公开(公告)号：US20120171624A1

公开(公告)日：2012-07-05

申请号：US13419826

申请日：2012-03-14

申请人： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G03F7/20

CPC分类号： G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

摘要： Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

摘要翻译： 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US08036501B2

公开(公告)日：2011-10-11

申请号：US12588453

申请日：2009-10-15

申请人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

发明人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

摘要： The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

公开(公告)号：US20100142883A1

公开(公告)日：2010-06-10

申请号：US12385007

申请日：2009-03-27

申请人： Joon Sung Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Sang Hoon Kim

发明人： Joon Sung Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Sang Hoon Kim

IPC分类号： G02B6/12 ,  H01K3/10

CPC分类号： H05K3/00 ,  G02B6/138 ,  G02B2006/12073 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0187 ,  Y10T29/49165

摘要： Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part.

摘要翻译： 本文公开了一种用于光波导的印刷电路板，包括：基板; 具有通孔并形成在所述基板上的绝缘层; 形成在所述通孔的底部的下包层; 芯部分形成在下包层上; 以及形成在下包层和芯部上并因此覆盖芯部的露出表面的上覆层。

公开(公告)号：US08369676B2

公开(公告)日：2013-02-05

申请号：US12385007

申请日：2009-03-27

申请人： Joon Sung Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Sang Hoon Kim

发明人： Joon Sung Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Sang Hoon Kim

IPC分类号： G02B6/10 ,  G02B6/12

CPC分类号： H05K3/00 ,  G02B6/138 ,  G02B2006/12073 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0187 ,  Y10T29/49165

摘要： Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part.

摘要翻译： 本文公开了一种用于光波导的印刷电路板，包括：基板; 具有通孔并形成在所述基板上的绝缘层; 形成在所述通孔的底部的下包层; 芯部分形成在下包层上; 以及形成在下包层和芯部上并因此覆盖芯部的露出表面的上覆层。

公开(公告)号：US20100316329A1

公开(公告)日：2010-12-16

申请号：US12552918

申请日：2009-09-02

申请人： Han Seo CHO ,  Sang Hoon Kim ,  Joon Sung Kim ,  Jae Hyun Jung

发明人： Han Seo CHO ,  Sang Hoon Kim ,  Joon Sung Kim ,  Jae Hyun Jung

IPC分类号： G02B6/12

CPC分类号： G02B6/4214 ,  G02B6/43

摘要： Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency.

摘要翻译： 这里公开了一种光学元件封装基板，其被构造成使得具有空腔的电布线基板层叠在光波导的两侧，光学元件封装安装在电布线基板中，并且安装在光学器件的表面上的光学元件 元件封装容纳在空腔中，使得光学元件和光波导之间的距离减小，从而提高光学连接效率。

公开(公告)号：US20090290832A1

公开(公告)日：2009-11-26

申请号：US12216995

申请日：2008-07-14

申请人： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/132 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602

摘要： Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

摘要翻译： 这里公开了包括光波导的印刷电路板和制造该板的方法。 在该板中，光波导包括与构成在光波导中形成的反射镜的金属层一体连接的金属层延伸部。 由于本发明的方法使用通常用于制造一般印刷电路板的工艺中的化学镀的镜子，所以适用于制造面积大的印刷电路板，并且镜具有高反射率和 在材料消耗方面效率高。

公开(公告)号：US20090232467A1

公开(公告)日：2009-09-17

申请号：US12155755

申请日：2008-06-09

申请人： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G02B6/10 ,  H01B13/00

CPC分类号： G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

摘要： Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

摘要翻译： 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US08160417B2

公开(公告)日：2012-04-17

申请号：US12155755

申请日：2008-06-09

申请人： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G02B6/10

CPC分类号： G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

摘要： Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

公开(公告)号：US20120005890A1

公开(公告)日：2012-01-12

申请号：US13137754

申请日：2011-09-09

申请人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

发明人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC分类号： H05K3/36

CPC分类号： G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

摘要： A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.

公开(公告)号：US20110019959A1

公开(公告)日：2011-01-27

申请号：US12588453

申请日：2009-10-15

申请人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

发明人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC分类号： G02B6/12 ,  B29C65/48 ,  H05K3/36

CPC分类号： G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

摘要： The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

摘要翻译： 本发明涉及一种用于光波导的印刷电路板及其制造方法。 本发明提供了一种用于光波导的印刷电路板，包括：基底; 光波导，其形成在所述基底基板的上部中间并且包括下部包层，形成在所述下部包层的上部中间的芯部，以及形成在所述下部包层上的上部包层，以包围上表面和侧面 的核心; 以及侧基板，其形成在基底基板上，并且具有通孔，光波导穿过该通孔设置在其中间，形成在其中的电路图案以及制造用于光波导的印刷电路板的方法。