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10 条记录 (耗时 0.042 秒)

    Biodegradable copolymer, and polymeric micelle composition containing the same
    7.
    发明申请
    Biodegradable copolymer, and polymeric micelle composition containing the same 有权
    生物可降解共聚物和含有它们的聚合胶束组合物

    公开(公告)号：US20050019303A1

    公开(公告)日：2005-01-27

    申请号：US10745975

    申请日：2003-12-29

    申请人： Bin-Hong Tsai ,  Jui-Hsiang Chen ,  Muh-Lan Chen ,  Yu-Hua Chen ,  Mei-Jung Liu

    发明人： Bin-Hong Tsai ,  Jui-Hsiang Chen ,  Muh-Lan Chen ,  Yu-Hua Chen ,  Mei-Jung Liu

    IPC分类号： A61K9/107 ,  A61K9/51 ,  A61K31/74 ,  A61K31/765 ,  A61K9/14

    CPC分类号： A61K9/1075 ,  A61K31/74 ,  A61K31/765

    摘要： A biodegradable copolymer with a core block comprising bioresorbable hydrophobic polyester segment and from 3 to 10 shell blocks comprising hydrophilic polyethylene glycol segment. The hydrophobic polyester segment and each of the hydrophilic polyethylene glycol segments are linked by a urethane linkage. A polymeric micelle composition containing the copolymer is also provided. The copolymer forms micelles when the concentration of the copolymer in a dispersing medium reaches or exceeds the critical micelle concentration. The micelles possess good drug and bioactive agent delivery characteristics and are suitable for use in drug delivery or cosmetic applications.

    摘要翻译： 具有芯块的可生物降解的共聚物，其包含生物可再吸收的疏水性聚酯链段和包含亲水性聚乙二醇链段的3至10个壳嵌段。 疏水性聚酯链段和亲水性聚乙二醇链段各自通过氨基甲酸酯键连接。 还提供含有该共聚物的聚合胶束组合物。 当共聚物在分散介质中的浓度达到或超过临界胶束浓度时，共聚物形成胶束。 胶束具有良好的药物和生物活性剂递送特性，适用于药物递送或化妆品应用。

    Biodegradable copolymer, and polymeric micelle composition containing the same
    8.
    发明授权
    Biodegradable copolymer, and polymeric micelle composition containing the same 有权
    生物可降解共聚物和含有它们的聚合胶束组合物

    公开(公告)号：US07655258B2

    公开(公告)日：2010-02-02

    申请号：US10745975

    申请日：2003-12-29

    申请人： Bin-Hong Tsai ,  Jui-Hsiang Chen ,  Muh-Lan Chen ,  Yu-Hua Chen ,  Mei-Jung Liu

    发明人： Bin-Hong Tsai ,  Jui-Hsiang Chen ,  Muh-Lan Chen ,  Yu-Hua Chen ,  Mei-Jung Liu

    IPC分类号： A61K9/14

    CPC分类号： A61K9/1075 ,  A61K31/74 ,  A61K31/765

    摘要： A biodegradable copolymer with a core block comprising bioresorbable hydrophobic polyester segment and from 3 to 10 shell blocks comprising hydrophilic polyethylene glycol segment. The hydrophobic polyester segment and each of the hydrophilic polyethylene glycol segments are linked by a urethane linkage. A polymeric micelle composition containing the copolymer is also provided. The copolymer forms micelles when the concentration of the copolymer in a dispersing medium reaches or exceeds the critical micelle concentration. The micelles possess good drug and bioactive agent delivery characteristics and are suitable for use in drug delivery or cosmetic applications.

