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    Electronic devices with modular housings
    1.
    发明授权
    Electronic devices with modular housings 有权

    公开(公告)号：US10808963B2

    公开(公告)日：2020-10-20

    申请号：US16246387

    申请日：2019-01-11

    Applicant: Johnson Controls Technology Company

    Inventor： Daniel J. Spors ,  Daniel R. Hjortland

    IPC: F24F13/20 ,  G01K1/08 ,  F24F11/88 ,  F24F11/523 ,  F24F11/89

    Abstract: A sensor device including a housing and a number of sensors. The housing includes a back plate including a mounting surface, a middle plate attached to the back plate, and a face plate attached to the middle plate, wherein the face plate is formed from a clear material and has a back surface and a front surface with the back surface positioned toward the middle plate and wherein a design is applied to the back surface of the face plate and is visible through the front surface of the face plate. The housing defines an interior housing volume and the number of sensors is positioned within the interior housing volume.

    Mitigation of fluid ingress via convection venting on electronic devices
    2.
    发明授权
    Mitigation of fluid ingress via convection venting on electronic devices 有权

    公开(公告)号：US11085832B2

    公开(公告)日：2021-08-10

    申请号：US15247888

    申请日：2016-08-25

    Applicant: Johnson Controls Technology Company

    Inventor： Daniel J. Spors

    IPC: G01K1/08 ,  F24F13/20

    Abstract: A fluid protection cover for an electronic device includes a cowl configured to fit at least partially over an electronic device enclosure and shield a convection vent opening in the electronic device enclosure against fluid ingress, an opening located underneath the cowl and configured to permit the passage of air from an interior region of the electronic device enclosure to the ambient air, and a primary louver located underneath the cowl. The primary louver includes an inclined surface configured to direct fluid away from the opening. The fluid protection cover further includes a first end cap and a second end cap. Each end cap is configured to fit at least partially over an exterior face of the electronic device enclosure and join the cowl to the primary louver.

    DISPLAY FOR SENSOR DEVICE
    4.
    发明申请
    DISPLAY FOR SENSOR DEVICE 审中-公开

    公开(公告)号：US20200224911A1

    公开(公告)日：2020-07-16

    申请号：US16246035

    申请日：2019-01-11

    Applicant: Johnson Controls Technology Company

    Inventor： Daniel J. Spors ,  Brian D. Klarkowski

    IPC: F24F11/523 ,  G06F3/041 ,  F24F11/64 ,  G06F3/0488 ,  G06F3/0481 ,  G06F3/0482

    Abstract: A sensor device or thermostat for use in a building zone including a number of sensor components, each sensor component configured to sense an environmental condition. The sensor device or thermostat further including a display including a first number of fixed segment icons, each fixed segment icon associated with one of the sensors. The display further including a first number of fixed segment numerals, each numeral associated with one of the fixed segment icons to indicate a value associated with a sensor component, a second number of fixed segment numerals, the second number of fixed segment numerals having a larger size than the first number of fixed segment numerals. The sensor device or thermostat further including a control circuit communicably coupled to the sensor components and the display, wherein the control circuit is structured to cause the second number of fixed segment numerals to display a value associated with one of the number of sensor components.

    ELECTRONIC DEVICES WITH MODULAR HOUSINGS
    5.
    发明申请
    ELECTRONIC DEVICES WITH MODULAR HOUSINGS 审中-公开

    公开(公告)号：US20200224922A1

    公开(公告)日：2020-07-16

    申请号：US16246387

    申请日：2019-01-11

    Applicant: Johnson Controls Technology Company

    Inventor： Daniel J. Spors ,  Daniel R. Hjortland

    IPC: F24F13/20 ,  G01K1/08 ,  F24F11/88 ,  F24F11/89 ,  F24F11/523

    Abstract: A sensor device including a housing and a number of sensors. The housing includes a back plate including a mounting surface, a middle plate attached to the back plate, and a face plate attached to the middle plate, wherein the face plate is formed from a clear material and has a back surface and a front surface with the back surface positioned toward the middle plate and wherein a design is applied to the back surface of the face plate and is visible through the front surface of the face plate. The housing defines an interior housing volume and the number of sensors is positioned within the interior housing volume.

    DESIGN FOR MITIGATION OF FLUID INGRESS VIA CONVECTION VENTING ON ELECTRONIC DEVICES
    9.
    发明申请
    DESIGN FOR MITIGATION OF FLUID INGRESS VIA CONVECTION VENTING ON ELECTRONIC DEVICES 审中-公开

    公开(公告)号：US20180058941A1

    公开(公告)日：2018-03-01

    申请号：US15247888

    申请日：2016-08-25

    Applicant: Johnson Controls Technology Company

    Inventor： Daniel J. Spors

    IPC: G01K1/08

    CPC classification number: G01K1/08 ,  F24F13/20 ,  F24F2013/207

    Abstract: A fluid protection cover for an electronic device includes a cowl configured to fit at least partially over an electronic device enclosure and shield a convection vent opening in the electronic device enclosure against fluid ingress, an opening located underneath the cowl and configured to permit the passage of air from an interior region of the electronic device enclosure to the ambient air, and a primary louver located underneath the cowl. The primary louver includes an inclined surface configured to direct fluid away from the opening. The fluid protection cover further includes a first end cap and a second end cap. Each end cap is configured to fit at least partially over an exterior face of the electronic device enclosure and join the cowl to the primary louver.

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