公开(公告)号：US07948750B2

公开(公告)日：2011-05-24

申请号：US12503082

申请日：2009-07-15

申请人： Jui-Wen Hung ,  Nien-Tien Cheng ,  Ping-Yang Chuang

发明人： Jui-Wen Hung ,  Nien-Tien Cheng ,  Ping-Yang Chuang

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F1/183 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.

摘要翻译： 电子设备包括底盘，电子部件，具有底座和散热模块的散热器。 底盘包括底板和围绕底板的侧板。 侧板上设有切口。 电子部件布置在底板上并面向侧板的切口。 散热器的底座布置在电子部件上，散热模块布置在散热片的底部。 热模块通过延伸穿过切口组装在基座上，并可通过切口从机架中取出。 当热模块插入机箱时，热模块和散热器一起散发电子部件产生的热量。

公开(公告)号：US07869215B2

公开(公告)日：2011-01-11

申请号：US12506214

申请日：2009-07-20

申请人： Jui-Wen Hung ,  Nien-Tien Cheng ,  Ping-Yang Chuang

发明人： Jui-Wen Hung ,  Nien-Tien Cheng ,  Ping-Yang Chuang

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： G06F1/203

摘要： An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

摘要翻译： 电子设备包括壳体，容纳在壳体中的电子部件和固定部件。 壳体包括限定在其侧壁中的切口，用于将散热构件组装或拆卸到电子设备中或从电子设备排出。 固定构件连接到壳体的顶壁。 固定构件包括细长杆，连接到细长杆的外端并邻近切口定位的引导杆，以及位于细长杆的内端处并位于电子部件上方的弹性元件。 当散热构件组装到电子设备中以与电子部件接触时，弹性元件被压缩并邻接散热构件。

公开(公告)号：US08292464B2

公开(公告)日：2012-10-23

申请号：US13169037

申请日：2011-06-27

申请人： Jui-Wen Hung ,  Ben-Fan Xia

发明人： Jui-Wen Hung ,  Ben-Fan Xia

IPC分类号： F21V29/00

CPC分类号： F21V29/51 ,  B21D53/02 ,  F21K9/23 ,  F21V3/00 ,  F21V29/006 ,  F21V29/77 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink, a reflecting cup, a heat pipe and an LED. The heat sink includes fins cooperatively defining a receiving space therein. Each of the fins includes a plate-shaped main body and a flange extending rearward from a periphery side of the main body. The flanges are connected to each other to cooperatively form an annular supporting surface. The reflecting cup is received in the receiving space of the heat sink. The heat pipe includes an evaporating section located above the reflecting cup and a condensing section thermally connecting with the annular supporting surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface facing downwardly towards the reflecting cup.

摘要翻译： LED灯包括散热器，反射杯，热管和LED。 散热器包括在其中协作地限定其中的接收空间的翅片。 每个翅片包括板状主体和从主体的周边向后延伸的凸缘。 凸缘彼此连接以协同地形成环形支撑表面。 反射杯被接收在散热器的接收空间中。 热管包括位于反射杯上方的蒸发部分和与散热片的环形支撑表面热连接的冷凝部分。 LED直接安装在蒸发部分上，发光面向下朝向反射杯。

公开(公告)号：US08079406B2

公开(公告)日：2011-12-20

申请号：US11873786

申请日：2007-10-17

申请人： Jui-Wen Hung ,  Ching-Bai Hwang ,  Jie Zhang

发明人： Jui-Wen Hung ,  Ching-Bai Hwang ,  Jie Zhang

IPC分类号： H05K7/20

CPC分类号： F16B2/241

摘要： A thermal module includes a centrifugal blower (10), a heat sink (20) mounted to an air outlet (11) of the centrifugal blower, a heat pipe (40) connecting the heat sink with a heat generating electronic component, and a resilient clip (80) for mounting the heat pipe onto the heat generating electronic component. The resilient clip includes an M-shaped pressing portion (82) disposed above an evaporation section (44) of the heat pipe, a plate portion (83) disposed at one end of the pressing portion for being fixed to a sidewall (53d), and an abutting portion (85) disposed at the other end of the pressing portion and including an abutting plate (85b) for abutting against a bottom surface of another sidewall (53b).

摘要翻译： 热模块包括离心式鼓风机（10），安装在离心式鼓风机的出风口（11）上的散热器（20），连接散热器和发热电子部件的热管（40） 夹具（80），用于将热管安装到发热电子部件上。 弹性夹包括设置在热管的蒸发部分（44）上方的M形按压部分（82），设置在按压部分的一端处以固定到侧壁（53d）的板部分（83） 以及设置在所述按压部的另一端的抵接部（85），并且具有抵靠另一侧壁（53b）的底面的抵接板（85b）。

公开(公告)号：US07613000B2

公开(公告)日：2009-11-03

申请号：US11953714

申请日：2007-12-10

申请人： Jui-Wen Hung ,  Ching-Bai Hwang

发明人： Jui-Wen Hung ,  Ching-Bai Hwang

IPC分类号： H05K7/20 ,  F28F7/00 ,  F28F13/00 ,  F03D11/04 ,  F04D29/40

CPC分类号： F04D25/0613 ,  F04D25/0693

摘要： A heat dissipation device includes a fan (200), a first wire collection structure (280) and a second wire collection structure (290). The fan (200) includes a frame (210) and an impeller (240) disposed in the frame (210). The first wire collection structure (280) is formed on the frame (210) to collect wires (270) of the fan (200). The second wire collection structure (290) is formed on the frame (210) and configured for collecting wires (460) of another component other than the fan (200).

