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公开(公告)号：US09294135B2
公开(公告)日：2016-03-22
申请号：US13609638
申请日：2012-09-11
申请人： Ik Soo Eo , Sang-Kyun Kim , Mun Yang Park , Seon-Ho Han , Hyun Kyu Yu
发明人： Ik Soo Eo , Sang-Kyun Kim , Mun Yang Park , Seon-Ho Han , Hyun Kyu Yu
IPC分类号： H04B1/00
CPC分类号： H04B1/0021
摘要： A digital RF receiver does not use a separate receiver according to a mode and a band for multi-mode reception, MIMO reception, and bandwidth extension reception, and changes only setting variables in a single receiver structure so as to implement multi-mode reception, MIMO reception, bandwidth extension reception, and/or simultaneous multi-mode operation, such that complexity of the receiver, development cost, and power consumption can be reduced.
摘要翻译： 数字RF接收机根据用于多模式接收，MIMO接收和带宽扩展接收的模式和频带不使用单独的接收机，并且仅改变单个接收机结构中的设置变量以便实现多模式接收， MIMO接收，带宽扩展接收和/或同时多模式操作，从而可以减少接收机的复杂性，开发成本和功耗。
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2.发明授权Composition for forming silica based insulating layer, method for manufacturing composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layer 有权用于形成二氧化硅基绝缘层的组合物，用于形成二氧化硅基绝缘层的组合物的制造方法，二氧化硅基绝缘层和二氧化硅基绝缘层的制造方法公开(公告)号：US09096726B2
公开(公告)日：2015-08-04
申请号：US13339728
申请日：2011-12-29
申请人： Sang-Hak Lim , Bong-Hwan Kim , Jung-Kang Oh , Taek-Soo Kwak , Jin-Hee Bae , Hui-Chan Yun , Dong-Il Han , Sang-Kyun Kim , Jin-Wook Lee
发明人： Sang-Hak Lim , Bong-Hwan Kim , Jung-Kang Oh , Taek-Soo Kwak , Jin-Hee Bae , Hui-Chan Yun , Dong-Il Han , Sang-Kyun Kim , Jin-Wook Lee
CPC分类号： C08G77/54 , H01L21/02164 , H01L21/02216 , H01L21/02222 , H01L21/02282 , H01L28/40
摘要： A composition for forming silica-based insulation layer includes a hydrogenated polysiloxazane including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, and having a chlorine concentration of about 1 ppm or less:
摘要翻译： 用于形成二氧化硅基绝缘层的组合物包括氢化聚硅氧氮烷，其包含由以下化学式1表示的部分和由以下化学式2表示的部分，并且具有约1ppm或更低的氯浓度：
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3.发明授权Composition for forming a silica layer, method of manufacturing the composition, silica layer prepared using the composition, and method of manufacturing the silica layer 有权用于形成二氧化硅层的组合物，制备组合物的方法，使用该组合物制备的二氧化硅层，以及制备二氧化硅层的方法公开(公告)号：US09082612B2
公开(公告)日：2015-07-14
申请号：US13330856
申请日：2011-12-20
申请人： Hui-Chan Yun , Taek-Soo Kwak , Bong-Hwan Kim , Jin-Hee Bae , Jung-Kang Oh , Sang-Hak Lim , Dong-Il Han , Sang-Kyun Kim , Jin-Wook Lee
发明人： Hui-Chan Yun , Taek-Soo Kwak , Bong-Hwan Kim , Jin-Hee Bae , Jung-Kang Oh , Sang-Hak Lim , Dong-Il Han , Sang-Kyun Kim , Jin-Wook Lee
IPC分类号： H01L21/02 , C09D183/02 , C08L83/16 , B32B9/00 , C09D183/00 , B05D5/12 , B05D5/00 , C09D183/08
CPC分类号： H01L21/02282 , B05D5/00 , B05D5/12 , B32B9/00 , C08G77/54 , C08G77/62 , C08L83/14 , C08L83/16 , C09D183/00 , C09D183/02 , C09D183/08 , C09D183/14 , C09D183/16 , H01L21/02164 , H01L21/02222 , Y10T428/24355
摘要： A composition for forming a silica layer, a method of manufacturing the composition, a silica layer prepared using the composition, and a method of manufacturing the silica layer, the composition including hydrogenated polysilazane, hydrogenated polysiloxazane, or a combination thereof, wherein a concentration of a sum of hydrogenated polysilazane and hydrogenated polysiloxazane having a weight average molecular weight, reduced to polystyrene, of greater than or equal to about 50,000 is about 0.1 wt % or less, based on a total amount of the hydrogenated polysilazane and hydrogenated polysiloxazane.
