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    Inductor integrated chip
    1.
    发明授权
    Inductor integrated chip 有权
    电感集成芯片

    公开(公告)号：US07615842B2

    公开(公告)日：2009-11-10

    申请号：US11473079

    申请日：2006-06-23

    申请人： Joo-ho Lee ,  Hae-seok Park ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    发明人： Joo-ho Lee ,  Hae-seok Park ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    IPC分类号： H01L29/00

    CPC分类号： H03H9/0542 ,  H03H9/105

    摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.

    摘要翻译： 提供一种电感器集成芯片及其制造方法。 电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。 该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof
    2.
    发明授权
    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
    包括用于隔离元件的气腔，双工器和双工器制造方法的片上系统结构

    公开(公告)号：US07498900B2

    公开(公告)日：2009-03-03

    申请号：US11517371

    申请日：2006-09-08

    申请人： Joo-ho Lee ,  Hae-seok Park ,  In-sang Song ,  Byeoung-ju Ha ,  Seog-woo Hong

    发明人： Joo-ho Lee ,  Hae-seok Park ,  In-sang Song ,  Byeoung-ju Ha ,  Seog-woo Hong

    IPC分类号： H03H9/00

    CPC分类号： H01L27/0805 ,  H03H9/0571 ,  H03H9/588 ,  H03H9/706

    摘要： A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.

    摘要翻译： 防止发射机和接收机滤波器之间影响的双工器。 双工器包括基板，在基板的表面上的预定的第一区域中制造的发送器滤波器，在基板的表面上的预定的第二区域中制造的接收滤波器，以及在预定的第一和第 第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。 空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。 因此，可以有效地截获元素之间的物理效应。

    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof
    3.
    发明申请
    System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof 有权
    包括用于隔离元件的气腔，双工器和双工器制造方法的片上系统结构

    公开(公告)号：US20070126527A1

    公开(公告)日：2007-06-07

    申请号：US11517371

    申请日：2006-09-08

    申请人： Joo-ho Lee ,  Hae-seok Park ,  In-sang Song ,  Byeoung-ju Ha ,  Seog-woo Hong

    发明人： Joo-ho Lee ,  Hae-seok Park ,  In-sang Song ,  Byeoung-ju Ha ,  Seog-woo Hong

    IPC分类号： H03H9/70

    CPC分类号： H01L27/0805 ,  H03H9/0571 ,  H03H9/588 ,  H03H9/706

    摘要： A duplexer which prevents effects between transmitter and receiver filters. The duplexer include a substrate, a transmitter filter fabricated in a predetermined first area on a surface of the substrate, a receiver filter fabricated in a predetermined second area on the surface of the substrate and an air cavity fabricated in an area between the predetermined first and second areas by etching the substrate to isolate the transmitter and receiver filters from each other. The air cavity is fabricated in the substrate perpendicular to directions along which the transmitter and receiver filters are disposed. Accordingly, physical effects among elements can be effectively intercepted.

    摘要翻译： 防止发射机和接收机滤波器之间影响的双工器。 双工器包括基板，在基板的表面上的预定的第一区域中制造的发送器滤波器，在基板的表面上的预定的第二区域中制造的接收滤波器，以及在预定的第一和第 第二区域通过蚀刻基板以将发射器和接收器滤波器彼此隔离。 空气腔垂直于发射器和接收器滤波器布置的方向在衬底上制造。 因此，可以有效地截获元素之间的物理效应。

    Inductor integrated chip and fabrication method thereof
    4.
    发明申请
    Inductor integrated chip and fabrication method thereof 有权
    电感集成芯片及其制造方法

    公开(公告)号：US20070138594A1

    公开(公告)日：2007-06-21

    申请号：US11473079

    申请日：2006-06-23

    申请人： Joo-ho Lee ,  Hae-seok Park ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    发明人： Joo-ho Lee ,  Hae-seok Park ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    IPC分类号： H01L29/00

    CPC分类号： H03H9/0542 ,  H03H9/105

    摘要： An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.

    摘要翻译： 提供一种电感器集成芯片及其制造方法。 电感器集成芯片包括晶片; 结合在晶片表面上的电感器; 电路元件，其形成在所述晶片的表面上并且耦合到所述电感器的第一端; 连接到晶片表面并封装电感器和电路元件的封装晶片; 以及形成在封装晶片上并连接到电感器的第二端的连接电极。 该方法包括在晶片的表面上形成电感器和电路元件，其中电路元件耦合到电感器的第一端; 在封装晶片上形成连接电极; 并且通过接合晶片和封装晶片来封装电感器和电路元件，以将连接电极与电感器的第二端连接。

    Coupled resonator filter and fabrication method thereof
    5.
    发明授权
    Coupled resonator filter and fabrication method thereof 有权
    耦合谐振滤波器及其制造方法

    公开(公告)号：US07548139B2

    公开(公告)日：2009-06-16

    申请号：US11455190

    申请日：2006-06-19

    申请人： Hao-seok Park ,  Joo-ho Lee ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    发明人： Hao-seok Park ,  Joo-ho Lee ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    IPC分类号： H03H9/17 ,  H03H9/00

    CPC分类号： H03H9/584 ,  H03H3/04 ,  H03H9/587 ,  H03H9/588

    摘要： A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.