公开(公告)号：US07489510B1

公开(公告)日：2009-02-10

申请号：US11964905

申请日：2007-12-27

申请人： Jui-Wen Hung ,  Cheng-Jen Liang

发明人： Jui-Wen Hung ,  Cheng-Jen Liang

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal module includes a heat sink (400), a heat pipe (200) and a fastening device (300). The heat pipe (200) includes an evaporator (240) and a condenser (220) connected with the heat sink. The fastening device includes a base member (320) and a spring member (340). The base member includes a contacting plate (322) and two locating pins (324). Each locating pin includes a head portion (3240) and a neck portion (3244). The spring member includes a pressing portion (342) pressing the evaporator towards the contacting plate. Two locating holes (348) are defined in the pressing portion. The spring member is mounted on the base member via engagement of the locating holes with the locating pins. The spring member has a thickness smaller than a length of each of the neck portions and is movable along the neck portions to suit for a size of the evaporator.

摘要翻译： 热模块包括散热器（400），热管（200）和紧固装置（300）。 热管（200）包括与散热器连接的蒸发器（240）和冷凝器（220）。 紧固装置包括基部构件（320）和弹簧构件（340）。 基座构件包括接触板（322）和两个定位销（324）。 每个定位销包括头部（3240）和颈部（3244）。 弹簧构件包括将蒸发器压向接触板的按压部分（342）。 两个定位孔（348）被限定在按压部分中。 弹簧构件通过定位孔与定位销的接合而安装在基座构件上。 弹簧构件的厚度小于每个颈部的长度，并且可以沿颈部移动以适合于蒸发器的尺寸。

公开(公告)号：US07414850B2

公开(公告)日：2008-08-19

申请号：US11309624

申请日：2006-09-01

申请人： Jui-Wen Hung

发明人： Jui-Wen Hung

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation module for removing heat from a heat-generating electronic component includes a base (106) and a clip (40, 40a). The clip includes a connecting arm (42, 42a) and a securing arm (44, 44a) for locking the base to the heat-generating electronic component. The connecting arm engages with the base. The securing arm extends from the contacting arm and is curve-shaped with a free end thereof being for being depressed whereby the securing arm exerts a downward force on the base so that the base and the electronic component can have an intimate contact with each other.

摘要翻译： 用于从发热电子部件除去热量的散热模块包括基座（106）和夹子（40,40a）。 夹具包括连接臂（42,42a）和用于将基座锁定到发热电子部件的固定臂（44,47a）。 连接臂与基座接合。 固定臂从接触臂延伸并且具有弯曲形状，其自由端被压下，由此固定臂在基座上施加向下的力，使得基座和电子部件可以彼此紧密接触。

公开(公告)号：US08885346B2

公开(公告)日：2014-11-11

申请号：US13418366

申请日：2012-03-13

申请人： Shih-Yao Li ,  Jui-Wen Hung ,  Ching-Bai Hwang

发明人： Shih-Yao Li ,  Jui-Wen Hung ,  Ching-Bai Hwang

IPC分类号： H05K7/20

CPC分类号： F28F3/022 ,  F28D2021/0029 ,  F28F7/00 ,  F28F2255/02

摘要： An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

摘要翻译： 示例性电子设备包括印刷电路板，安装在印刷电路板的顶表面上的电子部件和散热装置。 散热装置接触电子部件以吸收由电子部件产生的热量，并通过自然对流和热辐射消散热量。 散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。 热毛发在电子设备的内部具有加热的气流波浪，以散发从基板传递的热量。

公开(公告)号：US08109718B2

公开(公告)日：2012-02-07

申请号：US11840181

申请日：2007-08-16

申请人： Ching-Bai Hwang ,  Jui-Wen Hung

发明人： Ching-Bai Hwang ,  Jui-Wen Hung

IPC分类号： F04D29/58

CPC分类号： F04D25/0613 ,  F04D29/582 ,  F04D29/601 ,  G06F1/203

摘要： A centrifugal blower (10) includes a casing (12) and a rotor (14) rotatable disposed in the casing. The casing includes a base plate (121), a sidewall (122) extending from the base plate and a cover (123) covering the sidewall. The sidewall is a multilayer structure and includes a first section (128a) and a second section (128c). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board (20) and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.

摘要翻译： 离心式鼓风机（10）包括壳体（12）和可旋转地设置在壳体中的转子（14）。 壳体包括基板（121），从基板延伸的侧壁（122）和覆盖侧壁的盖（123）。 侧壁是多层结构，并且包括第一部分（128a）和第二部分（128c）。 转子的中心轴线（A）和第二部分的内表面之间的距离大于转子的中心轴线与第一部分的内表面之间的距离。 第一部分位于母板（20）的下方，当离心鼓风机安装在母板上时，第二部分位于母板的顶面上。

公开(公告)号：US07986521B2

公开(公告)日：2011-07-26

申请号：US12465628

申请日：2009-05-13

申请人： Jui-Wen Hung ,  Ching-Bai Hwang ,  Jie Zhang

发明人： Jui-Wen Hung ,  Ching-Bai Hwang ,  Jie Zhang

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  G06F1/20 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.

摘要翻译： 散热装置包括翅片单元，风扇和风扇导管。 翅片单元包括堆叠在一起的多个翅片。 在每个两个相邻的翅片之间限定气流通道。 风扇包括空气入口和相对的空气出口。 风扇管道连通翅片单元和风扇的气流通道。 风扇管道包括连接到风扇的空气入口的第一烟道和连接到散热片单元的第二烟道。 第二烟道包括分别覆盖在翅片单元的两个相邻侧上的第一侧板和第二侧板。