公开(公告)号：US07934513B2

公开(公告)日：2011-05-03

申请号：US10574113

申请日：2004-10-07

申请人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

发明人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

IPC分类号： B08B3/00

CPC分类号： H01L21/67207 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67745

摘要： A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.

摘要翻译： 用于清洁诸如半导体晶片的基板的设备包括装载/卸载部分，其中晶片从水平状态重新定位到垂直状态的对准部分，执行晶片的蚀刻处理，漂洗和干燥处理的清洁部件，并且具有 多个处理室堆叠，以及界面部分，其中设置传送槽以在处理室之间传送晶片。 当晶片在处理室之间转移时，转移浴用去离子水（DI水）填充，以防止它们暴露于空气中。 从加载/非拉伸部分引出的晶片从水平状态重新定位到垂直状态，并被转移到作为处理室之一进行一部分处理的第一处理室。 在将晶片转移到作为要进行其它处理的另一个处理室的第二处理室之后，它们从垂直状态重新定位到水平状态。 也就是说，晶片沿着要被处理的环形传送。

公开(公告)号：US20070224820A1

公开(公告)日：2007-09-27

申请号：US10574113

申请日：2004-10-07

申请人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

发明人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

IPC分类号： H01L21/302

CPC分类号： H01L21/67207 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67745

摘要： A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.

摘要翻译： 用于清洁诸如半导体晶片的基板的设备包括装载/卸载部分，其中晶片从水平状态重新定位到垂直状态的对准部分，执行晶片的蚀刻处理，漂洗和干燥处理的清洁部件，并且具有 多个处理室堆叠，以及界面部分，其中设置传送槽以在处理室之间传送晶片。 当晶片在处理室之间转移时，转移浴用去离子水（DI水）填充，以防止它们暴露于空气中。 从加载/非拉伸部分引出的晶片从水平状态重新定位到垂直状态，并被转移到作为处理室之一进行一部分处理的第一处理室。 在将晶片转移到作为要进行其它处理的另一个处理室的第二处理室之后，它们从垂直状态重新定位到水平状态。 也就是说，晶片沿着要被处理的环形传送。

公开(公告)号：US07611182B2

公开(公告)日：2009-11-03

申请号：US11064856

申请日：2005-02-25

申请人： Woo-Young Kim ,  In-Ho Bang ,  Taek-Youb Lee

发明人： Woo-Young Kim ,  In-Ho Bang ,  Taek-Youb Lee

IPC分类号： B65G49/07

CPC分类号： H01L21/68707 ,  Y10S414/141

摘要： A wafer transfer apparatus may include a robot arm unit configured to be operated by a driving means, a blade configured to support a wafer and having a fix finger at a first end, and a clamping member attached to the robot arm. The clamping arm may also include a movable finger configured to hold a peripheral edge of the wafer, and a moving pusher attached to the movable finger and configured to guide the movable finger and the wafer on the blade towards the fix finger.

摘要翻译： 晶片传送装置可以包括被配置为由驱动装置操作的机器人臂单元，被配置为支撑晶片并且在第一端具有固定指的刀片以及附接到机器人手臂的夹紧构件。 夹持臂还可以包括被配置为保持晶片的周边边缘的可动指状物，以及附接到可动指状物的移动推动器，并构造成将可动指状物和刀片上的晶片引向固定指。

公开(公告)号：US20060192400A1

公开(公告)日：2006-08-31

申请号：US11064856

申请日：2005-02-25

申请人： Woo-Young Kim ,  In-Ho Bang ,  Taek-Youb Lee

发明人： Woo-Young Kim ,  In-Ho Bang ,  Taek-Youb Lee

IPC分类号： B65G49/07

CPC分类号： H01L21/68707 ,  Y10S414/141

摘要： The present invention is directed to a wafer transfer apparatus having cylinder-driving movable fingers. The wafer transfer apparatus a robot arm unit whose operation is controlled by driving means, a blade on which a wafer is placed, and a clamping member for locating the wafer placed on the blade in position while fixing the wafer. The blade is installed at the end of the robot arm unit, and-the clamping is installed at the blade.

摘要翻译： 本发明涉及具有气缸驱动活动指状物的晶片传送装置。 晶片传送装置，其操作由驱动装置控制的机器人手臂单元，放置晶片的刀片和用于将晶片放置在刀片上的晶片定位的夹紧构件，同时固定晶片。 刀片安装在机器人手臂单元的末端，夹紧装置安装在刀片上。