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1.发明公开公开(公告)号：US20240297632A1
公开(公告)日：2024-09-05
申请号：US18441907
申请日：2024-02-14
发明人： Satoru Matsuda , Naoya Iwamoto , Hisatada Yasukawa
CPC分类号： H03H9/02086 , H03H3/04 , H03H9/132 , H03H9/568 , H03H2003/0428
摘要： An acoustic wave filter includes a plurality of acoustic wave resonators configured to filter a radio frequency signal, each of the plurality of acoustic wave resonators having a different frequency response and including a piezoelectric structure and a metal top electrode structure, one or more of the acoustic wave resonators having a mass loading portion that is a single seamless piece with the metal top electrode.
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公开(公告)号：US11942919B2
公开(公告)日：2024-03-26
申请号：US17145665
申请日：2021-01-11
申请人： Raytheon Company
CPC分类号： H03H9/02133 , H03H3/04 , H03H9/02031 , H03H9/02102 , H03H9/174 , H03H9/176 , H03H2003/023 , H03H2003/0407
摘要： A strain compensated heterostructure comprising a substrate comprising silicon carbide material; a first epitaxial layer comprising single-crystal aluminum nitride material formed on a top surface of the substrate; a second epitaxial layer formed on the first epitaxial layer opposite the top surface of the substrate, the second epitaxial layer comprising single-crystal scandium aluminum nitride material; and a third epitaxial layer formed on the second epitaxial layer opposite the first epitaxial layer, the third layer comprising single-crystal aluminum nitride material.
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公开(公告)号：US11923821B2
公开(公告)日：2024-03-05
申请号：US17351203
申请日：2021-06-17
CPC分类号： H03H9/02228 , H03H3/04 , H03H9/02031 , H03H9/132 , H03H9/174 , H03H9/176 , H03H9/562 , H03H9/564 , H03H9/568 , H03H2003/023 , H03H2003/0442
摘要： Acoustic filters, resonators and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate including a diaphragm that spans a cavity in the substrate. A conductor pattern includes an interdigital transducer (IDT) with interleaved parallel fingers on the diaphragm. A ratio of a width of either of two adjacent parallel fingers and a center-to-center spacing between the two adjacent parallel fingers is greater than or equal to 0.2 and less than or equal to 0.3.
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4.发明公开公开(公告)号：US20240048125A1
公开(公告)日：2024-02-08
申请号：US18229590
申请日：2023-08-02
发明人： Rei Goto , Hironori Fukuhara , Shoji Okamoto
CPC分类号： H03H9/6453 , H03H9/25 , H03H3/04 , H03H9/02559
摘要： A radio frequency acoustic filter includes a plurality of resonators arranged to filter a signal. At least one resonator of the plurality of resonators includes a support substrate, a functional layer, and a piezoelectric layer. Both the piezoelectric layer and the functional layer are supported by the support substrate. An interdigital transducer structure is at least partially formed in the piezoelectric layer.
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公开(公告)号：US11894823B2
公开(公告)日：2024-02-06
申请号：US16386850
申请日：2019-04-17
申请人： DISCO CORPORATION
发明人： Kenya Kai
CPC分类号： H03H3/08 , H03H3/04 , H03H9/02559 , H03H9/02622 , H03H2003/0435 , Y10T29/42 , Y10T29/49005
摘要： A SAW device manufacturing method includes a piezoelectric ceramic substrate polishing step of polishing a first surface of the piezoelectric ceramic substrate, a support substrate polishing step of polishing a first surface of the support substrate, a bonding step of bonding the first surface of the piezoelectric ceramic substrate to the first surface of the support substrate to thereby form a stacked substrate, a grinding step of grinding a second surface of the piezoelectric ceramic substrate, and a vibration diffusion layer forming step of applying a laser beam to the stacked substrate in the condition where the focal point of the laser beam is positioned inside the piezoelectric ceramic substrate to thereby form a modified layer as a vibration diffusion layer inside the piezoelectric ceramic substrate.
