公开(公告)号：US06822258B2

公开(公告)日：2004-11-23

申请号：US10377693

申请日：2003-03-04

申请人： Jong-Hong Lu ,  Huai-Luh Chang ,  Chiung-Hsiung Chen ,  Yi-Ping Huang ,  Sheng-Ju Liao ,  Yuh-Fwu Chou ,  Ho-Yin Pun

发明人： Jong-Hong Lu ,  Huai-Luh Chang ,  Chiung-Hsiung Chen ,  Yi-Ping Huang ,  Sheng-Ju Liao ,  Yuh-Fwu Chou ,  Ho-Yin Pun

IPC分类号： H01L2912

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/2855 ,  H01L29/861

摘要： A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.

公开(公告)号：US06667072B2

公开(公告)日：2003-12-23

申请号：US10023878

申请日：2001-12-21

申请人： Geoffrey Wen-Tai Shuy ,  Jong-Hong Lu ,  Sheng-Ju Liao ,  Huai-Luh Chang ,  Song-Wein Hong ,  Ruey-Cheng Huang

发明人： Geoffrey Wen-Tai Shuy ,  Jong-Hong Lu ,  Sheng-Ju Liao ,  Huai-Luh Chang ,  Song-Wein Hong ,  Ruey-Cheng Huang

IPC分类号： B05D512

CPC分类号： C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/38 ,  C04B41/5022 ,  C04B41/4582 ,  C04B41/5024 ,  C04B41/4572 ,  C04B41/5155 ,  C04B35/10

摘要： This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate consists of a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate provides structural strength and surface-mount capability. The buffer layer provides the adhesion between the substrate and the nanostructure layer. The nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhances adhesion for metallization and electronic materials.

摘要翻译： 本发明提供了在陶瓷衬底平面化上使用多孔材料的概念。 该平坦化衬底由陶瓷衬底，缓冲层和纳米结构层组成。 陶瓷基板提供结构强度和表面贴装能力。 缓冲层提供了衬底和纳米结构层之间的粘附。 纳米结构层提供陶瓷基底所需的表面平滑度，用于执行薄膜加工技术并增强金属化和电子材料的粘合性。

公开(公告)号：US20120059097A1

公开(公告)日：2012-03-08

申请号：US13040266

申请日：2011-03-04

申请人： Sheng-Ju Liao ,  Chien-Ming Chen ,  Chih-Jen Chang ,  Yao-Chu Chung ,  Cheng-Feng Liao ,  Hsieh-Yung Chang

发明人： Sheng-Ju Liao ,  Chien-Ming Chen ,  Chih-Jen Chang ,  Yao-Chu Chung ,  Cheng-Feng Liao ,  Hsieh-Yung Chang

IPC分类号： C08L3/00 ,  C08K5/1539 ,  C08K5/101

CPC分类号： C08L3/04 ,  C08L3/02 ,  C08L55/02 ,  C08L69/00

摘要： In an embodiment, a starch-based thermoplastic composite is provided. The starch-based thermoplastic composite includes thermoplastic starch (TPS), polycarbonate (PC) and acrylonitrile butadiene styrene (ABS), wherein the polycarbonate has a weight ratio of 15-60% in the starch-based thermoplastic composite. The starch-based thermoplastic composite further includes an impact modifier and a compatibilizer.

摘要翻译： 在一个实施方案中，提供了淀粉基热塑性复合材料。 淀粉类热塑性复合材料包括热塑性淀粉（TPS），聚碳酸酯（PC）和丙烯腈丁二烯苯乙烯（ABS），其中聚碳酸酯在淀粉基热塑性复合材料中的重量比为15-60％。 淀粉类热塑性复合材料还包括抗冲改性剂和增容剂。