摘要翻译： 用于形成二氧化硅层的组合物，该组合物的制造方法，使用该组合物制备的二氧化硅层，以及二氧化硅层的制造方法，包含氢化聚硅氮烷，氢化聚硅氧氮烷或其组合的组合物，其中， 基于氢化聚硅氮烷和氢化聚硅氧氮烷的总量，氢化聚硅氮烷和氢化聚硅氧氮烷的总重量平均分子量（减少为聚苯乙烯）大于或等于约50,000的总量为约0.1重量％以下。
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4.发明授权Resist underlayer composition and process of producing integrated circuit devices using the same 有权抗蚀底层组合物和使用其制造集成电路器件的工艺公开(公告)号：US08962747B2
公开(公告)日：2015-02-24
申请号：US13539971
申请日：2012-07-02
申请人： Mi-Young Kim , Woo-Jin Lee , Kwen-Woo Han , Han-Song Lee , Sang-Kyun Kim , Jong-Seob Kim
发明人： Mi-Young Kim , Woo-Jin Lee , Kwen-Woo Han , Han-Song Lee , Sang-Kyun Kim , Jong-Seob Kim
IPC分类号： C08L83/00 , H01L21/033 , G03F7/075 , G03F7/09 , H01L21/02
CPC分类号： H01L21/0332 , C08G77/80 , C09D183/04 , G03F7/0752 , G03F7/091 , H01L21/02126 , H01L21/02216 , H01L21/02282
摘要： A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3, [R1O]3Si—X [Chemical Formula 1] [R2O]3Si—R3 [Chemical Formula 2] [R4O]3Si—Si[OR5]3. [Chemical Formula 3]
摘要翻译： 抗蚀剂底层组合物包括溶剂和由以下化学式1表示的化合物，由以下化学式2表示的化合物和由以下化学式3表示的化合物的有机硅烷缩聚产物[R1O] 3Si-X [化学式1] [R2O] 3Si-R3 [化学式2] [R4O] 3Si-Si [OR5] 3。 [化学式3]
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5.发明授权Resist underlayer composition and process of producing integrated circuit devices using same 有权抗蚀底层组成和使用其制造集成电路器件的工艺公开(公告)号：US08841218B2
公开(公告)日：2014-09-23
申请号：US13571751
申请日：2012-08-10
申请人： Kwen-Woo Han , Mi-Young Kim , Woo-Jin Lee , Han-Song Lee , Seung-Hee Hong , Sang-Kyun Kim , Jin-Wook Lee
发明人： Kwen-Woo Han , Mi-Young Kim , Woo-Jin Lee , Han-Song Lee , Seung-Hee Hong , Sang-Kyun Kim , Jin-Wook Lee
IPC分类号： H01L21/311 , C08L83/06
CPC分类号： C08L83/06 , G03F7/0752 , G03F7/091 , G03F7/094
摘要： A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3.
摘要翻译： 包含溶剂的抗蚀剂底层组合物和由化学式1表示的化合物，由化学式2表示的化合物和由化学式3表示的化合物制备的水解产物的有机硅烷缩聚产物。
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6.发明授权公开(公告)号：US08758981B2
公开(公告)日：2014-06-24
申请号：US13540111
申请日：2012-07-02
申请人： Mi-Young Kim , Sang-Kyun Kim , Hyeon-Mo Cho , Chang-Soo Woo , Sang-Ran Koh , Hui-Chan Yun , Woo-Jin Lee , Jong-Seob Kim
发明人： Mi-Young Kim , Sang-Kyun Kim , Hyeon-Mo Cho , Chang-Soo Woo , Sang-Ran Koh , Hui-Chan Yun , Woo-Jin Lee , Jong-Seob Kim
CPC分类号： G03F7/0752 , G03F7/09 , G03F7/11
摘要： A photoresist underlayer composition includes a solvent, and a polysiloxane resin represented by Chemical Formula 1: {(SiO1.5—Y—SiO1.5)x(SiO2)y(XSiO1.5)z}(OH)e(OR1)f. [Chemical Formula 1]
摘要翻译： 光致抗蚀剂底层组合物包括溶剂和由化学式1表示的聚硅氧烷树脂：{（SiO 1.5-Y-SiO 1.5）x（SiO 2）y（XSiO 1.5）z}（OH）e（OR 1）f 。 [化学式1]
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7.发明授权Positive photosensitive resin composition, and display device and organic light emitting device using the same 有权正性感光性树脂组合物，显示装置及使用其的有机发光装置公开(公告)号：US08735029B2
公开(公告)日：2014-05-27
申请号：US13603491
申请日：2012-09-05
申请人： Eun-Kyung Yoon , Eun-Ha Hwang , Jong-Hwa Lee , Ji-Yun Kwon , Dae-Yun Kim , Sang-Kyeon Kim , Sang-Kyun Kim , Sang-Soo Kim , Kun-Bae Noh , Jun-Ho Lee , Jin-Young Lee , Hyun-Yong Cho , Chung-Beom Hong
发明人： Eun-Kyung Yoon , Eun-Ha Hwang , Jong-Hwa Lee , Ji-Yun Kwon , Dae-Yun Kim , Sang-Kyeon Kim , Sang-Kyun Kim , Sang-Soo Kim , Kun-Bae Noh , Jun-Ho Lee , Jin-Young Lee , Hyun-Yong Cho , Chung-Beom Hong
CPC分类号： G03F7/0226 , G03F7/0233 , G03F7/0236 , G03F7/0755 , G03F7/085 , Y10S430/107
摘要： Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.
