摘要:
Provided is a substrate processing apparatus for loading substrates such as solar cell substrates on a tray in substrate processing equipment for processing a large number of substrates. The substrate processing apparatus includes: a tray carrying unit configured to receive and carry a tray; a substrate loading conveyor unit on which substrates to be loaded on a tray are arranged in a line; a substrate unloading conveyor unit on which substrates unloaded from a tray are arranged in a line; a first substrate carrying robot configured to pick up substrates from the substrate loading conveyor unit and carry the substrates to a tray placed on the tray carrying unit; and a second substrate carrying robot configured to pick up substrates from a tray placed on the tray carrying unit and carry the substrates to the substrate unloading conveyor unit.
摘要:
There is provided an apparatus for treating a substrate using a plurality of treatment solutions in sequence. The apparatus includes treatment liquid collecting vessels for separately collecting used treatment solutions, and an exhaust member for separately discharging pollutant gases generated during a process.
摘要:
A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.
摘要:
Provided is a substrate processing apparatus for loading substrates such as solar cell substrates on a tray in substrate processing equipment for processing a large number of substrates. The substrate processing apparatus includes: a tray carrying unit configured to receive and carry a tray; a substrate loading conveyor unit on which substrates to be loaded on a tray are arranged in a line; a substrate unloading conveyor unit on which substrates unloaded from a tray are arranged in a line; a first substrate carrying robot configured to pick up substrates from the substrate loading conveyor unit and carry the substrates to a tray placed on the tray carrying unit; and a second substrate carrying robot configured to pick up substrates from a tray placed on the tray carrying unit and carry the substrates to the substrate unloading conveyor unit.
摘要:
A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.
摘要:
A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.
摘要:
A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.
摘要:
A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.
摘要:
An apparatus is provided for supplying a plurality of chemicals or gases to the surface of a substrate to clean and dry the substrate. The apparatus includes a substrate support unit with a chuck on which a substrate is loaded, a bottom chamber having an open top and configured to surround the circumference of the chuck, a top chamber configured to open or close the top of the bottom chamber such that a drying treatment for the substrate is performed while the substrate is isolated from the outside, and an indirect injection nozzle installed at the edge of the top chamber and configured to inject drying fluid toward the center of the top chamber such that the drying fluid is indirectly injected to the substrate. According to the apparatus, it is possible to enhance a substrate drying efficiency, suppress external contamination, and prevent the formation of an oxide layer.
摘要:
In an apparatus for transferring a substrate, a partition wall is disposed in a vertical direction in a housing to divide an interior space of the housing into a first space and a second space. A pressure generating member divides the first space into an upper space and a lower space and moves in a vertical direction in the first space such that a positive pressure and a negative pressure are alternately generated in the upper space and the lower space. A substrate supporting member is movably disposed in the second space to support and to transfer the substrate. A plurality of gates is disposed on a side wall of the housing and the partition wall, and is opened and closed by the positive pressure and the negative pressure such that the particles are eliminated from the second space to an exterior space via the first space.