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公开(公告)号：USD532758S1
公开(公告)日：2006-11-28
申请号：US29197365
申请日：2004-01-14
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公开(公告)号：US07969072B2
公开(公告)日：2011-06-28
申请号：US12568012
申请日：2009-09-28
IPC分类号： H01L41/053
CPC分类号： B29C39/10 , H01L2224/73265 , H03H9/0547 , H03H9/1021
摘要： An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.
摘要翻译： 一种电子设备，包括：具有盖和封装基座的封装，所述封装通过使用接合材料将盖结合到封装基座的接合表面而形成; 以及覆盖所述包装的树脂部分。 树脂部分至少覆盖封装基部和接合材料，并且树脂部分的至少一部分具有截面轮廓。 截面轮廓具有与电子装置的安装表面平行的方向的最外侧部分。 最外面部分位于与电子装置的安装表面垂直的方向上的盖的下表面下方。
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公开(公告)号：US20060022319A1
公开(公告)日：2006-02-02
申请号：US11188766
申请日：2005-07-26
IPC分类号： H01L31/0203
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： An airtight package has an insulating base having an opening approximately in the center and a recessed portion penetrating the insulating base in a thickness direction on a circumferential surface of the insulating base. The airtight package also has a lid sealed against the insulating base so as to block the opening. The lid is bonded to the insulating base in a manner that an edge of the lid overlaps the recessed portion exposed on an opening-side surface of the insulating base.
摘要翻译： 气密包装具有绝缘基部，其绝缘基部具有大致中心的开口，以及在绝缘基底的圆周表面上沿着厚度方向穿透绝缘基底的凹部。 气密包装还具有密封在绝缘基底上的盖子，从而阻挡开口。 盖以绝缘基底的开口侧表面露出的凹部重叠的方式接合到绝缘基底。
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4.发明授权公开(公告)号：US07218036B2
公开(公告)日：2007-05-15
申请号：US10865970
申请日：2004-06-14
IPC分类号： H01L41/08
CPC分类号： H03B5/36 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H03H9/0552 , H03H9/1021 , H03H9/21 , H03H2003/0492 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.
摘要翻译： 本发明提供了一种压电振荡器，其允许在树脂模制之后的频率的精细调整，其制造方法以及使用压电振荡器的移动电话和电子设备。 压电振荡器可以包括其中容纳压电谐振元件的谐振器封装，以及其中结合有电连接到谐振器封装的振荡电路的半导体器件。 谐振器封装和半导体器件可以固定到引线框架的岛部分的对应的不同表面，并且执行树脂模制，使得谐振器封装的透明盖暴露于外部。
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5.发明申请公开(公告)号：US20050012559A1
公开(公告)日：2005-01-20
申请号：US10865970
申请日：2004-06-14
CPC分类号： H03B5/36 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H03H9/0552 , H03H9/1021 , H03H9/21 , H03H2003/0492 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.
摘要翻译： 本发明提供了一种压电振荡器，其允许在树脂模制之后的频率的精细调整，其制造方法以及使用压电振荡器的移动电话和电子设备。 压电振荡器可以包括其中容纳压电谐振元件的谐振器封装，以及其中结合有电连接到谐振器封装的振荡电路的半导体器件。 谐振器封装和半导体器件可以固定到引线框架的岛部分的对应的不同表面，并且执行树脂模制，使得谐振器封装的透明盖暴露于外部。
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