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1.发明授权公开(公告)号：US07218036B2
公开(公告)日：2007-05-15
申请号：US10865970
申请日：2004-06-14
IPC分类号： H01L41/08
CPC分类号： H03B5/36 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H03H9/0552 , H03H9/1021 , H03H9/21 , H03H2003/0492 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.
摘要翻译： 本发明提供了一种压电振荡器，其允许在树脂模制之后的频率的精细调整，其制造方法以及使用压电振荡器的移动电话和电子设备。 压电振荡器可以包括其中容纳压电谐振元件的谐振器封装，以及其中结合有电连接到谐振器封装的振荡电路的半导体器件。 谐振器封装和半导体器件可以固定到引线框架的岛部分的对应的不同表面，并且执行树脂模制，使得谐振器封装的透明盖暴露于外部。
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2.发明申请公开(公告)号：US20050012559A1
公开(公告)日：2005-01-20
申请号：US10865970
申请日：2004-06-14
CPC分类号： H03B5/36 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H03H9/0552 , H03H9/1021 , H03H9/21 , H03H2003/0492 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.
摘要翻译： 本发明提供了一种压电振荡器，其允许在树脂模制之后的频率的精细调整，其制造方法以及使用压电振荡器的移动电话和电子设备。 压电振荡器可以包括其中容纳压电谐振元件的谐振器封装，以及其中结合有电连接到谐振器封装的振荡电路的半导体器件。 谐振器封装和半导体器件可以固定到引线框架的岛部分的对应的不同表面，并且执行树脂模制，使得谐振器封装的透明盖暴露于外部。
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公开(公告)号：USD532758S1
公开(公告)日：2006-11-28
申请号：US29197365
申请日：2004-01-14
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公开(公告)号：US20070228892A1
公开(公告)日：2007-10-04
申请号：US11727151
申请日：2007-03-23
申请人： Yugo Koyama , Kazuhiko Shimodaira
发明人： Yugo Koyama , Kazuhiko Shimodaira
IPC分类号： H01L41/00
CPC分类号： H03H9/0552 , H01L24/73 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H03H3/02 , H03H9/1021 , H01L2924/00
摘要： A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof, an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.
摘要翻译： 一种压电装置，包括：在其上表面具有电极端子部的基板，配置在基板的上侧的电子部件; 以及布置在电子部件的上侧的压电谐振器，其中与具有焊盘部分的表面相对的电子部件的表面接合到具有外部端子部分的压电谐振器的下表面，并且焊盘部分 电子部件和压电谐振器的外部端子部分彼此线接合，并且其中具有焊盘部分的电子部件的表面朝下安装在基板的上表面上。
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公开(公告)号：US07576476B2
公开(公告)日：2009-08-18
申请号：US11727151
申请日：2007-03-23
申请人： Yugo Koyama , Kazuhiko Shimodaira
发明人： Yugo Koyama , Kazuhiko Shimodaira
IPC分类号： H01L41/08
CPC分类号： H03H9/0552 , H01L24/73 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H03H3/02 , H03H9/1021 , H01L2924/00
摘要： A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof; an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.
摘要翻译： 一种压电器件，包括：在其上表面上具有电极端子部分的衬底; 设置在所述基板的上侧的电子部件; 以及布置在电子部件的上侧的压电谐振器，其中与具有焊盘部分的表面相对的电子部件的表面接合到具有外部端子部分的压电谐振器的下表面，并且焊盘部分 电子部件和压电谐振器的外部端子部分彼此线接合，并且其中具有焊盘部分的电子部件的表面朝下安装在基板的上表面上。
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6.发明授权Piezoelectric oscillator, portable telephone unit using piezoelectric oscillator, and electronic equipment using piezoelectric oscillator 有权压电振荡器，使用压电振荡器的便携式电话机，以及使用压电振荡器的电子设备公开(公告)号：US07057331B2
公开(公告)日：2006-06-06
申请号：US10797196
申请日：2004-03-11
IPC分类号： H01L41/08
CPC分类号： H03B5/36 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/49171 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： To provide a piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the piezoelectric oscillator, a resonator package accommodating a piezoelectric resonating element therein, and an IC chip fixed onto a rear surface of the resonator package and having an oscillating circuit therein are provided, and an inner lead portions of a lead frame are fixed onto the rear surface of the resonator package and the resonator package and the IC chip are resin molded except for an outer lead portion of the lead frame.