    摘要翻译： 具有芯块的可生物降解的共聚物，其包含生物可再吸收的疏水性聚酯链段和包含亲水性聚乙二醇链段的3至10个壳嵌段。 疏水性聚酯链段和亲水性聚乙二醇链段各自通过氨基甲酸酯键连接。 还提供含有该共聚物的聚合胶束组合物。 当共聚物在分散介质中的浓度达到或超过临界胶束浓度时，共聚物形成胶束。 胶束具有良好的药物和生物活性剂递送特性，适用于药物递送或化妆品应用。

    METHOD FOR ENCAPSULATING A SUBSTRATE AND METHOD FOR FABRICATING A LIGHT EMITTING DIODE DEVICE
    9.
    发明申请
    METHOD FOR ENCAPSULATING A SUBSTRATE AND METHOD FOR FABRICATING A LIGHT EMITTING DIODE DEVICE 审中-公开
    用于封装基板的方法和用于制造发光二极管器件的方法

    公开(公告)号：US20120225510A1

    公开(公告)日：2012-09-06

    申请号：US13102215

    申请日：2011-05-06

    申请人： Bin-Hong Tsai

    发明人： Bin-Hong Tsai

    IPC分类号： H01L33/08

    CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

    摘要： The present invention relates to a method for encapsulating a substrate, which comprises:(a1) providing a substrate with a plurality of chips mounted on a top side of the substrate;(b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer;(c1) exposing the photoresist layer to a light source through a mask to form unexposed photoresist regions and exposed photoresist regions;(d1) developing the photoresist layer to uncover underlying portions of the unexposed photoresist regions;(e1) molding the top side of the substrate with a molding material;(f1) curing the molding material; and(g1) removing the unexposed photoresist regions from the substrate with a photoresist-removing agent.

    摘要翻译： 本发明涉及一种用于封装衬底的方法，其包括：（a1）提供衬底，其具有安装在衬底的顶侧上的多个芯片; （b1）在基板的顶侧压缩干膜光致抗蚀剂以形成光致抗蚀剂层; （c1）通过掩模将光致抗蚀剂层暴露于光源以形成未曝光的光致抗蚀剂区域和曝光的光致抗蚀剂区域; （d1）显影光致抗蚀剂层以露出未曝光的光致抗蚀剂区域的下面部分; （e1）用模塑材料成型衬底的顶侧; （f1）固化成型材料; 和（g1）用光致抗蚀剂去除剂从衬底去除曝光的光致抗蚀剂区域。

    Method for encapsulating a substrate and method for fabricating a light emitting diode device
    10.
    发明授权
    Method for encapsulating a substrate and method for fabricating a light emitting diode device 失效
    用于封装衬底的方法和用于制造发光二极管器件的方法

    公开(公告)号：US07939350B2

    公开(公告)日：2011-05-10

    申请号：US12341037

    申请日：2008-12-22

    申请人： Bin-Hong Tsai

    发明人： Bin-Hong Tsai

    IPC分类号： H01L21/00

    CPC分类号： H01L21/56 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention relates to a method for encapsulating a substrate, which comprises: (a1) providing a substrate with a plurality of chips mounted on a top of the substrate; (b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer; (c1) exposing the photoresist layer to a light source through a mask to form unexposed photoresist regions and exposed photoresist regions; (d1) developing the photoresist layer to uncover underlying portions of the unexposed photoresist regions; (e1) molding the top side of the substrate with a molding material; (f1) curing the molding material; and (g1) removing the unexposed photoresist regions from the substrate with a photoresist-removing agent.

    摘要翻译： 本发明涉及一种封装衬底的方法，包括：（a1）提供衬底，该衬底安装在衬底顶部上的多个芯片; （b1）在基板的顶侧压缩干膜光致抗蚀剂以形成光致抗蚀剂层; （c1）通过掩模将光致抗蚀剂层暴露于光源以形成未曝光的光致抗蚀剂区域和曝光的光致抗蚀剂区域; （d1）显影光致抗蚀剂层以露出未曝光的光致抗蚀剂区域的下面部分; （e1）用模塑材料成型衬底的顶侧; （f1）固化成型材料; 和（g1）用光致抗蚀剂去除剂从衬底去除曝光的光致抗蚀剂区域。