公开(公告)号：US20110036627A1

公开(公告)日：2011-02-17

申请号：US12809841

申请日：2008-12-11

申请人： Josef Loibl ,  Hermann- Josef Robin ,  Karl Smirra

发明人： Josef Loibl ,  Hermann- Josef Robin ,  Karl Smirra

IPC分类号： H01L23/48 ,  B23K31/02 ,  B23K26/20 ,  H05K1/09

CPC分类号： H01R43/0221 ,  H01L2924/0002 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/10416 ,  H05K2203/107 ,  H01L2924/00

摘要： A method for producing an electrical connection between a rigid printed circuit board and a metallic contact partner, includes preparing the rigid printed circuit board having at least one copper layer and at least one prepreg layer, bringing the metallic contact partner and the printed circuit board together in such a way that the metallic contact partner is brought into contact with a contact pad on the copper layer of the printed circuit board, forming a cutout in the printed circuit board by removing the prepreg layer in at least one partial region of the contact pad, and irradiating with laser light to form a weld connection between the contact partner and the contact pad. A configuration of a rigid printed circuit board, a metallic contact partner and an electrical connection point, as well as a module having such a configuration, are also provided.

摘要翻译： 一种用于在刚性印刷电路板和金属接触配合体之间制造电连接的方法，包括制备具有至少一个铜层和至少一个预浸料层的刚性印刷电路板，使金属接触对象和印刷电路板在一起 使得金属接触对象与印刷电路板的铜层上的接触焊盘接触，通过在接触垫的至少一个部分区域中去除预浸料层，在印刷电路板中形成切口 并且用激光照射以在接触对象和接触垫之间形成焊接连接​​。 还提供了刚性印刷电路板，金属接触对象和电连接点的配置，以及具有这种结构的模块。