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1.发明申请RESIN COMPOSITION FOR TRANSPARENT ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE FORMED USING THE SAME 有权用于透明材料的树脂组合物和使用其形成的电子器件公开(公告)号：US20120270998A1
公开(公告)日：2012-10-25
申请号：US13535673
申请日：2012-06-28
申请人： Sang-Ran KOH , June-Ho SHIN , Hyun-Jung AHN , Sung-Hwan CHA , Young-Eun CHOI , Doo-Young JUNG , Sang-Kyun KIM , Jong-Seob KIM
发明人： Sang-Ran KOH , June-Ho SHIN , Hyun-Jung AHN , Sung-Hwan CHA , Young-Eun CHOI , Doo-Young JUNG , Sang-Kyun KIM , Jong-Seob KIM
IPC分类号： C08L83/06
摘要： A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
摘要翻译： 一种透明包封材料用树脂组合物，该树脂组合物含有通过由下述化学式1表示的第一硅化合物的共聚合得到的聚硅氧烷和包含由下述化学式2表示的化合物的第二硅化合物，
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2.发明申请TRANSPARENT RESIN FOR ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE INCLUDING THE SAME 失效用于封装材料的透明树脂和包括其的电子器件公开(公告)号：US20120271006A1
公开(公告)日：2012-10-25
申请号：US13535956
申请日：2012-06-28
申请人： June-Ho SHIN , Sang-Ran KOH , Sung-Hwan CHA , Hyun-Jung AHN , Young-Eun CHOI
发明人： June-Ho SHIN , Sang-Ran KOH , Sung-Hwan CHA , Hyun-Jung AHN , Young-Eun CHOI
CPC分类号： C08G77/02 , C08G77/58 , Y10T428/31663
摘要： A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
摘要翻译： 一种用于包封材料的透明树脂，包括由至少一种由化学式1A至1D表示的金属化合物获得的聚金属硅氧烷，所述金属化合物与包含由化学式2表示的化合物的硅化合物共聚合：
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