TEST STRUCTURE AND METHOD FOR DETECTING AND STUDYING CRYSTAL LATTICE DISLOCATION DEFECTS IN INTEGRATED CIRCUIT DEVICES
    1.
    发明申请
    TEST STRUCTURE AND METHOD FOR DETECTING AND STUDYING CRYSTAL LATTICE DISLOCATION DEFECTS IN INTEGRATED CIRCUIT DEVICES 失效
    用于检测和研究集成电路设备中的晶体尺寸分离缺陷的测试结构和方法

    公开(公告)号:US20070051948A1

    公开(公告)日:2007-03-08

    申请号:US11162128

    申请日:2005-08-30

    IPC分类号: H01L23/58

    CPC分类号: H01L22/32

    摘要: A test structure (200, 200′) having an array (224) of test devices (220) for detecting and studying defects that can occur in an integrated circuit device, e.g., a transistor (144), due to the relative positioning of one component (100) of the device with respect to another component (108) of the device. The test devices in the array are of a like kind, but vary in their configuration. The differences in the configurations are predetermined and selected with the intent of forcing defects to occur within at least some of the test devices. During testing, the responses of the test devices are sensed so as to determine whether or not a defect has occurred in any one or more of the test devices. If a defective test device is detected, the corresponding wafer (204) may be subjected to physical failure analysis for yield learning.

    摘要翻译: 一种测试结构(200,200'),具有用于检测和研究集成电路器件例如晶体管(144)中可能发生的缺陷的测试器件(220)的阵列(224),由于一个 相对于设备的另一组件(108)的设备的组件(100)。 阵列中的测试设备是类似的,但是它们的配置是不同的。 配置中的差异是预先确定的,其目的是强制在至少一些测试设备内发生缺陷。 在测试期间,感测测试装置的响应,以便确定在任何一个或多个测试装置中是否发生了缺陷。 如果检测到有缺陷的测试装置,则可以对相应的晶片(204)进行用于产量学习的物理故障分析。

    System and method for random defect yield simulation of chip with built-in redundancy
    2.
    发明授权
    System and method for random defect yield simulation of chip with built-in redundancy 有权
    具有内置冗余的芯片的随机缺陷产量仿真的系统和方法

    公开(公告)号:US07984399B1

    公开(公告)日:2011-07-19

    申请号:US11965681

    申请日:2007-12-27

    IPC分类号: G06F17/50 G06F9/455

    CPC分类号: G06F17/5068

    摘要: In random defect yield simulation, a specific defect size interacts with a specific physical design and has a calculated probability of failure associated with it. The failure model is in terms of probability of failure. It provides a solution to the random defect yield simulation problem of chips with a built-in redundancy scheme. The solution first defines the independent failure modes of the chip with a built-in redundancy scheme and efficiently models each mode. Then, it may accumulate the respective probability of failures according to the chip's architecture.

    摘要翻译: 在随机缺陷产量模拟中,特定的缺陷尺寸与特定的物理设计相互作用并具有与之相关联的故障的故障概率。 故障模型是以故障概率为依据的。 它提供了具有内置冗余方案的芯片的随机缺陷产量模拟问题的解决方案。 该解决方案首先通过内置冗余方案定义了芯片的独立故障模式,并有效地模拟了每种模式。 然后,它可以根据芯片的架构累积各自的故障概率。