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公开(公告)号：US20240022228A1
公开(公告)日：2024-01-18
申请号：US18477307
申请日：2023-09-28
发明人： Sean MCHUGH
CPC分类号： H03H9/02228 , H03H3/04 , H03H9/02031 , H03H9/02102 , H03H9/174 , H03H9/562 , H03H9/564 , H03H9/568 , H03H9/176 , H03H2003/0442 , H03H2003/023
摘要： Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate supported by the substrate. A portion of the piezoelectric plate suspended across a cavity in the substrate forms a diaphragm. A decoupling dielectric layer is on a front surface of the diaphragm. An interdigital transducer (IDT) has interleaved fingers on the decoupling dielectric layer over the diaphragm. The IDT and piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites shear acoustic waves in the diaphragm.
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公开(公告)号：US11831296B2
公开(公告)日：2023-11-28
申请号：US17534913
申请日：2021-11-24
CPC分类号： H03H9/19 , H03B5/32 , H03H3/04 , H03H9/0595 , H03H9/105 , H03H9/132 , H03H9/215 , H03H2003/0428 , H03H2003/0442
摘要： There is provided a piezoelectric vibrator element which is excellent in vibration characteristics, high in quality, and capable of suppressing a frequency fluctuation after a frequency adjustment. The piezoelectric vibrator element is provided with a piezoelectric plate having a pair of vibrating arm parts, an electrode film disposed on obverse and reverse surfaces of the piezoelectric plate, and weight metal films for a frequency adjustment disposed on the electrode film at the obverse surface side in the vibrating arm parts. The reverse surface of the vibrating arm part has a reverse side exposure part from which the piezoelectric plate is exposed. The obverse surface of the vibrating arm part has an obverse side exposure part from which the weight metal film and the electrode film are removed, and from which the piezoelectric plate is exposed. A whole of the obverse side exposure part overlaps the reverse side exposure part at a distance from the electrode film on the reverse surface viewed from a thickness direction of the piezoelectric plate.
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公开(公告)号：US20230275553A1
公开(公告)日：2023-08-31
申请号：US17683086
申请日：2022-02-28
CPC分类号： H03H9/02015 , H03H3/04 , H03H9/175 , H03H2003/0435
摘要： In some examples, an apparatus includes a first metal layer having a thickness, a piezoelectric material layer having a first side and a second side that is opposite the first side, the piezoelectric material layer first side abutting the first metal layer, the piezoelectric material layer second side having recesses, and a second metal layer abutting the piezoelectric material layer second side, the second metal layer having extensions that fill the recesses to form a metal frame that is at least partially recessed into the piezoelectric material layer. The first metal layer, the piezoelectric material layer, and the second metal layer form a resonator body. The metal frame has a shape governing a resonant mode of the resonator body.
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公开(公告)号：US20230261626A1
公开(公告)日：2023-08-17
申请号：US18169251
申请日：2023-02-15
发明人： Sean McHugh
CPC分类号： H03H3/04 , H03H9/02228 , H03H9/174 , H03H9/176 , H03H9/562 , H03H9/564 , H03H9/568 , H03H2003/023
摘要： A filter device is provided that includes a substrate and a piezoelectric plate attached to the substrate. A conductor pattern is formed at a first surface of the piezoelectric plate and includes interdigital transducers of series and shunt resonators that each have interleaved fingers at respective diaphragms of the plate suspended. A first dielectric coating layer is formed over the interleaved fingers of the IDTs and on the first surface of the piezoelectric plate; and a second dielectric coating layer is formed on the second surface of the piezoelectric plate that is opposite the first surface. The second dielectric coating layer of the shunt resonator has a greater thickness than a thickness of the at least one second dielectric coating layer of the series resonator.
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公开(公告)号：US11689177B2
公开(公告)日：2023-06-27
申请号：US17406362
申请日：2021-08-19
发明人： Shigeo Ojima , Isao Ikeda , Koki Sai
CPC分类号： H03H9/02023 , H03H3/04 , H03H2003/0457
摘要： An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.
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