姆厘米的体积电阻率 如ANSI / EIA-541-1988所定义; 以及位于金属层和引线之间的绝缘层。

公开(公告)号：US20060227457A1

公开(公告)日：2006-10-12

申请号：US11449443

申请日：2006-06-07

申请人： Annayya Deshpande ,  Hoodin Hamidi ,  Icko Iben ,  Kevin Luong ,  Sassan Shahidi ,  Abel Taina

发明人： Annayya Deshpande ,  Hoodin Hamidi ,  Icko Iben ,  Kevin Luong ,  Sassan Shahidi ,  Abel Taina

IPC分类号： G11B5/187

CPC分类号： G11B5/105 ,  G11B5/00821 ,  G11B5/60 ,  G11B15/62

摘要： A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.