Top-emitting nitride-based light emitting device and method of manufacturing the same
    1.
    发明申请
    Top-emitting nitride-based light emitting device and method of manufacturing the same 有权
    顶部发射氮化物基发光器件及其制造方法

    公开(公告)号:US20050133809A1

    公开(公告)日:2005-06-23

    申请号:US11011154

    申请日:2004-12-15

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。

    Top-emitting nitride-based light emitting device and method of manufacturing the same
    2.
    发明授权
    Top-emitting nitride-based light emitting device and method of manufacturing the same 有权
    顶部发射氮化物基发光器件及其制造方法

    公开(公告)号:US07417264B2

    公开(公告)日:2008-08-26

    申请号:US11011154

    申请日:2004-12-15

    IPC分类号: H01L33/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。

    Top-emitting nitride-based light emitting device and method of manufacturing the same
    3.
    发明授权
    Top-emitting nitride-based light emitting device and method of manufacturing the same 有权
    顶部发射氮化物基发光器件及其制造方法

    公开(公告)号:US07666693B2

    公开(公告)日:2010-02-23

    申请号:US12180312

    申请日:2008-07-25

    IPC分类号: H01L21/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。

    TOP-EMITTING NITRIDE-BASED LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    TOP-EMITTING NITRIDE-BASED LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    基于氮化物的发光装置及其制造方法

    公开(公告)号:US20080299687A1

    公开(公告)日:2008-12-04

    申请号:US12180312

    申请日:2008-07-25

    IPC分类号: H01L33/00

    CPC分类号: H01L33/42 H01L33/32

    摘要: Provided are a top-emitting N-based light emitting device and a method of manufacturing the same. The device includes a substrate, an n-type clad layer, an active layer, a p-type clad layer, and a multi ohmic contact layer, which are sequentially stacked. The multi ohmic contact layer includes one or more stacked structures, each including a modified metal layer and a transparent conductive thin film layer, which are repetitively stacked on the p-type clad layer. The modified metal layer is formed of an Ag-based material.

    摘要翻译: 提供了一种顶发射N型发光器件及其制造方法。 该器件包括依次层叠的衬底,n型覆盖层,有源层,p型覆盖层和多欧姆接触层。 多欧姆接触层包括一个或多个堆叠结构,每个层叠结构包括重复堆叠在p型覆盖层上的改性金属层和透明导电薄膜层。 改性金属层由Ag基材料形成。