EXPANDABLE IMPLANT AND IMPLANT SYSTEM
    5.
    发明公开

    公开(公告)号:US20240008875A1

    公开(公告)日:2024-01-11

    申请号:US18469671

    申请日:2023-09-19

    IPC分类号: A61F2/06

    CPC分类号: A61F2/06 A61F2310/00071

    摘要: An embodiment of the invention includes an expandable implant to endovascularly embolize an anatomical void or malformation, such as an aneurysm. An embodiment is comprised of a chain or linked sequence of expandable polymer foam elements. Another embodiment includes an elongated length of expandable polymer foam coupled to a backbone. Another embodiment includes a system for endovascular delivery of an expandable implant (e.g., shape memory polymer) to embolize an aneurysm. The system may include a microcatheter, a lumen-reducing collar coupled to the distal tip of the microcatheter, a flexible pushing element detachably coupled to an expandable implant, and a flexible tubular sheath inside of which the compressed implant and pushing element are pre-loaded. Other embodiments are described herein.