摘要翻译： 公开了包含（A）包含聚苯并恶唑前体，聚酰亚胺前体或其组合的碱溶性树脂的正性感光性树脂组合物，（B）感光性重氮醌化合物，（C）由以下化学式1表示的化合物， 和（D）溶剂，以及显示装置和使用其的有机发光装置。 化学式1与详细描述中所定义的相同。
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8.发明申请Positive Photosensitive Resin Composition, and Display Device and Organic Light Emitting Device Using the Same 有权正型感光树脂组合物，以及使用其的显示装置和有机发光装置公开(公告)号：US20130171564A1
公开(公告)日：2013-07-04
申请号：US13603491
申请日：2012-09-05
申请人： Eun-Kyung YOON , Eun-Ha HWANG , Jong-Hwa LEE , Ji-Yun KWON , Dae-Yun KIM , Sang-Kyeon KIM , Sang-Kyun KIM , Sang-Soo KIM , Kun-Bae NOH , Jun-Ho LEE , Jin-Young LEE , Hyun-Yong CHO , Chung-Beom HONG
发明人： Eun-Kyung YOON , Eun-Ha HWANG , Jong-Hwa LEE , Ji-Yun KWON , Dae-Yun KIM , Sang-Kyeon KIM , Sang-Kyun KIM , Sang-Soo KIM , Kun-Bae NOH , Jun-Ho LEE , Jin-Young LEE , Hyun-Yong CHO , Chung-Beom HONG
CPC分类号： G03F7/0226 , G03F7/0233 , G03F7/0236 , G03F7/0755 , G03F7/085 , Y10S430/107
摘要： Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.
摘要翻译： 公开了包含（A）包含聚苯并恶唑前体，聚酰亚胺前体或其组合的碱溶性树脂的正性感光性树脂组合物，（B）感光性重氮醌化合物，（C）由以下化学式1表示的化合物， 和（D）溶剂，以及显示装置和使用其的有机发光装置。 化学式1与详细描述中所定义的相同。
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9.发明授权Resin composition for transparent encapsulation material and electronic device formed using the same 有权用于透明封装材料的树脂组合物和使用其形成的电子器件公开(公告)号：US08455605B2
公开(公告)日：2013-06-04
申请号：US13535673
申请日：2012-06-28
申请人： Sang-Ran Koh , June-Ho Shin , Hyun-Jung Ahn , Sung-Hwan Cha , Young-Eun Choi , Doo-Young Jung , Sang-Kyun Kim , Jong-Seob Kim
发明人： Sang-Ran Koh , June-Ho Shin , Hyun-Jung Ahn , Sung-Hwan Cha , Young-Eun Choi , Doo-Young Jung , Sang-Kyun Kim , Jong-Seob Kim
IPC分类号： C08G77/60
摘要： A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
摘要翻译： 一种透明包封材料用树脂组合物，该树脂组合物含有通过由下述化学式1表示的第一硅化合物的共聚合得到的聚硅氧烷和包含由下述化学式2表示的化合物的第二硅化合物，
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10.发明申请RESIST UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES USING THE SAME 审中-公开耐蚀组合物及使用其制造半导体集成电路器件的方法公开(公告)号：US20120270143A1
公开(公告)日：2012-10-25
申请号：US13539894
申请日：2012-07-02
申请人： Hui-Chan YUN , Sang-Kyun KIM , Hyeon-Mo CHO , Mi-Young KIM , Sang-Ran KOH , Yong-Jin CHUNG , Jong-Seob KIM
发明人： Hui-Chan YUN , Sang-Kyun KIM , Hyeon-Mo CHO , Mi-Young KIM , Sang-Ran KOH , Yong-Jin CHUNG , Jong-Seob KIM
IPC分类号： C08L83/04 , G03F7/20 , B32B3/30 , C08K5/3432
CPC分类号： G03F7/0752 , G03F7/094 , G03F7/11
摘要： A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product including about 10 to about 40 mol % of a structural unit represented by Chemical Formula 1:
摘要翻译： 包括溶剂的抗蚀剂底层组合物和包含由化学式1表示的结构单元的约10至约40mol％的有机硅烷缩聚产物：
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