CONDUCTIVE PASTE COMPOSITION
    1.
    发明申请
    CONDUCTIVE PASTE COMPOSITION 审中-公开
    导电胶组合物

    公开(公告)号:US20110193028A1

    公开(公告)日:2011-08-11

    申请号:US13060884

    申请日:2009-08-28

    IPC分类号: H01B1/20

    摘要: The present invention relates to a conductive paste composition. The conductive paste composition includes a binder resin including a urethane group present in a main chain or a side chain, especially a binder resin formed from isocyanate and a polymer with at least one hydroxyl group, a fine powder, a glass frit, and a solvent. The conductive paste composition can have a superior physical property, improve productivity and an environmental problem by reducing waste fluid such as aqueous alkaline solution, and form a fine pattern having an improved structure. Accordingly, the paste composition is especially useful for a paste for gravure offset printing.

    摘要翻译: 本发明涉及一种导电糊组合物。 导电性糊料组合物包括粘合剂树脂,其包含存在于主链或侧链中的氨基甲酸酯基团,特别是由异氰酸酯形成的粘合剂树脂和具有至少一个羟基的聚合物,细粉末,玻璃料和溶剂 。 导电糊组合物可以通过减少诸如碱性水溶液的废液,具有优异的物理性能,提高生产率和环境问题,并形成具有改进结构的精细图案。 因此,糊剂组合物对于凹版胶版印刷用糊剂特别有用。