摘要翻译： 为了提供可以使厚度方向的尺寸更小，安装所需的空间更小的压电振动器，使用压电振荡器的便携式电话和电子装置，容纳压电谐振元件的谐振器封装， 并且设置固定在谐振器封装的后表面上并具有振荡电路的IC芯片，引线框架的内引线部分固定在谐振器封装的后表面上，并且谐振器封装和IC芯片是 除了引线框架的外部引线部分外的树脂模制。
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7.发明授权公开(公告)号：US07408291B2
公开(公告)日：2008-08-05
申请号：US11471710
申请日：2006-06-21
IPC分类号： H01L41/22 , H01L41/053 , H01L41/04 , H03H9/02
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/01077 , H01L2924/01078 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H03H9/0547 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.
摘要翻译： 提供一种通过减小平面尺寸可以减小尺寸的压电振荡器。 关于包括两个引线框架的分层引线框架，并且在上引线框架上形成用于与压电谐振器连接的连接引线，并且连接引线竖立在上方，以形成连接端子，以及用于安装到安装件的安装引线 板形成在下引线框架上，并且安装引线向下竖立以形成安装端子，并且形成振荡电路的IC安装在分层引线框架上，压电谐振器通过将压电谐振元件密封在封装 安装在分层引线框架上，层叠引线框架和压电谐振器被密封在树脂封装内，使得安装端子的主表面向外露出，从而形成完整的物品。
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8.发明申请公开(公告)号：US20060238080A1
公开(公告)日：2006-10-26
申请号：US11471710
申请日：2006-06-21
IPC分类号： H01L41/053
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/01077 , H01L2924/01078 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H03H9/0547 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.
摘要翻译： 提供一种通过减小平面尺寸可以减小尺寸的压电振荡器。 关于包括两个引线框架的分层引线框架，并且在上引线框架上形成用于与压电谐振器连接的连接引线，并且连接引线竖立在上方，以形成连接端子，以及用于安装到安装件的安装引线 板形成在下引线框架上，并且安装引线向下竖立以形成安装端子，并且形成振荡电路的IC安装在分层引线框架上，压电谐振器通过将压电谐振元件密封在封装 安装在分层引线框架上，层叠引线框架和压电谐振器被密封在树脂封装内，使得安装端子的主表面向外露出，从而形成完整的物品。
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公开(公告)号：US07123107B2
公开(公告)日：2006-10-17
申请号：US10729010
申请日：2003-12-08
IPC分类号： H03B1/00
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/01077 , H01L2924/01078 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H03H9/0547 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.
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公开(公告)号：US07545083B2
公开(公告)日：2009-06-09
申请号：US11902037
申请日：2007-09-18
申请人： Seiichi Chiba , Yugo Koyama
发明人： Seiichi Chiba , Yugo Koyama
IPC分类号： H01L41/08
CPC分类号： H03H9/1021 , H03H9/0547 , Y10T29/42
摘要： A piezoelectric device includes a piezoelectric resonator including a piezoelectric resonator element, a package for accommodating the piezoelectric resonator in a cavity thereinside, a lid for airtightly sealing the cavity inside the package, a package base included in the package, and an external terminal formed on a bottom surface of the package base; a circuit element stacked together with the piezoelectric resonator to be electrically connected thereto; a wiring substrate having the circuit element mounted on a first surface thereof and a mounting external terminal provided on a second surface thereof, a connecting member arranged in a periphery of the circuit element mounted on the first surface of the wiring substrate to electrically and mechanically connect the wiring substrate to the external terminal of the piezoelectric resonator; and a molded portion made of a molding member that is formed from the first surface of the wiring substrate up to at least a position higher than an upper end surface of the package base of the piezoelectric resonator, the molded portion covering the first surface of the wiring substrate, the package base of the piezoelectric resonator, the external terminal formed on the bottom surface of the package base, the circuit element, and the connecting member, whereas at least a part of a marking region on the lid being exposed from the molded portion.
摘要翻译： 一种压电装置，包括：压电谐振器，包括压电谐振元件，用于将压电谐振器容纳在其内部的空腔中的封装，用于气密密封封装内的空腔的封盖，包括在封装中的封装基座和形成在封装上的外部端子 封装基底的底表面; 与压电谐振器堆叠在一起的与其电连接的电路元件; 具有安装在其第一表面上的电路元件和设置在其第二表面上的安装外部端子的布线基板，布置在安装在布线基板的第一表面上的电路元件的外围的电连接和机械连接 布线基板到压电谐振器的外部端子; 以及由模制构件制成的模制部分，所述模制部件由所述布线基板的所述第一表面形成到至少高于所述压电谐振器的封装基底的上端表面的位置，所述模制部分覆盖所述压电谐振器的所述第一表面 布线基板，压电谐振器的封装基座，形成在封装基座的底表面上的外部端子，电路元件和连接构件，而盖子上的标记区域的至少一部分从模制的 一部分。
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