    摘要翻译： 提供耦合谐振滤波器和制造耦合谐振滤波器的方法。 该方法包括：在基板的表面上依次堆叠第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极; 顺序地构图第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极，以暴露第一，第二和第三电极的区域; 形成分别连接到第一，第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

    Coupled resonator filter and fabrication method thereof
    6.
    发明申请
    Coupled resonator filter and fabrication method thereof 有权
    耦合谐振滤波器及其制造方法

    公开(公告)号：US20070139139A1

    公开(公告)日：2007-06-21

    申请号：US11455190

    申请日：2006-06-19

    申请人： Hao-seok Park ,  Joo-ho Lee ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    发明人： Hao-seok Park ,  Joo-ho Lee ,  Byeoung-ju Ha ,  Seog-woo Hong ,  Hyung Choi ,  In-sang Song

    IPC分类号： H03H9/54

    CPC分类号： H03H9/584 ,  H03H3/04 ,  H03H9/587 ,  H03H9/588

    摘要： A coupled resonator filter and a method of fabricating the coupled resonator filter are provided. The method includes: sequentially stacking a first electrode, a first piezoelectric layer, a second electrode, an insulating layer, a third electrode, a second piezoelectric layer, and a fourth electrode on a surface of a substrate; sequentially patterning the first electrode, the first piezoelectric layer, the second electrode, the insulating layer, the third electrode, the second piezoelectric layer, and the fourth electrode to expose areas of the first, second, and third electrodes; forming a plurality of connection electrodes respectively connected to the exposed areas of the first, second, and third electrodes and an area of the fourth electrode; and etching an area of the substrate underneath the first electrode to form an air gap.

    摘要翻译： 提供耦合谐振滤波器和制造耦合谐振滤波器的方法。 该方法包括：在基板的表面上依次堆叠第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极; 顺序地构图第一电极，第一压电层，第二电极，绝缘层，第三电极，第二压电层和第四电极，以暴露第一，第二和第三电极的区域; 形成分别连接到第一，第二和第三电极的暴露区域和第四电极的区域的多个连接电极; 并且蚀刻在第一电极下方的衬底的区域以形成气隙。

    RF module with multi-stack structure
    7.
    发明授权
    RF module with multi-stack structure 有权
    RF模块具有多堆叠结构

    公开(公告)号：US07675154B2

    公开(公告)日：2010-03-09

    申请号：US11634247

    申请日：2006-12-06

    申请人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    发明人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H03H9/0547 ,  H01L2924/0002 ,  H03H9/587 ,  H01L2924/00

    摘要： A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.

    摘要翻译： 射频（RF）模块和包括其的多RF模块包括基底基板，能够处理形成在基底基板上的RF信号的第一元件，能够处理从第一元件分离并布置在第一元件上的RF信号的第二元件 ，与所述基底衬底耦合以封装所述第一和第二元件的帽衬底，所述第一和第二元件包括将所述第一和第二元件电连接到外部的多个通孔，以及封装并连接所述基底衬底和所述帽衬底的焊盘，以及 将第一和第二元件电连接到贯通电极。

    RF module, multi RF module including the RF module, and method of manufacturing the RF module
    8.
    发明申请
    RF module, multi RF module including the RF module, and method of manufacturing the RF module 有权
    RF模块，包括RF模块的多RF模块和RF模块的制造方法

    公开(公告)号：US20070170565A1

    公开(公告)日：2007-07-26

    申请号：US11634247

    申请日：2006-12-06

    申请人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    发明人： Seog-woo Hong ,  In-sang Song ,  Byeong-ju Ha ,  Hae-seok Park ,  Jun-sik Hwang ,  Joo-ho Lee

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547 ,  H01L2924/0002 ,  H03H9/587 ,  H01L2924/00

    摘要： A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.

    摘要翻译： 射频（RF）模块和包括其的多RF模块包括基底基板，能够处理形成在基底基板上的RF信号的第一元件，能够处理从第一元件分离并布置在第一元件上的RF信号的第二元件 ，与所述基底衬底耦合以封装所述第一和第二元件的帽衬底，所述第一和第二元件包括将所述第一和第二元件电连接到外部的多个通孔，以及封装并连接所述基底衬底和所述帽衬底的焊盘，以及 将第一和第二元件电连接到贯通电极。